Implementing High-Density-Advanced Packaging for OSATs And Foundries


HDAP design and verification require cooperation and collaboration between design houses, OSATs, foundries, and EDA vendors. By using common tools that have the integration and functionality needed to operate in both the IC and packaging domains and by developing and deploying process optimized design-kits such as ADK’s and PDKs, OSATs, foundries, and their customers can achieve design, fabri... » read more

Security Issues Up With Heterogeneity


The race toward heterogeneous designs is raising new security concerns across the semiconductor supply chain. There is more IP to track, more potential for unexpected interactions, and many more ways to steal data or IP. Security is a difficult problem no matter what kind of chip is involved, and it has been getting worse as more devices, machines and systems are connected to the Internet. B... » read more

Implementing High-Density-Advanced Packaging For OSATs And Foundries


HDAP design and verification require cooperation and collaboration between design houses, OSATs, foundries, and EDA vendors. By using common tools that have the integration and functionality needed to operate in both the IC and packaging domains and by developing and deploying process optimized design-kits such as ADK’s and PDKs, OSATs, foundries, and their customers can achieve design, fabri... » read more

Finally, Realizing The Full Benefits Of Parallel Site-To-Site (S2S) Testing


A very common and well-known practice by manufacturers during the IC test process is to test as many of the device die or packaged parts as possible in parallel (i.e. sites) during wafer sort and final test in order to increase test time efficiency and lower overall test costs. The constraints that typically restrict how many test sites can be used at any given time are the design I/O and capac... » read more

Wirebond Technology Rolls On


Several years ago, many predicted the demise of an older interconnect packaging technology called wire bonding, prompting the need for more advanced packaging types. Those predictions were wrong. The semiconductor industry today uses several advanced packaging types, but wire bonding has been reinvented over the years and remains the workhorse in packaging. For example, Advanced Semiconducto... » read more

Electroplating IC Packages


The electrochemical deposition (ECD) equipment market for IC packaging is heating up as 2.5D, 3D and fan-out technologies begin to ramp. [getentity id="22817" e_name="Applied Materials"]  recently rolled out an ECD system for IC packaging. In addition, Lam Research, TEL and others compete in the growing but competitive ECD equipment market for packaging. ECD—sometimes referred to as pl... » read more

2.5D Adds Test Challenges


OSATs and ATE vendors are making progress in determining what works and what doesn't in 2.5D packaging, expanding their knowledge base as this evolves into a mainstream technology. A [getkc id="82" kc_name="2.5D"] package generally includes an ASIC connected to a stack of memory chips—usually high-bandwidth memory—using an [getkc id="204" kc_name="interposer"] or some type of silicon bri... » read more

Crossing The Chasm: Uniting SoC And Package Verification


Wafer-level packaging enables higher form factor and improved performance compared to traditional SoC designs. However, to ensure an acceptable yield and performance, EDA companies, OSAT companies, and foundries must collaborate to establish consistent and unified automated WLP design and physical verification flows, while introducing minimum disruption to already-existing package design flows.... » read more

What Next For OSATs


Semiconductor Engineering sat down to discuss IC-packaging and business trends with Tien Wu, chief operating officer at Taiwan’s Advanced Semiconductor Engineering ([getentity id="22930" comment="ASE"]), the world’s largest outsourced semiconductor assembly and test (OSAT) vendor. What follows are excerpts of that conversation. SE: What’s the outlook for the IC industry in 2017? Wu:... » read more

OSAT Biz: Growth And Challenges


Amid a challenging business environment, the outsourced semiconductor assembly and test (OSAT) industry is projected to see steady to strong growth in a number of packaging segments this year. Right now, the [getkc id="83" kc_name="OSATs"]—which provide third-party IC-packaging and test services—are seeing brisk demand for both legacy and advanced chip packages. In addition, IDMs continu... » read more

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