tag: process

Negative-Tone Photosensitive Polymeric Bonding Material To Enable Room Temperature Prebond For Cu/Polymer Hybrid Bonding
By Brewer Science - 18 Oct, 2023 - Comments: 0

An evaluation of a negative-tone i-line photosensitive polymeric bonding material for achieving prebonding in Cu/polymer hybrid bonding at low temperatures via the Cu damascene process. The polymeric material has a Tg≤100∘C ; Young’s modulus of 99 MPa, the dielectric constant of 2.6, and dissipation factor of 0.0016 at 10 GHz. Shear tests revealed a bond shear strength of over 10 MPa when... » read more

Adding Circuit Aging To Variability
By Brian Bailey - 12 Aug, 2021 - Comments: 0

Moving to a smaller node usually means another factor becomes important. The industry has become accustomed to doing process, temperature, voltage (PVT) corner analysis, but now it has to add aging into that mix. The problem is that planning for circuit aging is no longer a purely statistical process. Aging is dependent on activity over the lifetime of the device. Tools need to be modified a... » read more

Using Virtual Process Libraries To Improve Semiconductor Manufacturing
By Jeonghoon (James) Kim - 17 Jun, 2021 - Comments: 0

People think that semiconductor process simulation libraries should be developed using a perfect theoretical background that is strongly supported by empirical data. This might be true in academic research, where researchers are trying to develop a systematic approach to understanding a process mechanism. However, it is definitely not true in production fabs, where engineers need to quickly a... » read more

Winning The Global Race For Semiconductor Technology With Virtual Fabrication
By David Fried - 22 Oct, 2020 - Comments: 0

Semiconductor process development is no easy task, with each generation of devices more difficult and expensive to create. Traditional cycles of build-and-test development are becoming obsolete, since they are too expensive and time-consuming for the most advanced processes. The high cost of process development Most chip designers developing new products rely on existing manufacturing process... » read more

Building Predictive And Accurate 3D Process Models
By Pradeep Nanja - 21 Sep, 2020 - Comments: 0

Process engineers and integrators can use virtual process modeling to test alternative process schemes and architectures without relying on wafer-based testing. One important aspect of building an accurate process model is to ensure that the model is calibrated. Having a calibrated model is important, since it provides assurance to the process integrators and engineers that the model will refle... » read more

OIP Ecosystem Forum 2020
By Paul McLellan - 10 Sep, 2020 - Comments: 0

Last Tuesday was the virtual TSMC OIP Ecosystem Forum. Apart from being virtual, the format was similar to the usual. Cliff Hou, Senior Vice President of Technology Development, opened the day with a summary of where everything is in the ecosystem around each of the new processes. There were then three keynotes by the leaders of the three big EDA companies. That was followed by more technical ... » read more

An Introduction To Semiconductor Process Modeling
By Jeonghoon (James) Kim - 20 Dec, 2019 - Comments: 0

Semiconductor process engineers would love to develop successful process recipes without the guesswork of repeated wafer testing. Unfortunately, developing a successful process can’t be done without some work. This blog will discuss an efficient technique to develop new process steps faster, with much less effort. Basic concept The easiest way to predict a process result is to model its b... » read more

Multi-Physics At 5/3nm
By Ed Sperling - 11 Apr, 2019 - Comments: 0

Joao Geada, chief technologist at ANSYS, talks about why timing, process, voltage, and temperature no longer can be considered independently of each other at the most advanced nodes, and why it becomes more critical as designs shrink from 7nm to 5nm and eventually to 3nm. In addition, more chips are being customized, and more of those chips are part of broader systems that may involve an AI com... » read more

Power Issues Grow For Cloud Chips
By Ann Mutschler - 11 Oct, 2018 - Comments: 0

Performance levels in traditional or hyperscale data centers are being limited by power and heat caused by an increasing number of processors, memory, disk and operating systems within servers. The problem is so complex and intertwined, though, that solving it requires a series of steps that hopefully add up to a significant reduction across a system. But at 7nm and below, predicting exactly... » read more

The Value of Runtime Knowledge Management
By Applied Materials - 20 Sep, 2018 - Comments: 0

In clinical and commercial manufacturing when measures are taken to prevent deviations, the findings aren’t often shared across the enterprise and when corrective actions are taken to resolve an issue, they often don’t address the actual root cause(s). The Applied SmartFactory® Rx™ Knowledge Management solution allows knowledge captured in the R&D and design phases to be used th... » read more

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