tag: Mentor

Siemens EDA’s Full-Flow Portfolio Helps Engineers Achieve Optimum IC Design Verification Efficiency
By Siemens EDA - 24 Mar, 2022 - Comments: 0

A quick overview of the front-end flow using the S-Edit schematic capture environment will be covered in this white paper, followed by a more detailed description and steps for using the Analog FastSPICE (AFS) platform simulator to go through the verification of a basic amplifier design. Greater efficiency in analog design verification can now be achieved using our enhanced inter-tool commun... » read more

Blog Review: March 23
By Jesse Allen - 23 Mar, 2022 - Comments: 0

Arm's Ilias Vougioukas presents new ways to improve on virtual to physical memory translation without breaking any of the pre-existing hardware or software. Siemens' Scot Morrison considers the current regulatory landscape for security of medical devices, including how device manufactures need to proactively implement a plan to find, assess, and respond to potential vulnerabilities. Synop... » read more

CXL and OMI: Competing or Complementary?
By Bryon Moyer - 23 Mar, 2022 - Comments: 1

System designers are looking at any ideas they can find to increase memory bandwidth and capacity, focusing on everything from improvements in memory to new types of memory. But higher-level architectural changes can help to fulfill both needs, even as memory types are abstracted away from CPUs. Two new protocols are helping to make this possible, CXL and OMI. But there is a looming question... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 18 Mar, 2022 - Comments: 0

Chipmakers, OEMs Intel continues to build more fabs. First, the company announced fabs in Arizona and then Ohio. Now, Intel plans to invest up to €80 billion in the European Union over the next decade. As part of the effort, Intel plans to build two semiconductor fabs in Magdeburg, Germany. Construction is expected to begin in the first half of 2023 and production planned to come online in 2... » read more

Week In Review: Design, Low Power
By Jesse Allen - 18 Mar, 2022 - Comments: 0

Alphawave IP will acquire the OpenFive business unit from SiFive. The $210 million cash deal will bring OpenFive’s high-speed connectivity SoC IP portfolio to Alphawave and nearly double its IPs currently available, including an expanded die-to-die connectivity portfolio as well as adding data center and networking custom silicon solutions. "When we completed our IPO in 2021, we committed to ... » read more

What Else Can You Do While Driving A Car?
By Ann Mutschler - 16 Mar, 2022 - Comments: 0

Increasing levels of autonomy in vehicles are driving increased demands for new technology. Consumers care about the electronics in their vehicles, for both safety and convenience, and those features are impacting both purchase decisions and new vehicle designs. As vehicles grow in sophistication with advanced driver assistance, electrification, or alternative fuel sources, personalized vehi... » read more

Blog Review: March 16
By Jesse Allen - 16 Mar, 2022 - Comments: 0

Ansys' Peter Hallschmid and Sandra Gely look at why, compared to rain and fog, snow is a different challenging environment for automotive sensors and how the random pattern of snowfall, properties of each flake, and the various distance between flakes play havoc on detecting objects. Siemens' Chuck Battikha focuses on how to protect against random hardware faults, the added costs of includin... » read more

Survey: 2022 Deep Learning Applications
By eBeam Initiative - 16 Mar, 2022 - Comments: 0

The 2022 member list of deep learning projects and products that eBeam members are working on in photomask to wafer semiconductor manufacturing. Participating companies include Advantest, ASML, Canon, CEA-LETI, D2S, Fraunhofer IPMS, Hitachi High-Tech Corporation, imec, NuFlare Technology, Siemens Industries Software, Inc.; Siemens EDA, STMicroelectronics, and TASMIT. Click here to see the su... » read more

Fundamental Shifts In IC Manufacturing Processes
By Ed Sperling - 14 Mar, 2022 - Comments: 2

High chip value and 3D packaging are changing where and how tests are performed, tightening design-for-reliability and accelerating the shift of tools from lab to fab. Heterogeneous integration and more domain-specific designs are causing a string of disruptions for chip manufacturers, up-ending proven fab processes and methodologies, extending the time it takes to manufacture a chip, and ul... » read more

Shifting The Design Paradigm To Improve Verification Efficiency
By Harry Foster - 10 Mar, 2022 - Comments: 0

We are in the midst of a verification crisis manifested by a growing gap between verification efficiency and effectiveness. This crisis cannot be solved through improvements in verification methodologies and techniques alone. Indeed, it requires a philosophical change in the way we approach design, with an emphasis on bug prevention. We refer to this fundamental change as design using intent-fo... » read more

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