Chip Industry’s Technical Paper Roundup: Feb. 28


New technical papers recently added to Semiconductor Engineering’s library: [table id=83 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us ... » read more

A RISC-V On-Chip Parallel Power Controller for HPC (ETH Zurich, U. of Bologna)


A new technical paper titled "ControlPULP: A RISC-V On-Chip Parallel Power Controller for Many-Core HPC Processors with FPGA-Based Hardware-In-The-Loop Power and Thermal Emulation" was published (preprint) by researchers at ETH Zurich and University of Bologna. Abstract (partial) "High-Performance Computing (HPC) processors are nowadays integrated Cyber-Physical Systems demanding complex an... » read more

Chip Industry’s Technical Paper Roundup: Feb. 14


New technical papers recently added to Semiconductor Engineering’s library: [table id=80 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us p... » read more

Hardware Virtualization Support in the RISC-V CVA6 Core


A new technical paper titled "CVA6 RISC-V Virtualization: Architecture, Microarchitecture, and Design Space Exploration" was written by researchers at Universidade do Minho (Portugal), University of Bologna, and ETH Zurich. Abstract Excerpt: "In this article, we describe our work on hardware virtualization support in the RISC-V CVA6 core. Our contribution is multifold and encompasses archite... » read more

RISC-V Pushes Into The Mainstream


RISC-V cores are beginning to show up in heterogeneous SoCs and packages, shifting from one-off standalone designs toward mainstream applications where they are used for everything from accelerators and extra processing cores to security applications. These changes are subtle but significant. They point to a growing acceptance that chips or chiplets based on an open-source instruction set ar... » read more

Chip Industry’s Technical Paper Roundup: Dec. 20


New technical papers added to Semiconductor Engineering’s library this week. [table id=71 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us po... » read more

Step Towards A 5G Software-Defined RAN Over A Fully Open-Source Parallel RISC-V Architecture (ETH Zurich)


A technical paper titled "Efficient Parallelization of 5G-PUSCH on a Scalable RISC-V Many-core Processor" was published by researchers at ETH Zurich. Abstract (partial) "5G Radio access network disaggregation and softwarization pose challenges in terms of computational performance to the processing units. At the physical layer level, the baseband processing computational effort is typicall... » read more

Heterogeneous Ultra-Low-Power RISC-V SoC Running Linux


A technical paper titled "HULK-V: a Heterogeneous Ultra-low-power Linux capable RISC-V SoC" was published by researchers at University of Bologna, University of Modena and Reggio Emilia, and ETH Zurich. "We present HULK-V: an open-source Heterogeneous Linux-capable RISC-V-based SoC coupling a 64-bit RISC-V processor with an 8-core Programmable Multi-Core Accelerator (PMCA), delivering up to... » read more

Chip Industry’s Technical Paper Roundup: Dec. 5


New technical papers added to Semiconductor Engineering’s library this week. [table id=67 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for u... » read more

An Arrangement of Chiplets That Outperforms A Grid Arrangement (ETH Zurich / U. of Bologna)


A research paper titled "HexaMesh: Scaling to Hundreds of Chiplets with an Optimized Chiplet Arrangement" was published by researchers at ETH Zurich and University of Bologna. Abstract: "2.5D integration is an important technique to tackle the growing cost of manufacturing chips in advanced technology nodes. This poses the challenge of providing high-performance inter-chiplet interconnects ... » read more

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