The Week In Review: IoT


Analysis Amazon Web Services has 81 services for its customers in the Internet of Things, online video games, and other markets, Quentin Hardy notes in this analysis. AWS is competing with Microsoft Azure and the Google Cloud Platform in cloud computing services, which are now extending beyond data centers and servers to offer software and a multitude of online services. “As innovations like... » read more

The Week In Review: Manufacturing


Chipmakers TDK has agreed to acquire MEMS supplier InvenSense for cash at an acquisition price of $13.00 per share, for a total acquisition price of $1.3 billion. Cypress has begun volume shipments of microcontrollers (MCUs) based on its 40nm Embedded Charge-Trap (eCT) flash technology. The MCUs are made on a foundry basis at UMC. UMC’s technology is a 40nm low power (40LP) logic process.... » read more

The Week In Review: IoT


M&A TDK has agreed to acquire InvenSense for $13 a share, representing a total of $1.3 billion in cash. The transaction must be approved by InvenSense shareholders and regulatory agencies; TDK expects to wrap up the deal in the second quarter of its fiscal year ending in March of 2018 (the third quarter of the calendar year). Apple accounted for 40% of InvenSense’s revenue for the fiscal... » read more

The Week In Review: Design


M&A ARM reached further into the HPC space with its acquisition of Allinea Software, a provider of debug and performance analysis tools for HPC systems. Currently, 80% of the world's top 25 supercomputers use Allinea's tools, and ARM will continue supporting multiple processor architectures. Terms of the deal were not disclosed. PLDA Group is spinning out its QuickPlay C/C++ tool for ... » read more

EDA, IP Up 7%


EDA and IP growth increased to $2.094 billion in Q3, a 7% gain over the $1.958 billion reported for the same period in 2015, according to just released data from the Electronic System Design Alliance Market Statistics Service. All geographic regions reported growth last quarter. So did computer-aided engineering, the largest single category, which grew 5.0% to $666.7 million in Q3, up from $... » read more

Blog Review: Dec. 21


Mentor's Jeff Miller and ARM's Nandan Nayampally contend that it's easier than ever to design custom SoCs. Cadence's Paul McLellan provides a basic primer on silicon photonics, from a presentation by Gilles Lamant. The US Department of Transportation is considering requiring the inclusion of vehicle-to-vehicle communication in new cars, says Synopsys' Robert Vamosi. Applied's Shekar Kr... » read more

The Week In Review: Manufacturing


Chipmakers Samsung is mulling over a plan to reorganize its System LSI division, according to a report from BusinessKorea. As part of the move, Samsung is mulling over the idea to spin off its foundry unit, according to the report. A spokeswoman for Samsung’s foundry unit said: “We don't have any comments on this story.” GlobalFoundries has added eight new partners to its FDXcelera... » read more

The Week In Review: IoT


Tools Google this week updated its Internet of Things platform, releasing a Developer Preview for Android Things, enabling application developers to create IoT devices running on the mobile Android operating system. “We incorporated the feedback from Project Brillo to include familiar tools such as Android Studio, the Android Software Development Kit (SDK), Google Play Services, and Google C... » read more

The Week In Review: Design


IP eSilicon launched 14nm FinFET and 28nm planar HBM Gen2 Hardened PHY. It supports up to 256Gbytes/sec bandwidth with 8x128b channels at 2Gbps per I/O, and the integrated I/O supports up to 2Gbps DDR operation across a 4mm interposer channel. The PHY was developed on Samsung 14LPP and TSMC 28HPC technologies. Flex Logix designed a high-performance embedded FPGA IP core for TSMC 16FF+ and... » read more

Blog Review: Dec. 14


What are the technology options for 5nm? Cadence's Paul McLellan highlights an IEDM presentation by An Steegen of Imec. Synopsys' Michael Posner suggests we may not have to live with USB Type-C dongles for very long. Mentor's Craig Armenti presents some of the fundamental best practices and guidelines for rigid-flex PCB design. NXP's Joe Byrne digs into the Mirai botnet attack, arguing... » read more

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