Collaborative IC Design Mandates Integrated Data Management


Due to complexity and multi-domain expertise, custom IC design typically requires a team to successfully design and verify the project. Often, specific blocks are assigned to team members based on analog, digital, MEMS, RF expertise, across multiple geographies, and separate verification team members focus on block and system validation. This means that unstructured design files with multiple c... » read more

Foundries Prepare For Battle At 22nm


After introducing new 22nm processes over the last year or two, foundries are gearing up the technology for production—and preparing for a showdown. GlobalFoundries, Intel, TSMC and UMC are developing and/or expanding their efforts at 22nm amid signs this node could generate substantial business for applications like automotive, IoT and wireless. But foundry customers face some tough choic... » read more

Finding New Dimensions Of Innovation


Whenever a company announces a major strategy shift and restructuring, such as pivoting away from 7nm FinFET technology development, it’s understandable that confusion, uncertainty and misunderstandings may arise. The best way to allay these concerns is to take an objective look at the situation: Demand for chips for the automotive, IoT, mobility and data center/wireless infrastructure mar... » read more

New Metrology and Inspection Technologies Needed for More-Than-Moore Markets


The escalating costs of following Moore’s Law have shifted the semiconductor industry’s focus to More-than-Moore (MtM) technologies, where analog/mixed-signal, RF, MEMS, image sensing, power or other technologies may be integrated with CMOS in a variety of planar, 2.5D and 3D architectures. The integration of these and other key technologies is enabling a host of fast-growing application... » read more

Panel Fan-out Ramps, Challenges Remain


After years of R&D, panel-level fan-out packaging is finally beginning to ramp up in the market, at least in limited volumes for a few vendors. However, panel-level fan-out, which is an advanced form of today’s fan-out packaging, still faces several technical and cost challenges to bring this technology into the mainstream or high-volume manufacturing. Moreover, several companies are d... » read more

Connected Cars: From Chip To City


As the automotive industry moves closer to autonomous vehicles, ecosystem players are focusing on the infrastructure pieces needed to make autonomous technology a reality for the first adopters, which are most likely commercial fleets. Vehicle-to-infrastructure (V2I or v2i) is a communications model that allows vehicles to share information with the components that support a country's hi... » read more

A Crisis In DoD’s Trusted Foundry Program?


The U.S. Department of Defense’s Trusted Foundry program is in flux due to GlobalFoundries’ recent decision to put 7nm on hold, raising national security concerns across the U.S. defense community. U.S. DoD and military/aerospace chip customers currently have access to U.S.-based “secure” foundry capacity down to 14nm, but that's where it ends. No other foundries provide similar “s... » read more

Wanted: Mask Equipment for Mature Nodes


Rising demand for chips at mature nodes is impacting the photomask supply chain, causing huge demand for trailing-edge masks and a shortfall of older mask equipment. The big issue is the equipment shortfall, which could impact customers on several fronts. Tool shortages could lead to longer mask turnaround times and delivery schedules for chips being developed at 90nm and above, which are bu... » read more

Collaboration And Advanced Substrates


Discussions of semiconductor manufacturing tend to focus on CMOS logic and memory devices, sometimes to the exclusion of everything else. Discussions of silicon-on-insulator wafer markets focus on the needs of high performance logic. Lithography analysts emphasize high density memories. It’s easy to forget that real systems contain other devices, too. A modern smartphone probably supports ... » read more

Lab-To-Fab Testing


Test equipment vendors are working on integrating testing and simulation in the lab with testing done later in the fab, setting the stage for what potentially could be the most significant change in semiconductor test in years. If they are successful, this could greatly simplify design for test, which has become increasingly difficult as chips get more complex, denser, and as more heterogene... » read more

← Older posts Newer posts →