What EDA’s Big 3 Think Now

By Ed Sperling - 23 Apr, 2015 - Comments: 0

In the past two months the CEOs of Cadence, Synopsys and Mentor Graphics delivered their annual high-level messages to their respective user groups. Semiconductor Engineering attended all of the speeches at these conferences, as it did in 2014 (see story here). From a high level, the big issues for CEOs last year were Moore's Law, the costs of design, the impact of low power, and business-... » read more

Partly Sunny, With A Chance For Explosive Growth

By Mike Gianfagna - 23 Apr, 2015 - Comments: 0

I recently attended a session at the Mentor Graphics User Conference (User2User) in San Jose that dealt with the changing foundry landscape. The session was moderated by SemiWiki's Dan Nenni and included: • Giorgio Cesana, director of technology at STMicroelectronics • Jack Harding, co-founder, president & CEO of eSilicon • Lluis Paris, deputy director of worldwide IP alliances at ... » read more

Meeting Functional Safety Requirements Efficiently Via Electronic Design Tools And Techniques

By Cadence - 22 Apr, 2015 - Comments: 0

In an intelligent electronic system, unexpected errors can lead to unplanned, unexpected behavior. This can be a potentially dangerous proposition for, say, an automotive manufacturer, as well as a costly occurrence for consumer product developers. Compliance to the latest safety standards can be a laborious, time-consuming process. Fortunately, there are now technologies available that can aut... » read more

FD-SOI Vs. FinFETs

By Ed Sperling - 16 Apr, 2015 - Comments: 1

Semiconductor Engineering sat down to compare the benefits, risks and challenges of moving to finFETs compared with fully depleted silicon on insulator ([getkc id="220" kc_name="FD-SOI"]) with Philippe Magarshack, group vice president for technology R&D at [getentity id="22331" comment="STMicroelectronics"]; Marco Brambilla, director of engineering at [getentity id="22150" e_name="Synapse D... » read more

5 Issues Under The Foundry Radar

By Mark LaPedus - 16 Apr, 2015 - Comments: 0

In the foundry business, the leading-edge segment grabs most, if not all, of the headlines. Foundry vendors, of course, are ramping up 16nm/14nm finFET processes, with 10nm and 7nm in R&D. The leading-edge foundry business is sizable, but it’s not the only thing going on in the competitive arena. In fact, there are battles taking place in many other foundry segments, such as 2.5D/3D packag... » read more

Ecosystem Changes

By Ed Sperling - 26 Mar, 2015 - Comments: 0

Semiconductor Engineering sat down to discuss changes in the semiconductor ecosystem with Kelvin Low, senior director of foundry marketing at [getentity id="22865" e_name="Samsung Semiconductor"]; John Costello, vice president of product planning at [getentity id="22849" e_name="Altera"]; Randy Smith, vice president of marketing at [getentity id="22605" e_name="Sonics"], and Michiel Ligthart, p... » read more

The Week In Review: Manufacturing

By Mark LaPedus - 20 Mar, 2015 - Comments: 0

For years, Altera’s sole foundry was TSMC. Then, not long ago, Altera selected Intel as its foundry partner for 14nm. TSMC still handles 20nm and above work for Altera. Now, Altera will soon select a foundry partner for 10nm. “Altera will make a decision on which foundry partner it will choose for 10nm finFET at the end of 1Q15, noting it will decide between Intel and TSMC,” said John Vin... » read more

HDMI 2.0 Design And Verification Challenges

By Cadence - 11 Mar, 2015 - Comments: 0

High-Definition Multimedia Interface (HDMI) is an audio/video (A/V) trans- mission protocol, which is omnipresent in consumer electronics, personal computing, and mobile products. Modern-day requirements of big screen resolutions, 3D, and multi-channel/multi-stream audio have pushed display devices to use a completely digital, high-speed transmission media, requiring a multi-layered protocol li... » read more

The Week In Review: Manufacturing

By Mark LaPedus - 20 Feb, 2015 - Comments: 0

For years, chipmakers have attempted to build fabs in India. So far, however, India has failed to set up modern fabs and for good reason. There are issues in terms of obtaining dependable power and water for a fab in India, according to Will Strauss, president of Forward Concepts, who added that India also suffers from government bureaucracy. India is still trying. Last week, Cricket Semicon... » read more

FD-SOI Meets The IoT

By Ann Mutschler - 05 Feb, 2015 - Comments: 1

Silicon-on-insulator manufacturing technology has been discussed for many years. IBM has used the partially depleted variation of SOI in its server products, but the fully depleted version has yet to find widespread adoption outside of mil/aero and automotive markets. That may change soon as applications in the Internet of Things ramp, given the requirements for ultra low power and low cost.... » read more

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tag: STMicroelectronics

What EDA’s Big 3 Think Now

Partly Sunny, With A Chance For Explosive Growth

Meeting Functional Safety Requirements Efficiently Via Electronic Design Tools And Techniques

FD-SOI Vs. FinFETs

5 Issues Under The Foundry Radar

Ecosystem Changes

The Week In Review: Manufacturing

HDMI 2.0 Design And Verification Challenges

The Week In Review: Manufacturing

FD-SOI Meets The IoT