The Week In Review: Manufacturing


Chipmakers Next month, GlobalFoundries will host a job fair in Portland, Ore., according to reports. The company hopes to hire former Intel workers. These are workers who lost their jobs as part of Intel's recent layoff. Anokiwave, a developer of chips for the mmWave market, has announced a foundry alliance with GlobalFoundries. GlobalFoundries will make so-called Silicon Core chips on a f... » read more

The Week In Review: Manufacturing


Fab tools and T&M Applied Materials and the Institute of Microelectronics (IME), a research institute under the Agency for Science, Technology and Research (A*STAR), have announced a five-year extension of their R&D collaboration at the Centre of Excellence in Advanced Packaging in Singapore. The organizations will expand the scope of their R&D collaboration to focus on advancing fan-out wafer... » read more

The Week In Review: Manufacturing


Fab tool and material vendors Applied Materials reported its results for the third quarter ended July 31. Net sales of $2.82 billion were up 15% sequentially and up 13% year over year. "AMAT reported impressive upside in July quarter and guided October quarter well ahead of expectations as the company is seeing sizable tailwinds across: 1) WFE uptick driven by foundry and NAND orders; 2) stron... » read more

The Week In Review: Manufacturing


Intel announced that the company’s former CEO and chairman, Andrew Grove, passed away. He was 79. Present at Intel’s 1968 founding with Robert Noyce and Gordon Moore, Grove became Intel’s president in 1979 and CEO in 1987. He served as chairman from 1997 to 2005. “We are deeply saddened by the passing of former Intel Chairman and CEO Andy Grove,” said Intel CEO Brian Krzanich, in a st... » read more

Inside The SRC


Semiconductor Engineering sat down to talk with Ken Hansen, the new president and chief executive of the Semiconductor Research Corp. (SRC), a U.S.-based technology research consortium. Prior to joining the SRC in May, Hansen was vice president and chief technology officer at Freescale. What follows are excerpts of that conversation. SE: My impression is that the SRC allocates funding for va... » read more

The Week In Review: Manufacturing


Lam Research’s proposed move to acquire KLA-Tencor is still generating a buzz in the industry. One executive from Lam has explained the reason for the deal. Meanwhile, analysts are also weighing in. “We believe the deal itself is a positive one for Lam as it supplements its leading etch position with the market share leader in process control with significant accretion and earnings leverage... » read more

The Week In Review: Manufacturing


Looking to propel the next wave of OLED displays, Applied Materials has rolled out two new systems. The tools enable the volume production of OLED displays for both mobile products and TVs. In addition, Applied Materials has shipped an Applied TopMet roll-to-roll metal deposition system to Jindal Poly Films, a leader in PET and BOPP films for flexible packaging and labeling applications. In... » read more

The Week In Review: Manufacturing


In a much-anticipated deal, IBM is close to selling its chip unit to GlobalFoundries, according to Bloomberg. GlobalFoundries wants IBM’s engineers and the IP, and not the fabs. Intel lost its challenge against a record 1.06 billion euro ($1.44 billion) European Union fine handed down five years ago, according to Reuters. The EU said Intel tried to thwart AMD by giving rebates to PC makers... » read more

MEMS Foundries Play Waiting Game


By Mark LaPedus For years, the foundries in the microelectromechanical systems (MEMS) business have been patiently waiting for the MEMS integrated device manufacturers (IDMs) to outsource some or all of their production. The MEMS foundries are still waiting for that development. Because MEMS are custom devices tuned to a proprietary process and toolset, IDMs still prefer to use their own f... » read more

Good Times For Analog Designers


By Ann Steffora Mutschler For a number of technological reasons, analog/mixed-signal design and low-power design are converging, and with that comes both challenges and opportunities. As far as challenges go, process variations at 14nm, 20nm and even 28nm have increased significantly to include DFM impacts such as layout-delay effects. On the digital side, those process changes affect... » read more