Chip Industry Technical Paper Roundup: June 18


New technical papers added to Semiconductor Engineering’s library this week. [table id=234 /] More ReadingTechnical Paper Library home » read more

Chip Industry Week In Review


Samsung unveiled its latest 2nm and 4nm process nodes, plus its AI solutions during the Samsung Foundry Forum. The company also introduced an aggressive roadmap for the next few years that includes 3D-ICs with logic-on-logic, starting in 2025; custom HBM with built-in logic; backside power delivery on 2nm technology in 2027; and co-packaged optics. In presentations at the event, the company als... » read more

Probing Attacks Against Chiplets


A technical paper titled “Evaluating Vulnerability of Chiplet-Based Systems to Contactless Probing Techniques” was published by researchers at University of Massachusetts and Worcester Polytechnic Institute. Abstract: "Driven by a need for ever increasing chip performance and inclusion of innovative features, a growing number of semiconductor companies are opting for all-inclusive System-... » read more

Chip Industry’s Technical Paper Roundup: October 31


New technical papers added to Semiconductor Engineering’s library this week. [table id=159 /] More Reading Technical Paper Library home » read more

Measurement-Induced Quantum Information Phases On Up To 70 Superconducting Qubits (Google/Stanford)


A technical paper titled “Measurement-induced entanglement and teleportation on a noisy quantum processor” was published by researchers at Google Quantum AI, Google Research, Stanford University, University of Texas at Austin, Cornell University, University of Massachusetts, University of Connecticut, Auburn University, University of Technology Sydney, University of California, and Columbia... » read more

Week In Review: Design, Low Power


MLCommons debuted the latest results for the MLPerf Inference v3.0 and Mobile v3.0 benchmark suites, which measure the performance and power-efficiency of applying a trained machine learning model to new data in data center, edge, and mobile use cases. Overall, MLCommons said the results showed both power efficiency improvements and significant gains in performance in some benchmark tests. Seve... » read more

Chip Industry’s Technical Paper Roundup: Jan. 17


New technical papers added to Semiconductor Engineering’s library. [table id=74 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us posting li... » read more

High Dynamic Range Josephson Parametric Amplifiers (Google Quantum AI & Others)


A technical paper titled "Readout of a quantum processor with high dynamic range Josephson parametric amplifiers" was published by researchers at Google Quantum AI, University of Massachusetts, Auburn University and UCSB. "We demonstrate a resonant Josephson parametric amplifier that achieves the bandwidth performance of a matched JPA and a hundred-fold increase in saturation power," states ... » read more

Chip Industry’s Technical Paper Roundup: Oct 25


New technical papers added to Semiconductor Engineering’s library this week. [table id=59 /] » read more

Simulating the Groundstate and Dynamics of Quantum Critical Systems


A new technical paper titled "Simulating groundstate and dynamical quantum phase transitions on a superconducting quantum computer" was published by researchers at London Centre for Nanotechnology, University College London, University of Massachusetts, and Google Quantum AI. Abstract (partial) "The phenomena of quantum criticality underlie many novel collective phenomena found in condensed... » read more

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