tag: test patterns

Disturbance In Verification
By Brian Bailey - 08 Jun, 2026 - Comments: 3

When writing my recent story about agentic verification, there was one quote from Abhi Kolpekwar, senior vice-president and general manager at Siemens EDA, that really struck a chord. He was talking about the additional token costs that would be consumed when a verification engineer starts asking the agents to do what was considered to be part of their job. "Consider the total cost of owners... » read more

Tackling Chip Complexity With Integrated System-Level Test Solutions
By Davette Berry - 09 Dec, 2025 - Comments: 0

As the sophistication of semiconductors continues to grow, so does the need for system-level test (SLT) in production to ensure that high-performance processors, chiplets, and other advanced devices function as expected in real-world environments. Once seen primarily as a fallback to catch what traditional automated test equipment (ATE) missed, SLT has now become a mission-critical step for val... » read more

In-System/In-Field Testing Using High-Quality Deterministic Test Patterns
By Ashrith Harith - 10 Jun, 2025 - Comments: 0

The amount of electronic content in passenger cars is growing rapidly, primarily due to the integration of advanced safety features. The shift towards fully autonomous vehicles, which must comply with stringent safety standards, will further increase the number of electronic components required. Testing efforts must be of exceptional quality. The target test time is often limited to less than 1... » read more

Reversible Chain Diagnosis
By Siemens EDA - 11 Mar, 2025 - Comments: 0

For advanced technologies, the industry is seeing very complicated silicon defect types and defect distribution. One consequence is that scan chain diagnosis becomes more difficult. To improve the resolution of scan chain diagnosis, Tessent Diagnosis can use new scan chain test patterns to leverage a reversible scan chain architecture. This paper describes the novel scan chain architecture t... » read more

Power-Aware Test Vector Porting For Production ATE
By Hari Mani - 12 Nov, 2024 - Comments: 0

Power management in contemporary system-on-chip (SoC) designs is almost unimaginably complex. Processors and other chip cores turn on and off as needed. Advanced features such as dynamic voltage and frequency scaling (DVFS) can adjust to changing conditions and incrementally adjust power and performance on the fly. Power management starts from the lowest hardware level of transistor structures ... » read more

Supporting Multiple Time Domains In SoC Production Test
By Hari Mani - 14 May, 2024 - Comments: 0

Complex system-on-chip (SoC) devices make every stage of the development flow harder, and the challenges continue even after the silicon is fabricated. Automatic test equipment (ATE) screening for defective wafers and assembled chips is always challenging. Production test engineers constantly struggle to minimize expensive test pattern memory, test each wafer or chip as quickly as possible, and... » read more

AI-Driven Test Optimization Solves Semiconductor Test Costs And Design Schedules
By Sri Ganta - 08 Feb, 2024 - Comments: 0

Artificial Intelligence has become a pervasive technology that is being applied to solve today’s complex problems, especially in the areas involving exponentially large amounts of data, their analysis, and corresponding decision making that are otherwise limited by human abilities. Therefore, complex challenges in semiconductor design, test and manufacturing are a perfect match for AI. The... » read more

Testing The Stack: DFT Is Ready For 3D Devices
By Martin Keim - 08 Sep, 2022 - Comments: 0

When existing advanced 2D designs already push the limits of design-for-test (DFT) tools, what hope do developers have of managing DFT for 3D devices? Can anyone afford the tool run time, on-chip area demand, pattern count, and test time? The answer, from an array of experts, is yes, there is a path to a scalable, affordable, and comprehensive DFT solution for 3D ICs. Well-covered strategies... » read more

Total Critical Area For Optimizing Test Patterns
By Ed Sperling - 19 Oct, 2021 - Comments: 0

Increasing complexity at advanced nodes makes it much harder to locate defects and latent defects because there is more surface area to cover and much less space between the various components in a leading-edge chip design. Ron Press, technology enablement director at Siemens Digital Industries Software, talks about why it’s so important to predict where defects are most likely to occur in th... » read more

Using Critical Area To Boost Automotive IC Test Quality
By Ron Press - 03 Sep, 2020 - Comments: 0

To compete in the fast-growing market for automotive ICs, semiconductor companies need to address new challenges across the entire design flow. To meet the ISO 26262 goal of zero defective parts per million (DPPM), DFT engineers have embraced new test pattern types, including cell-aware, interconnect, and inter-cell bridge (cell neighborhood). But the traditional methods of choosing the types o... » read more

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