tag: SPICE simulation

Transistor Sizing Approach for OTA Circuits Using a Transformer Architecture
By Technical Paper Link - 07 Feb, 2025 - Comments: 0

A  new technical paper titled "Accelerating OTA Circuit Design: Transistor Sizing Based on a Transformer Model and Precomputed Lookup Tables" was published by University Minnesota and Cadence. Abstract: "Device sizing is crucial for meeting performance specifications in operational transconductance amplifiers (OTAs), and this work proposes an automated sizing framework based on a transform... » read more

DFT At The Leading Edge
By Gregory Haley - 14 Jan, 2025 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss the rapidly changing landscape of design for testability (DFT), focusing on the impact of advancements in fault models, high-speed interfaces, and lifecycle data analytics, with Jeorge Hurtarte, senior director of product marketing in the Semiconductor Test Group at Teradyne; Sri Ganta, director of test products at Synopsys; D... » read more

Revolution By Evolution: Getting To The Next Technology Breakthrough In Analog Simulation
By Cadence - 12 Jun, 2019 - Comments: 0

Recent technology developments, advanced-node adoptions, and Moore than Moore designs have forced analog and custom IC designers to adopt new design practices that benefit from these advancements. These changes have resulted in the need to simulate larger designs with more post-layout parasitics. In addition, many custom IC designs such as flash memory, MRAM, sensor arrays, etc., now require SP... » read more

Prediction of SRAM Reliability Under Mechanical Stress Induced by Harsh Environments
By Fraunhofer IIS/EAS - 07 Nov, 2018 - Comments: 0

On the example of a 28nm SRAM array, this work presents a novel reliability study which takes into account the effect of externally applied mechanical stress in circuit simulations. This method is able to predict the bit failures caused by the stress via the piezoresistive effect. The stability of each single SRAM cell is simulated using static noise margin. Finally, the whole array’s behavio... » read more

New Thermal Issues Emerge
By Ann Mutschler - 12 Feb, 2018 - Comments: 0

Thermal monitoring is becoming more critical as gate density continues to increase at each new node and as chips are developed for safety critical markets such as automotive. This may sound counterintuitive because the whole point of device scaling is to increase gate density. But at 10/7 and 7/5nm, static current leakage is becoming a bigger issue, raising questions about how long [getkc id... » read more

Reduce Verification Complexity In Low/Multi-Power Designs
By Mentor, a Siemens Business - 10 May, 2017 - Comments: 0

Accurate and efficient low-power and multiple-power domain verification requires both knowledge of the overall system’s power intent and careful tracking of signals crossing these power domains. Calibre PERC is the only comprehensive solution capable of providing transistor-level power intent verification without the need for SPICE simulation on both the schematic and layout side of your desi... » read more

Mixed-Signal Design Powers Ahead
By Ann Mutschler - 10 Mar, 2016 - Comments: 1

Mixed-signal devices are at the heart of many advanced systems today because of the need to interact with the outside world, but designing and verifying these systems is getting harder. There are several reasons for this. First, almost all of these devices now have to be lower power than in the past, and in the analog space it's not as simple as just dialing down part of a block. Second, it ... » read more

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