tag: EMIB

Chiplets: Deep Dive Into Designing, Manufacturing, And Testing
By The SE Staff - 07 Aug, 2023 - Comments: 0

Chiplets are a disruptive technology. They change the way chips are designed, manufactured, tested, packaged, as well as the underlying business relationships and fundamentals. But they also open the door to vast new opportunities for existing chipmakers and startups to create highly customized components and systems for specific use cases and market segments. This LEGO-like approach sounds ... » read more

Is UCIe Really Universal?
By Brian Bailey - 22 Nov, 2022 - Comments: 3

Chiplets are rapidly becoming the means to overcome the slowing of Moore's Law, but whether one interface is capable of joining them all together isn't clear yet. The Universal Chiplet Interconnect Express (UCIe) believes it will work, but some in the industry remain unconvinced. At least part of the problem is that interconnect standards are never truly finished. Even today, the protocols tha... » read more

Chiplets Enter The Supercomputer Race
By Mark LaPedus - 17 Mar, 2022 - Comments: 0

Several entities from various nations are racing each other to deliver and deploy chiplet-based exascale supercomputers, a new class of systems that are 1,000x faster than today’s supercomputers. The latest exascale supercomputer CPU and GPU designs mix and match complex dies in advanced packages, adding a new level of flexibility and customization for supercomputers. For years, various na... » read more

New Approaches For Processor Architectures
By Ed Sperling - 26 Aug, 2021 - Comments: 0

Processor vendors are starting to emphasize microarchitectural improvements and data movement over process node scaling, setting the stage for much bigger performance gains in devices that narrowly target what end users are trying to accomplish. The changes are a recognition that domain specificity, and the ability to adjust or adapt designs to unique workloads, are now the best way to impro... » read more

Inside Intel’s Ambitious Roadmap
By Mark LaPedus and Ed Sperling - 23 Aug, 2021 - Comments: 2

Ann Kelleher, senior vice president and general manager of Technology Development at Intel, sat down with Semiconductor Engineering to talk about the company’s new logic roadmap, as well as lithography, packaging, and process technology. What follows are excerpts of that discussion. SE: Intel recently disclosed its new logic roadmap. Beyond Intel 3, the company is working on Intel 20A. Wit... » read more

Designs Beyond The Reticle Limit
By Brian Bailey - 12 Nov, 2020 - Comments: 0

Designs continue to grow in size and complexity, but today they are reaching both physical and economic challenges. These challenges are causing a reversal of the integration trend that has provided much of the performance and power gains over the past couple of decades. The industry, far from giving up, is exploring new ways to enable designs to go beyond the reticle size, which is around 8... » read more

Rethinking Competitive One Upmanship Among Foundries
By Ed Sperling - 03 Aug, 2020 - Comments: 2

The winner in the foundry business used to be determined by who got to the most advanced process node first. For the most part that benchmark no longer works. Unlike in the past, when all of the foundries and IDMs competed using basically the same process, each foundry has gone its own route. This is primarily due to the divergence of end markets, and the realization that as costs increase, ... » read more

eFPGAs Vs. FPGA Chiplets
By Ed Sperling - 22 Jul, 2020 - Comments: 0

Embedded FPGAs are a totally different concept from discrete FPGA chiplets, and that is reflected in size, cost, power and performance. Geoff Tate, CEO of Flex Logix, talks about which applications are best for each, how each maximizes power and performance, and why choices will vary greatly by application. Related eFPGA Knowledge Center FPGA Knowledge Center Increasing EFPGA Densit... » read more

What’s The Best Advanced Packaging Option?
By Mark LaPedus - 17 Oct, 2019 - Comments: 2

As traditional chip designs become more unwieldy and expensive at each node, many IC vendors are exploring or pursuing alternative approaches using advanced packaging. The problem is there are too many advanced packaging options on the table already, and the list continues to grow. Moreover, each option has several tradeoffs and challenges, and all of them are still relatively expensive. ... » read more

Return Of The Organic Interposer
By Ed Sperling - 06 Aug, 2018 - Comments: 2

Organic interposers are resurfacing as an option in advanced packaging, several years after they were first proposed as a means of reducing costs in 2.5D multi-die configurations. There are several reasons why there is a renewed interest in this technology: More companies are pushing up against the limits of Moore's Law, where the cost of continuing to shrinking features is exorbitant. ... » read more

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