The Week In Review: Manufacturing

Chipmakers At upcoming the 2016 IEEE International Electron Devices Meeting (IEDM) in San Francisco, TSMC will square off against the alliance of IBM, GlobalFoundries and Samsung at 7nm. IEDM will take place Dec. 3-7, 2016. TSMC will present a paper on 7nm finFET technology. Using 193nm immersion and multi-patterning, the 7nm technology features more than three times the gate density and ei... » read more

What Happened To Inverse Lithography?

Nearly 10 years ago, the industry rolled out a potentially disruptive technique called inverse lithography technology (ILT). But ILT was ahead of its time, causing the industry to push out the technology and relegate it to niche-oriented applications. Today, though, ILT is getting new attention as the semiconductor industry pushes toward 7nm, and perhaps beyond. ILT is not a next-generation ... » read more

Application Of Overlay Modeling And Control With Zernike Polynomials In An HVM Environment

By JawWuk Ju, MinGyu Kim and JuHan Lee of SK Hynix; Jeremy Nabeth, John C. Robinson and Bill Pierson of KLA-Tencor; and Sanghuck Jeon and Hoyoung Heo of KLA-Tencor Korea. Abstract Shrinking technology nodes and smaller process margins require improved photolithography overlay control. Generally, overlay measurement results are modeled with Cartesian polynomial functions for both intra-field... » read more

The Week In Review: Manufacturing

Fab tools and materials After a series of delays due to regulatory issues, Lam Research and KLA-Tencor have agreed to terminate their proposed merger agreement. Amid a possible proxy battle, Kulicke & Soffa Industries has named Fusen Chen as president and chief executive, effective Oct. 31. He was also elected to the board of K&S. Jonathan Chou, chief financial officer and interim CEO, w... » read more

Lam, KLA-Tencor Scrap Merger

After a series of delays due to regulatory issues, Lam Research and KLA-Tencor have agreed to terminate their proposed merger agreement. Last year, Lam entered into a definitive agreement to acquire KLA-Tencor for about $10.6 billion. Lam’s proposed and blockbuster move to acquire KLA-Tencor would supposedly create the world’s second largest fab tool maker, behind Applied Materials. O... » read more

5 Takeaways From BACUS

As usual, the recent SPIE Photomask Technology Conference, sometimes called BACUS, was a busy event. The event, which took place in San Jose, Calif., featured presentations on the usual subjects in the photomask sector. There were presentations on mask writers, inspection, metrology, repair and cleaning. And, of course, the papers included masks based on extreme ultraviolet (EUV) lithograp... » read more

Mask Maker Worries Grow

Photomasks are becoming more complex and expensive at each node, thereby creating a number of challenges on several fronts. For one thing, the features on the [getkc id="265" kc_name="photomask"] are becoming smaller and more complex at each node. Second, the number of masks per mask-set are increasing as a result of multiple patterning. Third, it costs more to build and equip a new mask fab... » read more

Device Overlay Method For High-Volume Manufacturing

By Honggoo Lee, Sangjun Hana and Youngsik Kima of SK Hynix; Myoungsoo Kim, of the Department of Semiconductor System Engineering at Korea University; Hoyoung Heo, Sanghuck Jeon and DongSub Choi, KLA-Tencor Korea; and Jeremy Nabeth, Irina Brinster, Bill Pierson, and John C. Robinson of KLA-Tencor. Abstract Advancing technology nodes with smaller process margins require improved photolithogra... » read more

Mask Maker Worries Grow

Leading-edge photomask makers face a multitude of challenges as they migrate from the 14nm node and beyond. Mask making is becoming more challenging and expensive at each node on at least two fronts. On one front, mask makers must continue to invest in the development of traditional optical masks at advanced nodes. On another front, several photomask vendors are preparing for the possible ra... » read more

Optical Metrology Solutions For 10nm Films Process Control Challenges

By Sridhar Mahendrakar (a), Alok Vaida (a), Kartik Venkataraman (b), Michael Lenahan (a), Steven Seipp (a), Fang Fanga (a), Shweta Saxena (a), Dawei Hu (b), Nam Hee Yoon (b), Da Song (b), Janay Camp (b), Zhou Ren (b). [a: GlobalFoundries; b:KLA-Tencor] Controlling thickness and composition of gate stack layers in logic and memory devices is critical to ensure transistor performance meets r... » read more

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