tag: packaging

Power Semiconductor Devices: Thermal Management and Packaging
By Technical Paper Link - 10 Apr, 2023 - Comments: 0

A technical paper titled "Thermal management and packaging of wide and ultra-wide bandgap power devices: a review and perspective" was published by researchers at Virginia Polytechnic Institute and State University, U.S. Naval Research Laboratory, and Univ Lyon, CNRS. "This paper provides a timely review of the thermal management of WBG and UWBG power devices with an emphasis on packaged dev... » read more

Panel Tackles Chiplet Packaging Challenges
By QP Technologies Staff - 16 Mar, 2023 - Comments: 1

QP Technologies recently exhibited at the first Chiplet Summit, held January 24-26 in San Jose, California. Dick Otte, CEO of our parent company Promex Industries, participated on a panel titled “Best Packaging for Chiplets Today.” Moderated by Nobuki Islam with JCET Group, the packaging panel also included Daniel Lambalot, Alphawave Semi; Laura Mirkarimi, Adeia; Syrus Ziai, Eliyan; and Mik... » read more

IEDM: Backside Power Delivery
By Paul McLellan - 09 Mar, 2023 - Comments: 0

One part of the short course that I attended at IEDM in December was about backside power delivery networks. It was presented by Gaspard Hiblot of imec and titled "Process Architectures Changes to Improve Power Delivery." The presentation is co-credited with Geert Hellings and Julien Ryckaert. I should preface this post with the fact that this presentation was 80 slides long and so I will only... » read more

Addressing Total Overlay Drift In Advanced IC Substrate (AICS) Packaging
By Keith Best - 07 Mar, 2023 - Comments: 0

For years, many in the semiconductor industry have focused on the march toward advanced nodes. As these nodes have decreased in size, the size of input/output (I/O) bumps on the chip has grown smaller. As these bumps shrink, their ability to mate directly to printed circuit boards (PCB) diminishes, which, in turn, leads to the need for an intermediary substrate. Enter the advanced IC substrate ... » read more

Effect Of RF Plasma Process Gas Chemistry And Electrode Configuration On The Removal Of Copper Lead Frame Oxidation
By Daniel Chir - 07 Feb, 2023 - Comments: 0

By Daniel Chir and Johnson Toh Lead frame surface oxidation can lead to surface delamination after molding or wire bonding issues. The application of plasma treatment has been proven to be safe and effective solution to address these issues. However, the effectiveness of plasma treatment for removing oxide is dependent on the correct use of recipe parameters, gas chemistry and electrode conf... » read more

An OSAT Perspective On Semiconductor Market Trends
By Vik Chaudhry - 19 Jan, 2023 - Comments: 0

For the semiconductor industry, 2022 was a very interesting year. On one hand, it witnessed shortages in the supply chain. On the other hand, the macro-economic situation turned and demand for several consumer and computing devices plummeted. A trade war with China and ensuing localization of supply chain with passage of CHIPS act took shape in 2022. The auto industry is still recovering from t... » read more

3D Sensing Package Solutions
By Chiung Lee - 15 Dec, 2022 - Comments: 0

By Chiung Lee, Weilung Lu, and Adrian Arcedera 3D sensing technology is rapidly being adopted in a variety of growing markets. End-product applications include smartphones, tablets, augmented/virtual reality products, robot vacuum cleaners, industry inspection machines, and automotive vehicles. As shown in figure 1, Yole Développement expects the 3D imaging and sensing market to expand from... » read more

Mastering FOWLP And 2.5D Design Is Easier Than You Think
By Bill Acito - 22 Nov, 2022 - Comments: 0

IC packaging has come into its own, where once traditional packaging was a “necessary evil,” today’s packaging can add significant value. There is an increase in functional density and flexibility by providing a platform for heterogeneous design assembly. Where designs implemented in an SoC can become too large to yield satisfactorily and too difficult to implement on one process node, pa... » read more

Heterogeneous Chip Assembly Helps Optimize Medical And Wearable Devices
By Dick Otte - 17 Nov, 2022 - Comments: 0

Heterogeneous integration (HI) has significant implications for the medical, health, and wearables industry. At Promex, we utilize a variety of complex assembly processes to achieve HI for medical and biotech applications. This post will take a closer look at the processes associated with assembling these classes of devices. Figure 1 provides a high-level overview of our approach. Nearly eve... » read more

Research Bits: Nov. 15
By Jesse Allen - 15 Nov, 2022 - Comments: 0

Low temperature 3D bonding Scientists from Osaka University developed a new method for the direct three-dimensional bonding of copper electrodes using silver layers. The method works at low temperatures and does not require external pressure. "Our process can be performed under gentle conditions, at relatively low temperatures and without added pressure, but the bonds were able to withstand... » read more

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