Ferroelectric Memories: The Middle Ground

By Katherine Derbyshire - 19 Jan, 2023 - Comments: 0

The first article in this series considered the use of ferroelectrics to improve subthreshold swing behavior in logic transistors. The prospects for ferroelectrics in logic applications are uncertain, but ferroelectric memories have clear advantages. The two most common commercial memories lie at opposite ends of a spectrum. DRAM is fast, but requires constant power to maintain its informat... » read more

Ferroelectrics: The Dream Of Negative Capacitance

By Katherine Derbyshire - 15 Dec, 2022 - Comments: 0

Ferroelectrics are getting a serious re-examination, as chipmakers look for new options to maintain drive current. Ferroelectric materials can provide non-volatile memory, serving an important functional gap somewhere between DRAM and flash memory. Indeed, ferroelectrics for memory and 2D channels for transistors were two highlights of the recent IEEE Electron Device Meeting. Ferroelectri... » read more

Week In Review: Design, Low Power

By Marie C. Baca - 30 Sep, 2022 - Comments: 0

Tools and IP Renesas introduced a new microprocessor that enables artificial intelligence to process image data from multiple cameras. "One of the challenges for embedded systems developers who want to implement machine learning is to keep up with the latest AI models that are constantly evolving,” said Shigeki Kato, Vice President of Renesas' Enterprise Infrastructure Business Division. �... » read more

Technical Paper Round-up: August 8

By Linda Christensen - 08 Aug, 2022 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=44 /] Semiconductor Engineering is in the process of building this library of research papers. Please send suggestions (via comments section below) for what else you’d like us to incorporate. If you have research papers you are trying to promote, we will review them to see if they are a good fit for... » read more

Reporting and Benchmarking Process For A 2D Semiconductor FET

By Technical Paper Link - 29 Jul, 2022 - Comments: 0

New research paper titled "How to Report and Benchmark Emerging Field-Effect Transistors" was published from researchers at NIST, Purdue University, UCLA, Theiss Research, Peking University, NYU, Imec, RWTH Aachen, and others. "Emerging low-dimensional nanomaterials have been studied for decades in device applications as field-effect transistors (FETs). However, properly reporting and compar... » read more

Two Chip-Scale Photonic Systems For Optical Data Transmission & Microwave Photonics

By Technical Paper Link - 21 May, 2022 - Comments: 0

New research paper "Microcomb-driven silicon photonic systems" from Peking University, UCSB, and Peng Cheng Laboratory. Abstract "Microcombs have sparked a surge of applications over the past decade, ranging from optical communications to metrology. Despite their diverse deployment, most microcomb-based systems rely on a large amount of bulky elements and equipment to fulfil their desir... » read more

Technical Paper Round-Up: April 19

By Linda Christensen - 19 Apr, 2022 - Comments: 0

New technical papers include selective etching, ISO 26262 test bench, hardware accelerators, RISC-V, lidar, EUV mask inspection, fault attacks, edge computing, gallium oxide, and machine learning for VLSI CAD-on-chip power grid design. Cutting-edge research is now a global effort. It extends from the U.S. Air Force, to schools such as MIT, and universities in Italy, Spain, Portugal, India, K... » read more

Embedded Microprocessor Extension Design and Optimization for Real-Time Edge Computing

By Technical Paper Link - 18 Apr, 2022 - Comments: 0

Abstract "With the development of 5G communication technology, more and more applications could be integrated into one system. Edge computing system and mixed-criticality system may integrate tasks of different criticality levels, which brings better balance in isolation and performance. Such advantages make it gradually become a research hotspot in edge computing and real-time systems with ... » read more

Silicon Thermo-Optic Switches with Graphene Heaters Operating at Mid-Infrared Waveband

By Technical Paper Link - 30 Mar, 2022 - Comments: 0

Abstract "The mid-infrared (MIR, 2–20 μm) waveband is of great interest for integrated photonics in many applications such as on-chip spectroscopic chemical sensing, and optical communication. Thermo-optic switches are essential to large-scale integrated photonic circuits at MIR wavebands. However, current technologies require a thick cladding layer, high driving voltages or may introduce h... » read more

Improving Machine Learning-Based Modeling of Semiconductor Devices by Data Self-Augmentation

By Technical Paper Link - 24 Mar, 2022 - Comments: 0

Abstract: "In the electronics industry, introducing Machine Learning (ML)-based techniques can enhance Technology Computer-Aided Design (TCAD) methods. However, the performance of ML models is highly dependent on their training datasets. Particularly in the semiconductor industry, given the fact that the fabrication process of semiconductor devices is complicated and expensive, it is of grea... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?