Week In Review: Design, Low Power

By Jesse Allen - 17 Mar, 2023 - Comments: 0

The UK government published its National Quantum Strategy, which outlines the plan to invest £2.5 billion (~$3.0 billion) over the next 10 years into quantum technology, including computing, sensing, timing, imaging, and networking. "We will develop UK strengths across different hardware platforms, software, and components, and reinforce our capabilities throughout the supply chains. Although ... » read more

Chip Industry’s Technical Paper Roundup: Mar. 14

By Linda Christensen - 14 Mar, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=86 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us ... » read more

Ferroelectric HEMT Reconfigurable Transistor (U. of Michigan)

By Technical Paper Link - 10 Mar, 2023 - Comments: 0

A new technical paper titled "Fully epitaxial, monolithic ScAlN/AlGaN/GaN ferroelectric HEMT" was published by researchers at University of Michigan. “We can make our ferroelectric HEMT reconfigurable,” That means it can function as several devices, such as one amplifier working as several amplifiers that we can dynamically control. This allows us to reduce the circuit area and lower the... » read more

Week In Review: Manufacturing, Test

By Gregory Haley - 10 Mar, 2023 - Comments: 0

Global semiconductor sales decreased 5.2% month-to-month in January, according to a new report by the Semiconductor Industry Association (SIA). For the year, worldwide chip sales are down 18.5%, with the largest drop in sales by China at 31.6%, followed by the Asia Pacific region at 19.5%, and the Americas at 12.4%. Despite the contraction, companies are increasing investments in manufacturi... » read more

Week In Review: Auto, Security, Pervasive Computing

By Marie C. Baca - 24 Feb, 2023 - Comments: 0

Automotive Ambarella will use Samsung's 5nm process technology for its new CV3-AD685 automotive AI central domain controller, bringing "new levels of AI acceleration, system integration and power efficiency to ADAS and L2+ through L4 autonomous vehicles.” Renesas introduced four technologies for automotive communication gateway SoCs: (1) an architecture that dynamically changes... » read more

Chip Industry’s Technical Paper Roundup: Feb. 14

By Linda Christensen - 14 Feb, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=80 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us p... » read more

Nanoscale (5nm) Ferroelectric Semiconductor (University of Michigan)

By Technical Paper Link - 08 Feb, 2023 - Comments: 0

A new technical paper titled "Thickness scaling down to 5 nm of ferroelectric ScAlN on CMOS compatible molybdenum grown by molecular beam epitaxy" was published by researchers at University of Michigan, with DARPA funding. "Ferroelectric semiconductors stand out from others because they can sustain an electrical polarization, like the electric version of magnetism. But unlike a fridge magn... » read more

Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 13 Jan, 2023 - Comments: 0

The head of the U.S. National Transportation Safety Board (NTSB), Jennifer Homendy, voiced concern about the impact of heavier electric vehicles (EVs) will have in crashes with smaller cars with internal combustion engines (ICEs). Homendy compared the weight of the GMC Hummer and the Ford F-150’s EV to ICE version and found the EVs are 2,000 to 6,000 pounds heavier. The extra weight in EVs is... » read more

Chip Industry’s Technical Paper Roundup: Jan 3

By Linda Christensen - 03 Jan, 2023 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=72 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us ... » read more

Research Bits: Jan. 3

By Jesse Allen - 03 Jan, 2023 - Comments: 0

Printing electronics on curved surfaces Researchers from North Carolina State University have demonstrated a new technique for directly printing electronic circuits onto curved and corrugated surfaces. They have used the technique to create prototype “smart” contact lenses, pressure-sensitive latex gloves, and transparent electrodes. “There are many existing techniques for creating pr... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: University of Michigan

Week In Review: Design, Low Power

Chip Industry’s Technical Paper Roundup: Mar. 14

Ferroelectric HEMT Reconfigurable Transistor (U. of Michigan)

Week In Review: Manufacturing, Test

Week In Review: Auto, Security, Pervasive Computing

Chip Industry’s Technical Paper Roundup: Feb. 14

Nanoscale (5nm) Ferroelectric Semiconductor (University of Michigan)

Week In Review: Auto, Security, Pervasive Computing

Chip Industry’s Technical Paper Roundup: Jan 3

Research Bits: Jan. 3