tag: STMicroelectronics

More Choices, Less Certainty
By Ed Sperling - 04 Nov, 2015 - Comments: 3

The increasing cost of feature scaling is splintering the chip market, injecting uncertainty into a global supply chain that has been continually fine-tuned for decades. Those with deep enough resources and a clear need for density will likely follow Moore's Law, at least until 7nm. What comes after that will depend on a variety of factors ranging from available lithography—EUV, multi-bea... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 30 Oct, 2015 - Comments: 0

Lam Research’s proposed move to acquire KLA-Tencor is still generating a buzz in the industry. One executive from Lam has explained the reason for the deal. Meanwhile, analysts are also weighing in. “We believe the deal itself is a positive one for Lam as it supplements its leading etch position with the market share leader in process control with significant accretion and earnings leverage... » read more

The Week In Review: Design/IoT
By Jesse Allen - 02 Oct, 2015 - Comments: 0

EDA industry revenue increased 8.5% for Q2 2015 to $1906.5 million, according to the latest report from the EDA Consortium. The four-quarters moving average, which compares the most recent four quarters to the prior four quarters, also increased by 8.5%. IP showed continued strength, with revenue totalling $611.7 million in Q2 2015, a 15% increase compared to Q2 2014; the four-quarters moving a... » read more

Top 15 Integrating Points In The Continuum Of Verification Engines
By Frank Schirrmeister - 30 Jul, 2015 - Comments: 0

The integration game between the different verification engines, dynamic and static, is in full swing. Jim Hogan talked about the dynamic engines that he dubbed “COVE”, and I recently pointed out a very specific adoption of COVE in my review of some customer examples at DAC 2015 in “Use Model Versatility Is Key for Emulation Returns on Investment”. Here are my top 15 integrating poin... » read more

Which Process, Material, IP?
By Ed Sperling - 30 Jul, 2015 - Comments: 1

For years chipmakers have been demanding more choices. They've finally gotten what they wished for—so many possibilities, in fact, that engineering teams of all types are having trouble wading through them. And to make matters worse, some choices now come with unexpected and often unwanted caveats. At the most advanced nodes it's a given that being able to shrink features and double patter... » read more

Moore’s Law Reset?
By Ed Sperling - 13 Jul, 2015 - Comments: 0

GlobalFoundries today took the wraps off its 22nm FD-SOI process, promising to extend Moore's Law technologically without altering the economic equation—at least for the next couple of process nodes. Subramani Kengeri, vice president of global design solutions at [getentity id="22819" comment="GlobalFoundries"], said 22nm FD-SOI will provide the same 30% improvement in PPA that has been c... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 10 Jul, 2015 - Comments: 0

An alliance led by IBM Research has produced the semiconductor industry’s first 7nm test chips with functioning transistors. The breakthrough, accomplished in partnership with GlobalFoundries and Samsung at SUNY Polytechnic Institute’s Colleges of Nanoscale Science and Engineering, could result in the ability to place more than 20 billion tiny switches, or transistors, on a chip. There i... » read more

Foundries Expand Planar Efforts
By Mark LaPedus - 18 Jun, 2015 - Comments: 0

Competition is heating up in the leading-edge foundry business, as vendors begin to ramp up their new 16nm/14nm finFET processes. But that’s not the only action in the foundry arena. They are also expanding their efforts in the leading-edge planar market by rolling out new 28nm and 22nm processes. On one front, TSMC is offering new 28nm variants, based on bulk CMOS technology. And on an... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 12 Jun, 2015 - Comments: 0

Christopher Rolland, an analyst at FBR, made a startling statement in a recent report. “At the pace of consolidation set thus far this year, 32% of all U.S. publicly traded semiconductor companies would be acquired in 2015! While this run-rate is not likely sustainable and should slow as the year progresses, we still expect ~15% consolidation rates for the remainder of this cycle (above low-t... » read more

The Week In Review: Design/IoT
By Jesse Allen - 05 Jun, 2015 - Comments: 0

Tools Cadence unveiled Genus, their next-generation RTL synthesis and physical synthesis engine incorporating a multi-level massively parallel architecture and physically aware context-generation capability. Using it for their recent PowerVR GE7800 GPU, Imagination reported a 5X improvement in turnaround time versus the previous Cadence synthesis solution with no impact on power, performance... » read more

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