Are We Too Hard On Artificial Intelligence For Autonomous Driving?

By Frank Schirrmeister - 03 Nov, 2022 - Comments: 1

I recently attended and presented at Detroit's "Implementation of ISO 26262 & SOTIF" conference. Its subtitle was "Taking an Integrated Approach to Automotive Safety." After three days, my head was spinning with numbers of ISO/SAE and other standards. And at the end of day two, after yet another example that tricked autonomous driving prototypes into behaving wrongly, I sighed and asked whe... » read more

How Do You Qualify Tools For DO-254 Programs?

By Siemens EDA - 02 Nov, 2022 - Comments: 0

This paper describes the terminology and requirements related to tool qualification specific to the safety-critical programs governed by DO-254 compliance. It also provides some practical examples of tool qualification processes and strategies for commonly used tools. Qualifying tools for DO-254 While the use of state-of-the art development tools has led to ever increasing design complexity... » read more

Testing Chips For Security

By Jeff Goldman - 06 Oct, 2022 - Comments: 0

Supply chains and manufacturing processes are becoming increasingly diverse, making it much harder to validate the security in complex chips. To make matters worse, it can be challenging to justify the time and expense to do so, and there’s little agreement on the ideal metrics and processes involved. Still, this is particularly important as chip architectures evolve from a single chip dev... » read more

Enabling Test Strategies For 2.5D, 3D Stacked ICs

By Laura Peters - 08 Sep, 2022 - Comments: 0

Improved testability, coupled with more tests at more insertion points, are emerging as key strategies for creating reliable, heterogeneous 2.5D and 3D designs with sufficient yield. Many changes need to fall into place to make side-by-side 2.5D and 3D stacking approaches cost-effective, particularly for companies looking to integrate chiplets from different vendors. Today, nearly all of t... » read more

Where Are The Autonomous Cars?

By Marie C. Baca - 08 Aug, 2022 - Comments: 0

Are we there yet? Governments, consumers, and engineers alike want to know how close the automotive world is to producing a fully autonomous Level 5 vehicle. While some experts say such vehicles could hit the road in the next few years, they're a shrinking minority. Most forecasts say a truly self-driving car is at least a decade away — and maybe much longer, because it requires disruptive... » read more

Building Trust Through Certification Of Security Solutions

By Stuart Kincaid - 04 Aug, 2022 - Comments: 0

Certification is all around us in our daily lives. When it comes to making decisions, we look for certain labels, stamps, and symbols indicating that products and services have been assessed or tested. If you are buying a new car, you may review NCAP (New Car Assessment Program) test results. If you are getting electrical work done at your home, you will choose a certified professional. And if ... » read more

Is Standardization Required For Security?

By Ann Mutschler - 04 Aug, 2022 - Comments: 1

Semiconductor Engineering sat down to discuss chip and system security with Mike Borza, fellow and scientist on the security IP team at Synopsys; Lee Harrison, automotive IC test solutions manager at Siemens Digital Industries Software; Jason Oberg, founder and CTO of Cycuity (formerly Tortuga Logic); Nicole Fern, senior security analyst at Riscure; Norman Chang, fellow and CTO of the electroni... » read more

Finding Frameworks For End-To-End Analytics

By Anne Meixner - 12 Jul, 2022 - Comments: 0

End-to-end analytics can improve yield and ROI on tool purchases, but reaping those benefits will require common data formats, die traceability, an appropriate level of data granularity — and a determination of who owns what data. New standards, guidelines, and consortium efforts are being developed to remove these barriers to data sharing for analytics purposes. But the amount of work req... » read more

Audio, Visual Advances Intensify IC Design Tradeoffs

By Ann Mutschler - 13 Jun, 2022 - Comments: 0

A spike in the number of audio and visual sensors is greatly increasing design complexity in chips and systems, forcing engineers to make tradeoffs that can affect performance, power, and cost. Collectively, these sensors generate so much data that designers must consider where to process different data, how to prioritize it, and how to optimize it for specific applications. The tradeoffs in... » read more

Khronos: Open Standards Powering The Future Of Embedded Vision

By Paul McLellan - 09 Jun, 2022 - Comments: 0

At the recent Embedded Vision Summit, one of the presentations was by Neil Trevett of The Khronos Group. This is a standardization body and is a non-profit. He said that his day job is at Nvidia. It has been creating standards for 20 years with a focus on low-level hardware acceleration APIs for 3D graphics, parallel computation, augmented reality (AR), virtual reality (VR), and machine learnin... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?