Fluid Dispensing For Packaging Today’s Devices


Fluid dispensing systems are evolving in order to address the challenges that system-in-package (SiP) and micromechanical systems (MEMS) packages face, especially in regard to tight geometries and assembly processes. These packages, used in smartphones, have become more miniaturized, and as a result, have created added value in the market. However, they include a variety of small dies or dev... » read more

Research Bits: Nov. 28


Switchable photodetector and neuromorphic vision sensor Researchers from the Institute of Metal Research at the Chinese Academy of Sciences built a device that can be switched between being a photodetector and neuromorphic vision sensor by adjusting the operating voltage. The trench-bridged GaN/Ga2O3/GaN heterojunction array device exhibits volatile and non-volatile photocurrents at low and hi... » read more

Using Atomic Vacancies In Silicon Carbide To Measure The Stability And Quality Of Acoustic Resonators


A technical paper titled “Spin-acoustic control of silicon vacancies in 4H silicon carbide” was published by researchers at Harvard University and Purdue University. Abstract: "Bulk acoustic resonators can be fabricated on the same substrate as other components and can operate at various frequencies with high quality factors. Mechanical dynamic metrology of these devices is challenging as... » read more

CMOS Compatible Materials With Quantum Defects Suitable For Room Temperature Applications


A technical paper titled “Thin Film Materials for Room Temperature Quantum Applications” was published by researchers at Marquette University. Abstract: "Thin films with quantum defects are emerging as a potential platform for quantum applications. Quantum defects in some thin films arise due to structural imperfections, such as vacancies or impurities. These defects generate localized el... » read more

Nine Essential Criteria To Achieve A Successful Bonding Process


A photosensitive permanent bonding material enables the creation of high-quality permanent bonds between dissimilar materials used in the creation of MEMS and sensors. Having a thorough understanding of the materials and product performance is crucial to the success of the end application. In this article, we explore nine criteria used to evaluate a polymeric photosensitive permanent bonding ma... » read more

A 3D MEMS Coaxial Socket Overcomes Challenges In Semiconductor Package Chip Testing


A technical paper titled "Fabrication and Characterization of Three-Dimensional Microelectromechanical System Coaxial Socket Device for Semiconductor Package Testing" was published by researchers at Yonsei University and Protec MEMS Technology. Abstract: "With the continuous reduction in size and increase in density of semiconductor devices, there is a growing demand for contact solutions tha... » read more

Developing A Customized RISC-V Core For MEMS Sensors


We recently described how Codasip Labs is working with the NimbleAI project to push the boundaries of neuromorphic vision. Let’s talk about another cool project. This project is focused on another sense, hearing. We will use our unique Codasip Studio design toolset to develop a customized RISC-V core for MEMS (micro-electro-mechanical system) sensors. Again, technology is inspired by bio... » read more

MEMS Device Cleaning


Cleaning is an essential process for MEMS applications in order to prevent device failure due to foreign material. Small particles located on MEMS devices are significant causes of device rejection and yield loss. These issues affect inertial devices, such as accelerometers and gyroscopes, as well as microphones, laser bars and other MEMS devices. Click here to download. » read more

MEMS & Sensors Market Forecast: Impact Of Semiconductor Industry Slowdown


Of all technologies, MEMS and sensors stand out for their far-reaching promise to improve lives across segments such as Internet of Things (IoT), wearables, smart home, digital health, precision agriculture, autonomous vehicles, robotics, and environmental monitoring. Little wonder, then, that the growth of the MEMS and sensor design and manufacturing industry is among the hottest topics at ... » read more

Research Bits: April 4


Wet-like plasma etching Researchers from Nagoya University and Hitachi developed a new etch method called wet-like plasma etching that combines the selectivity of wet etching with the controllability of dry etching. The researchers say the technique will make it possible to etch complex structures such as metal carbides consisting of titanium (Ti) and aluminum (Al), such as TiC or TiAlC, wh... » read more

← Older posts