tag: TEL

Week In Review: Manufacturing, Test
By Mark LaPedus - 12 Jul, 2019 - Comments: 0

Semi takeover targets Semiconductor M&A activity is heating up again. So who is next? “Within our coverage universe, we believe AMBA (Ambarella) and SLAB (Silicon Labs) represent the most likely targets moving forward,” according to KeyBanc in a research note. KeyBanc also listed some other “M&A Combinations That Could Make Sense.” Some of these combos make sense, while othe... » read more

5nm Vs. 3nm
By Mark LaPedus - 24 Jun, 2019 - Comments: 16

Foundry vendors are readying the next wave of advanced processes, but their customers will face a myriad of confusing options—including whether to develop chips at 5nm, wait until 3nm, or opt for something in between. The path to 5nm is well-defined compared with 3nm. After that, the landscape becomes more convoluted because foundries are adding half-node processes to the mix, such as 6nm ... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 24 May, 2019 - Comments: 0

Packaging and test In the rankings, ASE was the top OSAT in terms of sales in the first quarter of 2019, according to TrendForce. Amkor and JCET were next in the rankings. “Judging from the falling phone sales 1Q19 impacted by the U.S.-China trade dispute and the oversupply situation in memory markets, the total revenue of the top ten businesses in packaging and testing are predicted to st... » read more

Single Vs. Multi-Patterning EUV
By Mark LaPedus - 25 Mar, 2019 - Comments: 5

Extreme ultraviolet (EUV) lithography finally is moving into production, but foundry customers now must decide whether to implement their designs using EUV-based single patterning at 7nm, or whether to wait and instead deploy EUV multiple patterning at 5nm. Each patterning scheme has unique challenges, making that decision more difficult than it might appear. Targeted for 7nm, single pattern... » read more

EUV Arrives, But More Issues Ahead
By Katherine Derbyshire - 21 Mar, 2019 - Comments: 5

EUV has arrived. After decades of development and billions of dollars of investment, EUV lithography is taking center stage at the world’s leading fabs. More than 20 years after ASML's extreme ultraviolet lithography research program began, and nearly a decade after its first pre-production exposure tools, the company expects to deliver 30 EUV exposure systems in 2019. That is nearly doubl... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 01 Feb, 2019 - Comments: 0

Chipmakers and OEMs Taiwan specialty foundry vendor Vanguard International Semiconductor (VIS) will acquire GlobalFoundries’ Fab 3E facility in Singapore for $236 million. Fab 3E manages a monthly capacity of approximately 35,000 200mm wafers. The transaction includes buildings, facilities, and equipment, as well as IP associated with GF’s MEMS business. VIS currently has three 200mm fa... » read more

Variation Issues Grow Wider And Deeper
By Ed Sperling - 24 Jan, 2019 - Comments: 0

Variation is becoming more problematic as chips become increasingly heterogeneous and as they are used in new applications and different locations, sparking concerns about how to solve these issues and what the full impact will be. In the past, variation in semiconductors was considered a foundry issue, typically at the most advanced process node, and largely ignored by most companies. New p... » read more

Embedded Phase-Change Memory Emerges
By Mark LaPedus - 24 Jan, 2019 - Comments: 3

The next-generation memory market for embedded applications is becoming more crowded as another technology emerges in the arena—embedded phase-change memory. Phase-change memory is not new and has been in the works for decades. But the technology has taken longer to commercialize amid a number of technical and cost challenges. Phase-change memory, a nonvolatile memory type that stores data... » read more

Efforts to Suppress Nanosized Particles in Semiconductor Production Equipment
By TEL - 24 Jan, 2019 - Comments: 0

The currently dominant semiconductor process size is in the range between a few and a few dozen nanometers. That means if a nanosized-particle smaller than a virus (hereinafter simply “particle”) is present on a silicon substrate, it could cause a defect in the semiconductor device, lowering the production yield (i.e., the percentage of good chips produced in a manufacturing process).... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 18 Jan, 2019 - Comments: 1

Fab tools and materials Applied Materials is expected to remain the world’s largest semiconductor equipment supplier in terms of projected sales for 2018, according to a preliminary forecast of the rankings from VLSI Research. Applied will have $14 billion in sales in 2018, according to the firm. Applied is the leader in terms of overall projected sales in 2018, followed in order by ASM... » read more

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