tag: Siemens

Blog Review: Feb. 9
By Jesse Allen - 09 Feb, 2022 - Comments: 0

Arm's Mark Inskip walks through how the Morello program built a demonstration of the architecture that enables fine-grained memory protection and highly scalable software compartmentalization based on the CHERI (Capability Hardware Enhanced RISC Instructions) architectural model, from IP development and SoC design to creating software and a demonstration board. Synopsys' Plamen Asenov and su... » read more

Do You Know For Sure Your RISC-V RTL Doesn’t Contain Any Surprises?
By Joseph Hupcey III - 03 Feb, 2022 - Comments: 0

Given the relative novelty and complexity of RISC-V RTL designs, whether you are buying a commercially supported core or downloading a popular open-source offering, there is the small but non-zero risk of unwanted surprises escaping undetected into your end-product. In order of high-to-low probability, consider: The presence of a weird-yet-entirely-possible corner-case bug Bugs “insid... » read more

Dependable Verification Is The Foundation ICs Require
By Pirzad Motafram - 27 Jan, 2022 - Comments: 0

As our world becomes increasingly high-tech, it is easy to lose sight of the little things that make all of our fancy gadgets achieve optimal performance. The one thread that enables you to get all of the benefits of a new laptop, tablet, smartphone, or your automobile’s digital dashboard and connects the components that ensure best performance is the integrated circuit (IC). For as breath... » read more

Blog Review: Jan. 26
By Jesse Allen - 26 Jan, 2022 - Comments: 0

Arm's Mark Inskip shares how the Morello prototype architecture, aimed at improving the security of hardware, was developed, from the creation of the prototype architecture specification, followed by the design and implementation of a new CPU, through to the development of a new SoC, hardware platform, development tools, toolchains, and software. Cadence's Paul McLellan looks at how the RISC... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 21 Jan, 2022 - Comments: 0

Fabs Intel has announced plans for an initial investment of more than $20 billion in the construction of two new leading-edge fabs in Ohio. Planning for the first two factories will start immediately, with construction expected to begin late in 2022. Production is expected to come online in 2025. As part of the announcement, Air Products, Applied Materials, Lam Research and Ultra Clean Technol... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 21 Jan, 2022 - Comments: 0

Security Arm shipped a prototype CHERI-enabled Morello processor, SoC, and board, the first products coming from the security Morello research program that aims to make more secure hardware that will block certain common attacks. The first board prototypes are going to testing teams at Google, Microsoft, and other major stakeholders and partners across the industry and academia.  The UKRI (UK... » read more

Blog Review: Jan. 12
By Jesse Allen - 12 Jan, 2022 - Comments: 0

Synopsys' Twan Korthorst introduces the history of photonics, why it is important for the semiconductor industry, key market applications, and the future of photonic integrated circuits. Cadence's Paul McLellan takes a look at TSMC's recent announcements around its N3 and N3 HPC notes and the push for performance gains through design technology co-optimization Siemens' Sebastian Flock che... » read more

High-Quality Test And Embedded Analytics Are Vital For Secure SoCs
By Lee Harrison - 11 Jan, 2022 - Comments: 0

Applications like as smart cards and devices used in the defense industry require security to ensure that sensitive data is inaccessible to outside agents. This used to be a niche requirement met through custom solutions. However, now that automotive and cyber-physical systems are proliferating, the requirements around secure test and monitoring are becoming mainstream. The current best strateg... » read more

Managing Today’s Advanced Vehicle Networks Design Challenges
By Brendan Morris - 06 Jan, 2022 - Comments: 0

Today’s automotive electrical and electronic (E/E) architectures are highly complex, with the functionality of many vehicle features distributed across multiple discrete ECUs. The ECUs, sensors and actuators are not all directly connected, and much of the data communication occurs across networks, often through gateways over several networks. Modern E/E architectures are formally organized ar... » read more

Blog Review: Jan. 5
By Jesse Allen - 05 Jan, 2022 - Comments: 0

Cadence's Paul McLellan listens in on the challenges Tesla sees in manufacturing batteries for electric vehicles at scale and the types of battery chemistries it are currently using. Synopsys' Mark Kahan finds out the launch steps involved with the James Webb Space Telescope and the role of optical design software in creating the new instruments for Near IR and Mid IR sensing. Siemens' An... » read more

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