tag: TSMC

Week In Review: Design, Low Power
By Jesse Allen - 08 May, 2020 - Comments: 0

Tools & IP Ansys' RedHawk-SC multiphysics signoff software was certified for all TSMC advanced process technologies, including N16, N12, N7, N6 and N5. The certification includes extraction, power integrity and reliability, signal electromigration (EM) and thermal reliability analysis and statistical EM budgeting analysis. Aldec launched a new FPGA accelerator board for high performance... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 24 Apr, 2020 - Comments: 0

Chipmakers Select foundries are beginning to ramp up their new 5nm processes with 3nm in R&D. There are already signs that the foundries have pushed out their 3nm production schedules. So, expect 7nm and 5nm to become long-running nodes. At 3nm, Samsung and TSMC are going in different directions. Samsung is developing a gate-all-around (GAA) technology called nanosheet FETs. TSMC will e... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 24 Apr, 2020 - Comments: 0

PCs get work-from-home bump Rather than using Intel chips, Apple will be making its own chips for its Mac computers, using Arm cores, Bloomberg reports. TSMC will manufacture the chips. Intel, meanwhile, was up 14% quarter year-over-year its PC business, which it attributes to more people working from home and needed new equipment. Despite a strong quarter, however, the company pulled its 2... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 17 Apr, 2020 - Comments: 0

Chipmakers TSMC posted mixed results for the quarter, although there was a capital spending surprise. “It maintained its 2020 capex at $15B-$16B despite smartphone softness, primarily to support a strong 5nm ramp, led by demand from 5G and HPC customers,” said Weston Twigg, an analyst at KeyBanc, in a research note. “Despite lowering its industry outlook, TSMC still expects to grow its o... » read more

Taking A Pulse On The IC Biz
By Mark LaPedus - 16 Apr, 2020 - Comments: 0

It’s been a difficult period for the semiconductor industry. The coronavirus outbreak has put a damper on what was supposed to be a strong year in the semiconductor industry in 2020. Many are holding out hopes for a rebound in the second half of the year. That’s still a big unknown. The forecasts are gloomy. For example, VLSI Research has three different scenarios for the semiconduc... » read more

Metrology Challenges For Gate-All-Around
By Mark LaPedus - 16 Apr, 2020 - Comments: 3

Metrology is proving to be a major challenge for those foundries working on processes for gate-all-around FETs at 3nm and beyond. Metrology is the art of measuring and characterizing structures in devices. Measuring and characterizing structures in devices has become more difficult and expensive at each new node, and the introduction of new types of transistors is making this even harder. Ev... » read more

Making Chips At 3nm And Beyond
By Mark LaPedus and Ed Sperling - 16 Apr, 2020 - Comments: 4

Select foundries are beginning to ramp up their new 5nm processes with 3nm in R&D. The big question is what comes after that. Work is well underway for the 2nm node and beyond, but there are numerous challenges as well as some uncertainty on the horizon. There already are signs that the foundries have pushed out their 3nm production schedules by a few months due to various technical issu... » read more

Big Changes In Tiny Interconnects
By Ed Sperling - 16 Apr, 2020 - Comments: 1

One of the fundamental components of a semiconductor, the interconnect, is undergoing radical changes as chips scale below 7nm. Some of the most pronounced shifts are occurring at the lowest metal layers. As more and smaller transistors are packed onto a die, and as more data is processed and moved both on and off a chip or across a package, the materials used to make those interconnects, th... » read more

Designing Ultra Low Power AI Processors
By Ann Mutschler - 09 Apr, 2020 - Comments: 0

AI chip design is beginning to shift direction as more computing moves to the edge, adding a level of sophistication and functionality that typically was relegated to the cloud, but in a power envelope compatible with a battery. These changes leverage many existing tools, techniques and best practices for chip design. But they also are beginning to incorporate a variety of new approaches tha... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 27 Mar, 2020 - Comments: 0

Chipmakers TrendForce has released its projected foundry rankings in terms of sales for the first quarter. TSMC is still in first place, followed by Samsung, GlobalFoundries and UMC. Samsung has been ramping up chips based on its 7nm logic process using extreme ultraviolet (EUV) lithography. Now, Samsung is ramping up its DRAM devices using EUV and plans to expand its capacity in the arena.... » read more

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