7nm Lithography Choices

Chipmakers are ramping up their 16nm/14nm logic processes, with 10nm expected to move into early production later this year. Barring a major breakthrough in lithography, chipmakers are using today’s 193nm immersion and multiple patterning for both 16/14nm and 10nm. Now, chipmakers are focusing on the lithography options for 7nm. For this, they hope to use a combination of two technologies ... » read more

Searching For Rare Earths

The semiconductor industry is pre-occupied with several and expensive technologies at once. One the device side, the industry is looking at new chip architectures, such as 3D NAND, finFETs and stacked die. On the manufacturing front, there is 450mm technology, next-generation lithography (NGL) and new materials. And that’s just the tip of the iceberg. Another technology that deserve... » read more

Billions And Billions Invested

Over the years, next-generation [getkc id="80" kc_name="lithography"] (NGL) has suffered various setbacks and delays. But until recently, the industry basically shrugged its shoulders and expressed relatively little anxiety about the NGL delays. After all, optical lithography was doing the job in the fab and NGL would eventually materialize. Today, however, the mood is different. In fact, th... » read more

EUV Reaches A Crossroads

[gettech id="31045" comment="EUV"] (EUV) [getkc id="80" comment="lithography"] is at a crossroads. 2014 represents a critical year for the technology. In fact, it may answer a pressing question about EUV: Does it work or not? It’s too early to make that determination right now, but there are more uncertainties than ever for the oft-delayed technology. Originally aimed for the 65nm node in... » read more

Waiting For Next-Generation Lithography

Nearly 30 years ago, optical lithography was supposed to hit the wall at the magical 1 micron barrier, prompting the need for a new patterning technology such as direct-write electron beam and X-ray lithography. At that time, however, the industry was able to push optical lithography for volume chip production at the 1-micron node and beyond. This, in turn, effectively killed direct-write e-... » read more

Litho Roadmap Remains Cloudy

By Mark LaPedus For some time, the lithography roadmap has been cloudy. Optical lithography has extended much further than expected. And delays with the various next-generation lithography (NGL) technologies have forced the industry to re-write the roadmap on multiple occasions. Today, there is more uncertainty than ever in lithography. Until recently, for example, leading-edge logic chipma... » read more

Design-For-DSA Industry Begins To Assemble

By Mark LaPedus The industry is aggressively pursuing directed self-assembly (DSA) as an alternative patterning technology for future chip designs. DSA, which enables fine pitches through the use of block copolymers, is in the R&D pilot line stage today. The fab tools, process flows and materials are basically ready, but there are still several challenges to bring the technology from th... » read more