tag: STMicroelectronics

Manufacturing Bits: Sept. 2
By Mark LaPedus - 02 Sep, 2014 - Comments: 0

Looking at space dust The first analysis of space dust, collected by a special collector onboard NASA's Stardust mission and sent back to Earth for study in 2006, is more complex in composition and structure than previously thought. Researchers examined the dust using synchrotron light sources from three groups--the U.S. Department of Energy's Argonne National Laboratory, Lawrence Berkeley... » read more

ST Announces 20x Savings Using OpenPDK At DAC
By Steve Schulz - 02 Jul, 2014 - Comments: 0

Last month’s Design Automation Conference in San Francisco proved to be highly successful for Si2. This year, for example, Si2 organized 28 member-led presentations, issued 10 press releases, and hosted 5 special events. Today I will focus on one of those events, a special press conference featuring Philippe Magarshack, executive vice president for design enablement services at STMicroelectro... » read more

The Week In Review: Design
By Ed Sperling - 06 Jun, 2014 - Comments: 0

Tools Mentor Graphics rolled out embedded Linux software for AMD’s x86 G-series SoCs, code-named Steppe Eagle and its Crowned Eagle CPUs. Ansys-Apache and TowerJazz have created a power noise and reliability signoff design kit, including reference flow guidelines, test case examples and flow setup guidance. Synopsys updated its verification portfolio with static and formal tools for CD... » read more

The Week In Review: Design
By Ann Mutschler - 30 May, 2014 - Comments: 0

M&A ARM said it is acquiring Duolog Technologies, a player in design configuration and integration technology for the semiconductor industry. ARM said this will expand its position for deploying complex system IP including debug and trace IP. Terms of the deal have not been disclosed. Tools and IP ARM’s Cortex A9 core is at the heart of a new secure processor from Broadcom aimed at endpo... » read more

SEMICON West Preview
By SEMI - 19 May, 2014 - Comments: 0

By Paula Doe The fast growing demand for bandwidth is driving telecomm and data center user interest in moving high speed optical connections closer and closer to the chips, as recent advances in packaging technology, from microbumping to bonding to wafer-level redistribution now help make it possible. Chip-to-chip and chip-to-board optical connections increasingly look like a viable soluti... » read more

Taming The PDK Beast At DAC
By Steve Schulz - 19 May, 2014 - Comments: 0

A quick Web search on the phrase “process design kit” reveals about 48 million matches. This happens to be about 10 times larger than for the current pop dance sensation “twerking,” so I guess that’s at least something to brag about. Yet if we now add the word interoperability to our PDK search, we find only 200K matches, or less than 0.5% — and therein exposes the chronic problem w... » read more

Shootout At 28nm
By Ed Sperling - 15 May, 2014 - Comments: 0

By Ed Sperling & Mark LaPedus Samsung, Soitec and STMicroelectronics are joining forces on 28nm FD-SOI, creating a showdown with TSMC and others over the best single-patterned processes and materials and raising questions about how quickly companies need to move to the finFET technology generation. The multi-source manufacturing collaboration agreement for fully depleted silicon-on-insulato... » read more

The New Face Of MCUs
By Ann Mutschler - 10 Apr, 2014 - Comments: 0

For years, the humble microcontroller was known as the workhorse of white goods and other embedded applications that required some amount of processing, but not as much as a microprocessor would provide. Much has changed since then. Today’s MCUs are the star components in fast-growing and increasingly sophisticated application areas such as automotive, smartphones and the Internet of Thing... » read more

Directed Self-Assembly Gains Momentum
By Mark LaPedus - 20 Mar, 2014 - Comments: 0

At last year’s SPIE Advanced Lithography symposium, directed self-assembly (DSA) grabbed the spotlight as chipmakers provided the first glimpse of their initial work and results with the technology. The results were stunning, thereby propelling DSA from a curiosity item to a possible patterning solution for next-generation devices. Last year, in fact, GlobalFoundries, IBM, Intel and Sams... » read more

The Week In Review: Design
By Ed Sperling - 14 Mar, 2014 - Comments: 0

Tools Synopsys uncorked the next version of its verification tool, which includes static and formal verification, new debug capabilities, and low-power and X-propagation simulation. The company says the new tool offers up to 5X performance improvement. Cadence rolled out a new version of its verification solution for designs using ARM’s interconnect IP, speeding up verification and analys... » read more

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