Tech Talk: 2.5D Issues

Bill Isaacson, director of ASIC marketing at eSilicon, about how viable this packaging approach is, organic vs. inorganic interposers, where the problems are, thermal coupling, interposer cost, and what will change over the next couple years. [youtube vid=t6KUnC-oU5g] » read more

Architecturally Optimizing Memory Bandwidth

Making sure that an SoC’s [getkc id="22" kc_name="memory"] bandwidth is optimized is a crucial part of the design process today given its significance toward overall system performance. There are many ways to approach this issue, and all of them can have a direct bearing on the competitiveness of a chip in terms of both power and performance. So where should you start? “Number one, c... » read more