The Next Generation Of Wearables

By Ernest Worthman - 07 May, 2015 - Comments: 0

As the wearable market begins to take root, so has the focus on ultra-low power design—with some unique headaches that are unique to wearables. To begin with, there is much attention being paid to this market because of the almost staggering predictions associated with it. While numbers vary greatly, IDC predicts as many as 126 million units will be shipping annually by 2019. The five-year... » read more

FD-SOI Vs. FinFETs

By Ed Sperling - 30 Apr, 2015 - Comments: 0

Semiconductor Engineering sat down to compare the benefits, risks and challenges of moving to finFETs compared with fully depleted silicon on insulator ([getkc id="220" kc_name="FD-SOI"]) with Philippe Magarshack, group vice president for technology R&D at [getentity id="22331" comment="STMicroelectronics"]; Marco Brambilla, director of engineering at [getentity id="22150" e_name="Synapse D... » read more

What EDA’s Big 3 Think Now

By Ed Sperling - 23 Apr, 2015 - Comments: 0

In the past two months the CEOs of Cadence, Synopsys and Mentor Graphics delivered their annual high-level messages to their respective user groups. Semiconductor Engineering attended all of the speeches at these conferences, as it did in 2014 (see story here). From a high level, the big issues for CEOs last year were Moore's Law, the costs of design, the impact of low power, and business-... » read more

Partly Sunny, With A Chance For Explosive Growth

By Mike Gianfagna - 23 Apr, 2015 - Comments: 0

I recently attended a session at the Mentor Graphics User Conference (User2User) in San Jose that dealt with the changing foundry landscape. The session was moderated by SemiWiki's Dan Nenni and included: • Giorgio Cesana, director of technology at STMicroelectronics • Jack Harding, co-founder, president & CEO of eSilicon • Lluis Paris, deputy director of worldwide IP alliances at ... » read more

Meeting Functional Safety Requirements Efficiently Via Electronic Design Tools And Techniques

By Cadence - 22 Apr, 2015 - Comments: 0

In an intelligent electronic system, unexpected errors can lead to unplanned, unexpected behavior. This can be a potentially dangerous proposition for, say, an automotive manufacturer, as well as a costly occurrence for consumer product developers. Compliance to the latest safety standards can be a laborious, time-consuming process. Fortunately, there are now technologies available that can aut... » read more

FD-SOI Vs. FinFETs

By Ed Sperling - 16 Apr, 2015 - Comments: 1

5 Issues Under The Foundry Radar

By Mark LaPedus - 16 Apr, 2015 - Comments: 0

In the foundry business, the leading-edge segment grabs most, if not all, of the headlines. Foundry vendors, of course, are ramping up 16nm/14nm finFET processes, with 10nm and 7nm in R&D. The leading-edge foundry business is sizable, but it’s not the only thing going on in the competitive arena. In fact, there are battles taking place in many other foundry segments, such as 2.5D/3D packag... » read more

Ecosystem Changes

By Ed Sperling - 26 Mar, 2015 - Comments: 0

Semiconductor Engineering sat down to discuss changes in the semiconductor ecosystem with Kelvin Low, senior director of foundry marketing at [getentity id="22865" e_name="Samsung Semiconductor"]; John Costello, vice president of product planning at [getentity id="22849" e_name="Altera"]; Randy Smith, vice president of marketing at [getentity id="22605" e_name="Sonics"], and Michiel Ligthart, p... » read more

The Week In Review: Manufacturing

By Mark LaPedus - 20 Mar, 2015 - Comments: 0

For years, Altera’s sole foundry was TSMC. Then, not long ago, Altera selected Intel as its foundry partner for 14nm. TSMC still handles 20nm and above work for Altera. Now, Altera will soon select a foundry partner for 10nm. “Altera will make a decision on which foundry partner it will choose for 10nm finFET at the end of 1Q15, noting it will decide between Intel and TSMC,” said John Vin... » read more

HDMI 2.0 Design And Verification Challenges

By Cadence - 11 Mar, 2015 - Comments: 0

High-Definition Multimedia Interface (HDMI) is an audio/video (A/V) trans- mission protocol, which is omnipresent in consumer electronics, personal computing, and mobile products. Modern-day requirements of big screen resolutions, 3D, and multi-channel/multi-stream audio have pushed display devices to use a completely digital, high-speed transmission media, requiring a multi-layered protocol li... » read more

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The Next Generation Of Wearables

FD-SOI Vs. FinFETs

What EDA’s Big 3 Think Now

Partly Sunny, With A Chance For Explosive Growth

Meeting Functional Safety Requirements Efficiently Via Electronic Design Tools And Techniques

FD-SOI Vs. FinFETs

5 Issues Under The Foundry Radar

Ecosystem Changes

The Week In Review: Manufacturing

HDMI 2.0 Design And Verification Challenges

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