Technical Paper Roundup: November 21


New technical papers recently added to Semiconductor Engineering’s library: [table id=167 /] More Reading Technical Paper Library home » read more

A HIL Methodology For The SoC Development Flow


A technical paper titled “Virtual-Peripheral-in-the-Loop : A Hardware-in-the-Loop Strategy to Bridge the VP/RTL Design-Gap” was published by researchers at University of Bremen and German Research Center for Artificial Intelligence (DFKI). Abstract: "Virtual Prototypes act as an executable specification model, offering a unified behavior reference model for SW and HW engineers. However, b... » read more

Chip Industry’s Technical Paper Roundup: June 13


New technical papers recently added to Semiconductor Engineering’s library: [table id=109 /] Further Reading Technical Paper Home » read more

3DICs: Legalizer Techniques For Better Routing Quality, Fewer DRVs, And Reduced Total Slack With Negligible Runtime Impact


A technical paper titled “On Legalization of Die Bonding Bumps and Pads for 3D ICs” was published by researchers at the Georgia Institute of Technology, NVIDIA Corporation, and the University of Bremen. Abstract "State-of-the-art 3D IC Place-and-Route flows were designed with older technology nodes and aggressive bonding pitch assumptions. As a result, these flows fail to honor the widt... » read more

Week In Review: Design, Low Power


Cadence rolled out a slew of new products at this week’s CDNLive Silicon Valley, including: A new generative AI-powered tool for analog, mixed-signal, RF and photonics design; An extended collaboration with TSMC and Microsoft to advance giga-scale physical verification system in the cloud; A multi-year partnership with the San Francisco 49ers football organization, focused on sust... » read more

Chip Industry’s Technical Paper Roundup: Feb. 28


New technical papers recently added to Semiconductor Engineering’s library: [table id=83 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us ... » read more

Chip Industry’s Technical Paper Roundup: Feb. 21


New technical papers recently added to Semiconductor Engineering’s library: [table id=82 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us ... » read more

Automotive MCUs: Digital Twin of the LBIST Functionality


A new technical paper titled "A Novel LBIST Signature Computation Method for Automotive Microcontrollers using a Digital Twin" was written by researchers at Infineon Technologies, University of Bremen, and DFKI GmbH. Abstract "LBIST has been proven to be an effective measure for reaching functional safety goals for automotive microcontrollers. Due to a large variety of recent innovative fea... » read more

Chip Industry’s Technical Paper Roundup: Feb. 14


New technical papers recently added to Semiconductor Engineering’s library: [table id=80 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us p... » read more

Detecting Hardware Trojans In a RISC-V Core’s Post-Layout Phase


A new technical paper "Trojan-D2: Post-Layout Design and Detection of Stealthy Hardware Trojans - A RISC-V Case Study" was published by researchers at University of Bremen, DFKI GmbH, and the German Aerospace Center. Abstract: "With the exponential increase in the popularity of the RISC-V ecosystem, the security of this platform must be re-evaluated especially for mission-critical and IoT d... » read more

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