tag: University of Cambridge

CNN Hardware Architecture With Weights Generator Module That Alleviates Impact Of The Memory Wall
By Technical Paper Link - 01 Aug, 2023 - Comments: 0

A technical paper titled “Mitigating Memory Wall Effects in CNN Engines with On-the-Fly Weights Generation” was published by researchers at Samsung AI Center and University of Cambridge. Abstract: "The unprecedented accuracy of convolutional neural networks (CNNs) across a broad range of AI tasks has led to their widespread deployment in mobile and embedded settings. In a pursuit for high... » read more

Week In Review: Auto, Security, Pervasive Computing
By Liz Allan - 28 Jul, 2023 - Comments: 0

BMW, General Motors, Honda, Hyundai, Kia, Mercedes-Benz, and Stellantis will create an electric vehicle charging network, installing more than 30,000 high-powered DC charge points accessible to any cars that use Combined Charging System (CCS) or North American Charging Standard (NACS) connectors. Opening summer 2024, the network will leverage Plug & Charge technology and allow easy digital ... » read more

Chip Industry’s Technical Paper Roundup: July 5
By Liz Allan - 05 Jul, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=114 /] (more…) » read more

Week In Review: Design, Low Power
By Jesse Allen - 30 Jun, 2023 - Comments: 0

Keysight Technologies said it intends to acquire ESI Group for €913 million (~$998.6 million). ESI Group provides virtual prototyping solutions for the automotive and aerospace end markets that can create real-time digital twins to simulate a product's behavior during testing and real-life use. MLCommons announced the latest results from two MLPerf benchmark suites. One aims to measure the... » read more

Resistive Switching Memory Based on Thin-Film Design of Amorphous Hafnium Oxide (Cambridge & Others)
By Technical Paper Link - 28 Jun, 2023 - Comments: 0

A technical paper titled “Thin-film design of amorphous hafnium oxide nanocomposites enabling strong interfacial resistive switching uniformity” was published by researchers at University of Cambridge, Linköping University, Purdue University, University College London, Los Alamos National Laboratory, and University at Buffalo. Abstract: "A design concept of phase-separated amorphous nano... » read more

Chip Industry’s Technical Paper Roundup: May 2
By Linda Christensen - 02 May, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=95 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us p... » read more

Overview Of EV Charging Infrastructure, The Role of Power Electronics, And Charging Technologies
By Technical Paper Link - 26 Apr, 2023 - Comments: 0

A technical paper titled "Charging Infrastructure and Grid Integration for Electromobility" was published by researchers at Universidad de los Andes, University of Cambridge, Duke University, Universidad Técnica Federico Santa Maria, University of Toronto, TU Delft, and University of Florence. Abstract "Electric vehicle (EV) charging infrastructure will play a critical role in decarbonizat... » read more

Chip Industry’s Technical Paper Roundup: Apr. 25
By Linda Christensen - 25 Apr, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=94 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us ... » read more

Optimizing The Growth And Transfer Process of Graphene (Cambridge, RWTH Aachen)
By Technical Paper Link - 21 Apr, 2023 - Comments: 0

A technical paper titled "Putting High-Index Cu on the Map for High-Yield, Dry-Transferred CVD Graphene" was published by researchers at University of Cambridge, RWTH Aachen University, and National Institute for Materials Science. Abstract: "Reliable, clean transfer and interfacing of 2D material layers are technologically as important as their growth. Bringing both together remains a ch... » read more

Chip Industry’s Technical Paper Roundup: Mar. 21
By Linda Christensen - 21 Mar, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=88 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us ... » read more

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