AI-Driven Test Optimization Solves Semiconductor Test Costs And Design Schedules


Artificial Intelligence has become a pervasive technology that is being applied to solve today’s complex problems, especially in the areas involving exponentially large amounts of data, their analysis, and corresponding decision making that are otherwise limited by human abilities. Therefore, complex challenges in semiconductor design, test and manufacturing are a perfect match for AI. The... » read more

Testing The Stack: DFT Is Ready For 3D Devices


When existing advanced 2D designs already push the limits of design-for-test (DFT) tools, what hope do developers have of managing DFT for 3D devices? Can anyone afford the tool run time, on-chip area demand, pattern count, and test time? The answer, from an array of experts, is yes, there is a path to a scalable, affordable, and comprehensive DFT solution for 3D ICs. Well-covered strategies... » read more

Total Critical Area For Optimizing Test Patterns


Increasing complexity at advanced nodes makes it much harder to locate defects and latent defects because there is more surface area to cover and much less space between the various components in a leading-edge chip design. Ron Press, technology enablement director at Siemens Digital Industries Software, talks about why it’s so important to predict where defects are most likely to occur in th... » read more

Using Critical Area To Boost Automotive IC Test Quality


To compete in the fast-growing market for automotive ICs, semiconductor companies need to address new challenges across the entire design flow. To meet the ISO 26262 goal of zero defective parts per million (DPPM), DFT engineers have embraced new test pattern types, including cell-aware, interconnect, and inter-cell bridge (cell neighborhood). But the traditional methods of choosing the types o... » read more

Critical Area-Based Test Pattern Optimization For High-Quality Test


Among the challenges for DFT engineers is how to set a target metric for ATPG and how to choose the best set of patterns. Traditional coverage targets based on the number of faults detected doesn’t consider the likelihood of one fault occurring compared to another. Tessent developed total critical area ATPG technology that enables the sorting and ordering of patterns based on their likelihood... » read more

ATE Lab To Fab


Shu Li, business development manager at Advantest, zeroes in on the communication gap between engineers on the design side and the manufacturing/test side, why it exists, and what needs to be done to bridge that gap in order to speed up and improve test quality. https://youtu.be/Nd-5_twbJBw     See other tech talk videos here » read more