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Ann Mutschler

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Ann Mutschler is senior executive editor at Semiconductor Engineering.

Author's Latest Posts

Balancing Training, Quantization, And Hardware Integration In NPUs
By Ann Mutschler - 26 Jan, 2026 - Comments: 0

Experts At The Table: AI/ML is driving a steep ramp in neural processing unit (NPU) design activity for everything from data centers to edge devices such as PCs and smartphones. Semiconductor Engineering sat down to discuss this with Jason Lawley, director of product marketing, AI IP at Cadence; Sharad Chole, chief scientist and co-founder at Expedera; Steve Roddy, chief marketing officer at Qu... » read more

Addressing Critical Tradeoffs In NPU Design
By Ann Mutschler - 21 Jan, 2026 - Comments: 1

Experts At The Table: AI/ML are driving a steep ramp in neural processing unit (NPU) design activity for everything from data centers to edge devices such as PCs and smartphones. Semiconductor Engineering sat down with Jason Lawley, director of product marketing, AI IP at Cadence; Sharad Chole, chief scientist and co-founder at Expedera; Steve Roddy, chief marketing officer at Quadric; Steven W... » read more

How And Why To Optimize NPUs
By Ann Mutschler - 15 Jan, 2026 - Comments: 0

Experts At The Table: AI/ML are driving a steep ramp in neural processing unit (NPU) design activity for everything from data centers to edge devices such as PCs and smartphones.  Semiconductor Engineering sat down with Jason Lawley, director of product marketing, AI IP at Cadence; Sharad Chole, chief scientist and co-founder at Expedera; Steve Roddy, chief marketing officer at Quadric; Steven... » read more

Automotive Outlook: 2026
By Ann Mutschler - 08 Jan, 2026 - Comments: 0

The automotive industry stands at a crossroads entering 2026, facing a complex interplay of global tariffs, evolving electric vehicle (EV) dynamics, and the infusion of AI into just about everything. As manufacturers and suppliers navigate recent financing shifts and regulatory changes, they also must address consumer concerns over EV affordability and range, OEM concerns over when to develo... » read more

When To Move To Multi-Die Assemblies
By Ann Mutschler - 23 Dec, 2025 - Comments: 0

As chip designs become larger and more complex, especially for AI and high-performance computing workloads, it's often not feasible to fit everything onto a single planar die. But determining when to move to a multi-die assembly isn't always straightforward. Multi-die approaches have some well-documented benefits. They allow designers to split functions across different dies, which can impro... » read more

AI Workloads at the Edge: Ensuring Performance, Privacy, and Security
By Ann Mutschler - 17 Dec, 2025 - Comments: 0

Experts At The Table: Semiconductor Engineering gathered a group of experts to discuss why some AI workloads are better suited for on-device processing to achieve consistent performance, avoid network connectivity issues, reduce cloud computing costs, and ensure privacy. The panel included Frank Ferro, group director in the Silicon Solutions Group at Cadence; Eduardo Montanez, vice president a... » read more

AI Buildout Makes HPC Simulation More Challenging
By Ann Mutschler - 11 Dec, 2025 - Comments: 0

Simulations of semiconductors and systems are becoming bigger, more complex, and increasingly necessary, mirroring everything that is happening to the hardware itself — particularly in AI data centers. The move beyond monolithic chips to multi-die assemblies now requires solving some thorny multi-physics challenges, such as thermal and power delivery, which are increasingly difficult to mo... » read more

Harnessing Silicon Lifecycle Management For Chip Security
By Ann Mutschler - 04 Dec, 2025 - Comments: 0

Silicon lifecycle management is starting to be used in ways that extend well beyond its original mission of ensuring a chip functions to spec throughout its expected lifetime. While tracking aging effects and component failures are still important, the technology also is being deployed to proactively monitor, authenticate, and respond to potential threats in real-time. In fact, not applying ... » read more

Optimizing AI Workloads For Edge Computing
By Ann Mutschler - 03 Dec, 2025 - Comments: 0

Experts At The Table: Semiconductor Engineering gathered a group of experts to discuss how some AI workloads are better suited for on-device processing to achieve consistent performance, avoid network connectivity issues, reduce cloud computing costs, and ensure privacy. The panel included Frank Ferro, group director in the Silicon Solutions Group at Cadence; Eduardo Montanez, vice president an... » read more

The Real-World Impact Of Silicon Lifecycle Management On Chip Architectures
By Ann Mutschler - 25 Nov, 2025 - Comments: 0

Silicon lifecycle management (SLM) is transforming chip architectures, empowering designers to build smarter, more resilient, and secure semiconductor devices by leveraging data from manufacturing to end of life in the field. That data can be used to improve future designs, reduce margin, and continuously optimize performance and power efficiency throughout a chip's lifetime. Moreover, under... » read more

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