2.5D Adds Test Challenges


OSATs and ATE vendors are making progress in determining what works and what doesn't in 2.5D packaging, expanding their knowledge base as this evolves into a mainstream technology. A [getkc id="82" kc_name="2.5D"] package generally includes an ASIC connected to a stack of memory chips—usually high-bandwidth memory—using an [getkc id="204" kc_name="interposer"] or some type of silicon bri... » read more

Crossing The Chasm: Uniting SoC And Package Verification


Wafer-level packaging enables higher form factor and improved performance compared to traditional SoC designs. However, to ensure an acceptable yield and performance, EDA companies, OSAT companies, and foundries must collaborate to establish consistent and unified automated WLP design and physical verification flows, while introducing minimum disruption to already-existing package design flows.... » read more

What Next For OSATs


Semiconductor Engineering sat down to discuss IC-packaging and business trends with Tien Wu, chief operating officer at Taiwan’s Advanced Semiconductor Engineering ([getentity id="22930" comment="ASE"]), the world’s largest outsourced semiconductor assembly and test (OSAT) vendor. What follows are excerpts of that conversation. SE: What’s the outlook for the IC industry in 2017? Wu:... » read more

OSAT Biz: Growth And Challenges


Amid a challenging business environment, the outsourced semiconductor assembly and test (OSAT) industry is projected to see steady to strong growth in a number of packaging segments this year. Right now, the [getkc id="83" kc_name="OSATs"]—which provide third-party IC-packaging and test services—are seeing brisk demand for both legacy and advanced chip packages. In addition, IDMs continu... » read more

Betting On Wafer-Level Fan-Outs


Advanced packaging is starting to gain traction as a commercially viable business model rather than just one more possible option, propelled by the technical difficulties in routing signals at 10nm and 7nm and skyrocketing costs of device scaling on a single die. The inclusion of a [getkc id="202" kc_name="fan-out"] package for logic in Apple's iPhone 7, based on TSMC's Integrated Fan-Out (... » read more

Changing Direction In Chip Design


Andrzej Strojwas, chief technologist at PDF Solutions and professor of electrical and computer engineering at Carnegie Mellon University—and the winner of this year's Phil Kaufman Award for distinguished contributions to EDA—sat down with Semiconductor Engineering to talk about device scaling, why the semiconductor industry will begin to fragment around new architectures and packaging, and ... » read more

Advanced Packaging Requires Better Yield


Whether Moore's Laws truly ends, or whether the semiconductor industry reaches into the Angstrom world after 3nm—the semiconductor industry dislikes fractions—advanced packaging increasingly will dominate semiconductor designs. Apple already is on board with its iPhone 7, using TSMC's fan-out approach. And all of the major foundries and OSATs are lining up with a long list of capabilitie... » read more

Packaging Wars Begin


The advanced IC-packaging market is turning into a high-stakes competitive battleground, as vendors ramp up the next wave of [getkc id="82" kc_name="2.5D"]/[getkc id="42" kc_name="3D"] technologies, high-density fan-out packages and others. At one time, the outsourced semiconductor assembly and test ([getkc id="83" comment="OSAT"]) vendors dominated and handled the chip-packaging requirement... » read more

Grappling With Manufacturing Data


As complexity goes up with each new process node, so does the amount of data that is generated, from initial GDSII to photomasks, manufacturing, yield and post-silicon validation. But what happens to that data, and what gets shared, remain a point of contention among companies across the semiconductor ecosystem. The problem is that to speed up the entire design through manufacturing process,... » read more

China’s Capital Equipment Market To Boom


The worldwide semiconductor capital equipment market declined 3% last year to $36.53 billion from 2014’s $37.5 billion, but inside China the story was significantly different. Capital equipment sales there increased by 12% in 2015, to $4.9 billion. In fact, only Japan showed a higher growth rate last year, of 31%, according to figures from [getentity id="22821" comment="SEMI"] and the Semi... » read more

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