tag: signoff

Harnessing Artificial Intelligence For Trusted IC Signoff
By Carey Robertson - 14 May, 2026 - Comments: 0

After years of behind-the-scenes work, artificial intelligence (AI) is now embedded throughout the technology world—from space exploration to everyday apps on our smartphones. There is a circular feedback loop in which we design more powerful computer chips to train AI models and use them; and then use those AI models to design even more powerful chips. The use of AI in the software used for ... » read more

New Challenges In Signoff
By Ed Sperling - 03 Mar, 2026 - Comments: 0

Multi-die assemblies coupled with leading-edge process nodes make signoff increasingly challenging and scary. There are more corner cases and more data to consider, but no slack in the delivery schedule. Marc Heyberger, product engineer group director at Cadence Design Systems, talks about full-chip timing, flat versus hierarchical timing analysis, the ongoing development of full 3D-ICs, and wh... » read more

A Guide To Accelerating Your Design Timeline With Electromagnetic Analysis
By Cadence - 12 Nov, 2025 - Comments: 0

Today’s high-speed PCB and system-level design demands fast, accurate simulation. This ebook explains how to choose the right electromagnetic (EM) solver—from 2D and hybrid methods to full 3D FEM—for every stage of the design process. Inside, you’ll learn: When to use 2D, 3D planar (hybrid), or full-wave 3D solvers How the cloud-native parallelized Cadence Clarity 3D Tran... » read more

Top Five Trends In RTL Signoff
By Suresh Babu Barla - 30 Oct, 2025 - Comments: 0

By Suresh Babu Barla and Rimpy Chugh The “shift left” of the development cycle is critical for the huge, complex chips used in such applications as AI and high-performance computing (HPC). Identifying design issues at the netlist stage occurs far too late in the design development process. At this point, addressing such problems demands significant effort, primarily because most design-r... » read more

STA Strategies For Fast And Efficient Signoff Performance For Multi-Billion Instance Designs
By Manoz Palaparthi - 31 Jul, 2025 - Comments: 0

Contemporary AI, high-performance computing (HPC), mobile, and automotive designs continue to grow in size and complexity, putting a strain on the high-capacity compute required for static timing analysis (STA) workloads. Designs continue to grow at an unprecedented rate in size and complexity, outpacing the capacity of existing high-performance compute servers. A modern STA solution that can h... » read more

RTL Signoff vs. Functional Signoff: What’s The Difference?
By Bradley Geden - 17 Jul, 2025 - Comments: 1

By Bradley Geden and Manoz Palaparthi In semiconductor design, “signoff” is often treated as a single milestone. In practice, however, it encompasses distinct verification phases with unique objectives. Functional signoff and RTL signoff represent two such phases. Both are essential, and each one is focused on different facets of correctness. While functional signoff verifies whether ... » read more

Accelerating SI/PI Signoff: A Shift-Left Approach to PCB Design
By Cadence - 23 Apr, 2025 - Comments: 0

In high-speed PCB design, late-stage signal integrity (SI) and power integrity (PI) issues can lead to costly redesigns and delays. This white paper explores how in-design analysis helps engineers catch and fix SI/PI challenges early, saving time, reducing risks, and ensuring first-pass success. What You’ll Learn: The Shift-Left Advantage – How early SI/PI analysis minimizes late-s... » read more

Achieving Successful Multi-Die Signoff
By Vamsi Thatha - 19 Dec, 2024 - Comments: 0

Multi-die designs leveraging 2.5D and 3D technologies are becoming crucial for various electronics applications, including high-performance computing (HPC), artificial intelligence (AI), automotive, and mobile devices. These designs allow the integration of dies from different foundries and technology nodes, enhancing density and interconnect speeds beyond traditional discrete dies. However, th... » read more

A Shift Left Strategy Is One Part Of A Holistic Approach To IC Design Verification
By David Abercrombie - 28 Sep, 2023 - Comments: 0

The whole is more than the sum of its parts. –Aristotle A machine is nothing more than a collection of nuts, bolts, wheels, gears, wires, pipes, chains, and what have you. And yet, when they are all connected up properly, magic happens. Instead of a pile of parts, you have a car, or a dishwasher, or a nuclear reactor. The connections and interactions between all those parts turns the whole... » read more

Fast, Focused Early-Stage Circuit Verification Can Get You To Signoff Faster
By Kesmat Shahin - 23 Feb, 2023 - Comments: 0

Designers everywhere know that with the increasing complexity of integrated circuits (ICs), meeting tapeout schedules has become increasingly difficult. While there are often many reasons for missing tapeouts, one critical component is the significant amount of time needed to run the signoff layout verification cycle, which contributes to overall signoff process duration. Much of this schedule ... » read more

← Older posts

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2026 SMG   |  Terms of Service  |  Privacy Policy