Beyond Signoff


The future of connectivity is very promising - the new era of semiconductors will give rise to transformational products that will enable seamless connectivity with 5G, smarter devices with AI, next generation mobility with autonomous vehicles and immersive experiences with AR and VR. These cutting-edge electronics systems will require the use of advanced sub-16nm SoCs and complex packaging tec... » read more

Timing Signoff Methodology For eFPGA


An eFPGA is a hard IP block in an SoC. Most SoCs are made up of a collection of hard IP blocks (RAM, SerDes, PHYs…) and the remaining logic is constructed using Standard Cells. The timing signoff for an eFPGA’s interface with the rest of the chip is designed to leverage standard ASIC timing signoff flow for a hard-macro: as long as inputs/output to/from the eFPGA are all flopped, the int... » read more

8 Checks That Every PCB Designer Needs To Achieve Electrical Sign-Off


Automate electrical design rule checking (DRC) for fast, cost-effective PCB design verification. These eight rules apply regardless of your PCB layout tool or level of expertise. To read more, click here. » read more

Signal Integrity Methodology For Double-Digit Multi-Gigabit Interfaces


As data rates for serial link interfaces such as PCI Express (PCIe) Gen 4 move into the double digits, device modeling, interconnect modeling, and analysis methodologies must continue to evolve to address the shrinking design margins and increasingly challenging compliance criteria facing today’s engineers. To mitigate risk and optimize designs, it is critical to move analysis as far upstream... » read more

Improving Automotive Reliability


Semiconductor reliability requirements are rapidly evolving. New applications such as ADAS/self-driving cars and drones are pushing the limits for system reliability. A mobile phone that overheats in your pocket is annoying. In automobiles, it's a much different story. Overheating can impact the operation of backup sensors, which alert the driver that a pedestrian or obstacle is behind them.... » read more

Tech Talk: 7nm Power


Annapoorna Krishnaswamy, lead applications engineer at ANSYS, talks with Semiconductor Engineering about power-related changes at 7nm and what engineering teams need to watch out for as they move down to the latest process technology. https://youtu.be/Ym46ssJPeHM » read more

Choosing The Right Verification Technology For CDC-Clean RTL Signoff


Modern system-on-chip (SoC) designs typically contain multiple asynchronous clock domains. Clock domain crossing (CDC) signals, those which traverse these domains, are often subject to metastability effects that can cause functional errors. Traditional methods like RTL simulation or static timing analysis alone are not sufficient to verify correct data transfer across clock domains. As a result... » read more

Optimization Challenges For 10nm And 7nm


Optimization used to be a simple timing against area tradeoff, but not anymore. As we go to each new node the tradeoffs become more complicated, involving additional aspects of the design that used to be dealt with in isolation. Semiconductor Engineering sat down to discuss these issues with Krishna Balachandran, director of product management for low-power products at [getentity id="22032"... » read more

Addressing Process Variation And Reducing Timing Pessimism At 16nm And Below


At 16nm and below, on-chip variation (OCV) becomes a critically important issue. Increasing process variation makes a larger impact on timing, which becomes more pronounced in low-power designs with ultra-low voltage operating conditions. In this paper, we will discuss how a new methodology involving more accurate library characterization and variation modeling can reduce timing margins in libr... » read more

Power Estimation: Early Warning System Or False Alarm?


Semiconductor Engineering sat down with a large panel of experts to discuss the state of power estimation and to find out if the current levels of accuracy are sufficient to being able to make informed decisions. Panelists included: Leah Schuth, director of technical marketing in the physical design group at [getentity id="22186" comment="ARM"]; Vic Kulkarni, senior vice president and general m... » read more

← Older posts