New Transistor Types Vs. Packaging


Plans are being formulated for the rollout of multiple types of gate-all-around FETs and literally dozens of advanced packaging options. The question now is which ones will achieve critical mass, because there aren't enough chips in the world to support all of them profitably. FinFETs, which were first introduced by Intel at 22nm, are running out of steam. While they will survive 10/7nm, and... » read more

CEO Outlook On Chip Industry


Semiconductor Engineering sat down with Wally Rhines, president and CEO of Mentor, a Siemens Business; Simon Segars, CEO of Arm; Grant Pierce, CEO of Sonics; and Dean Drako, CEO of IC Manage. What follows are excerpts of that conversation. L-R: Dean Drako, Grant Pierce, Wally Rhines, Simon Segars. Photo: Paul Cohen/ESD Alliance SE: What are the big changes ahead, and where do you see th... » read more

Preparing For AI


Suppose an autonomous car is coming up an on-ramp onto a bridge. The ramp is fine, but the bridge is icy, and there’s an overturned bus full of children blocking several lanes. Children are evacuating through the windows and milling around on the pavement. There isn’t time to stop, even with the better-than-human reaction time an autonomous car might have. Swerving to one side might send... » read more

The Great Chip Shakeup


Facebook, Alibaba, Google, Apple and Samsung are all designing their own chips. So are Cisco and Huawei. So what exactly does this mean for big chipmakers and the semiconductor ecosystem? While your first impulse might be to draw a straight line between Qualcomm's decision to cut 1,500 jobs and reports about giant systems companies developing chips in-house, it's not clear there is any corre... » read more

The Week in Review: IoT


Cybersecurity The U.S. and U.K. governments collaborated on an unprecedented message on Monday, together warning that Russian cyberattacks may extend beyond government and private organizations to individual homes and offices. The attacks may focus on Internet of Things devices, said Rob Joyce, the cybersecurity coordinator for the National Security Council, who soon after resigned from the Wh... » read more

Applying Machine Learning To Chips


The race is on to figure out how to apply analytics, data mining and machine learning across a wide swath of market segments and applications, and nowhere is this more evident than in semiconductor design and manufacturing. The key with ML/DL/AI is understanding how devices react to real events and stimuli, and how future devices can be optimized. That requires sifting through an expandi... » read more

Exponentials At The Edge


The age of portable communication has set off a scramble for devices that can achieve almost anything a desktop computer could handle even five years ago. But this is just the beginning. The big breakthrough with mobile devices was the ability to combine voice calls, text and eventually e-mail, providing the rudiments of a mobile office-all on a single charge of a battery that was light enou... » read more

Privacy Is In Retreat


It was always a given that when you were online, you're in public. The deceptive piece is that your online activities can appear very distant from your physical location. You might be shopping from the comfort and seeming privacy of your living room, or texting on your smart phone before you get out of bed. This created a lot of buzz initially, but over the past year or so the level of paran... » read more

Preparing For Bigger Changes Ahead


The semiconductor industry has undergone a fundamental shift over the past year, and it's one that will redefine chipmaking over the next decade or more. While the focus is still on building the fastest, lowest-power devices, whether that's by shrinking features or packaging them into blazing-fast 2.5D or fan-out configurations, these devices are being customized for specific use cases much ... » read more

Hyperscaling The Data Center


Enterprise data centers increasingly will look and behave more like slimmed-down versions of hyperscale data centers as chipmakers and other suppliers adapt systems developed for their biggest customers to in-house IT faciilities. The new chips and infrastructure that will serve as building blocks in these facilities will be more power-efficient, make better use of space and generate less he... » read more

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