tag: Purdue University

Week In Review: Manufacturing, Test
By Karen Heyman - 26 Aug, 2022 - Comments: 0

Regional Shifts Supply chains are moving away from China. Apple, Honda, and Mazda are in line to diversify their manufacturing across different regions, according to one report. Another report says Apple plans to manufacture some of its new iPhone 14s in India. Mexico wants to be part of U.S.’s drive to move chip manufacturing closer to home, hosting American financiers to discuss elect... » read more

Technical Paper Round-up: August 8
By Linda Christensen - 08 Aug, 2022 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=44 /] Semiconductor Engineering is in the process of building this library of research papers. Please send suggestions (via comments section below) for what else you’d like us to incorporate. If you have research papers you are trying to promote, we will review them to see if they are a good fit for... » read more

Reporting and Benchmarking Process For A 2D Semiconductor FET
By Technical Paper Link - 29 Jul, 2022 - Comments: 0

New research paper titled "How to Report and Benchmark Emerging Field-Effect Transistors" was published from researchers at NIST, Purdue University, UCLA, Theiss Research, Peking University, NYU, Imec, RWTH Aachen, and others. "Emerging low-dimensional nanomaterials have been studied for decades in device applications as field-effect transistors (FETs). However, properly reporting and compar... » read more

Technical Paper Round-up: July 11
By Linda Christensen - 11 Jul, 2022 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=38 /]   Semiconductor Engineering is in the process of building this library of research papers. Please send suggestions (via comments section below) for what else you’d like us to incorporate. If you have research papers you are trying to promote, we will review them to see if they are a ... » read more

Brain-Inspired Computing Device That Programs/RePrograms HW On Demand With Electrical Pulses
By Technical Paper Link - 06 Jul, 2022 - Comments: 0

Multiple academic and government institutions jointly developed a new computer device that can "program and program computer hardware on demand through electrical pulses," according to this Argonne National Lab news release. The device's key materials are neodymium, nickel and oxygen and is referred to as a perovskite nickelate. This new research paper titled "Reconfigurable perovskite nicke... » read more

Week In Review, Manufacturing, Test
By Karen Heyman - 01 Jul, 2022 - Comments: 0

Samsung announced initial production of its 3nm process node, which uses a gate-all-around (nanosheet) transistor structure that the company calls Multi-Bridge-Channel FET (MBCFET). The first-generation 3nm process can reduce power consumption by up to 45% compared with a 5nm process, as well as improve performance by 23% and reduce area by 16%, according to the company. The second-generation 3... » read more

Research Bits: June 21
By Jesse Allen - 21 Jun, 2022 - Comments: 0

Side-channel protection for edge AI Researchers from the Massachusetts Institute of Technology built a chip that can defend against power side-channel attacks targeting machine learning computations in smartwatches, smartphones, and tablets. Side-channel attacks involve observing a facet of the device's operation, in this case power, to deduce secrets. “The goal of this project is to buil... » read more

Technical Paper Round-Up: June 8
By Linda Christensen - 08 Jun, 2022 - Comments: 0

  New technical papers added to Semiconductor Engineering’s library this week. [table id=32 /] Semiconductor Engineering is in the process of building this library of research papers. Please send suggestions (via comments section below) for what else you’d like us to incorporate. If you have research papers you are trying to promote, we will review them to see if they are a ... » read more

Novel Spintronic Neuro-mimetic Device Emulating the LIF Neuron Dynamics w/High Energy Efficiency & Compact Footprints
By Technical Paper Link - 03 Jun, 2022 - Comments: 0

New technical paper titled "Noise resilient leaky integrate-and-fire neurons based on multi-domain spintronic devices" from researchers at Purdue University. Abstract "The capability of emulating neural functionalities efficiently in hardware is crucial for building neuromorphic computing systems. While various types of neuro-mimetic devices have been investigated, it remains challenging to... » read more

Week in Review: Manufacturing, Test
By Linda Christensen - 03 Jun, 2022 - Comments: 0

Hybrid Bonding & Supercomputers At this week’s ECTC conference, CEA-Leti and Intel presented an “optimized hybrid direct-bonding, self-assembly process," which they claim has the potential to increase alignment accuracy and speed up fab throughput by several thousand dies per hour. The approach uses capillary forces of a water droplet to align dies on a target wafer. “Commercial s... » read more

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