Secure Data Sharing To Promote Collaboration
By Christophe Begue - 12 Aug, 2025 - Comments: 0

As the semiconductor industry evolves toward a $1-trillion revenue milestone by 2030, fueled largely by AI applications, its challenges have magnified—a globalized supply chain, increasingly complex chip architectures and mounting cybersecurity demands. Assessing how data collaboration occurs within the ecosystem is essential, while secure data collaboration facilitated by cutting-edge pla... » read more

Metrology Under Pressure: Detecting Defects in Fine-Pitch Hybrid Bonding
By Gregory Haley - 12 Aug, 2025 - Comments: 1

As advanced packaging pushes deeper into the sub-10µm realm, traditional inspection and metrology systems are being forced to evolve with it. Hybrid bonding, a critical enabler of vertical integration and 3D system performance, relies on exceptionally tight alignment and defect-free bonding surfaces. But as interconnect pitch shrinks, even nanometer-scale variations in height, tilt, or cont... » read more

Data Feed Forward And How It Works: Part 1
By Roberto Colecchia - 12 Aug, 2025 - Comments: 0

With data analytics, manufacturers can gain unparalleled insights into their testing processes, identify patterns, predict failures, and optimize operations. From improving yield rates to reducing testing costs, data analytics not only enhance the quality of semiconductor devices but also drives innovation and competitiveness in the industry. Traditionally, data analytics has been performed ... » read more

Test Hyperconvergence In Semiconductor Development
By Pawini Mahajan - 12 Aug, 2025 - Comments: 0

Back when semiconductor devices contained only a few thousand gates, manufacturing test was almost an afterthought. The development team threw the chip “over the wall” to the test engineers, who developed a set of test patterns for the manufacturing floor. As this process became more automated and chips became more complicated, test considerations crept into the development flow and design-... » read more

Chiplet Interfaces Embrace Failures
By Anne Meixner - 12 Aug, 2025 - Comments: 0

Redundancy in chiplet interfaces is now a prerequisite for achieving sufficient yield in high-performance computing devices, which today are packed with tens of thousands of interconnects. And as the number and density of those interconnects increases, the prospects for yield only worsen. For more than two decades, high-speed I/O interfaces have included reliability strategies to manage in-f... » read more

Redefining Sustainability: Operational Resilience Is the New Frontier
By Mike Halblander - 12 Aug, 2025 - Comments: 0

Powering everything from smartphones, energy infrastructure, electric transport, and AI systems, semiconductors have become a cornerstone of economic innovation. However, rapid progress has an impact. One recent survey shows that the semiconductor device manufacturing industry more than doubled its annual electricity consumption between 2015 and 2023 – an increase of 125% during that period. ... » read more

Optimizing System Production with On-Chip Telemetry and ML-Driven Analytics
By proteanTecs - 12 Aug, 2025 - Comments: 0

Abstract As system companies integrate increasingly advanced chips onto their boards for high-performance markets such as AI, Cloud, Telecommunications, and Automotive, the complexity of system production continues to rise. Ensuring quality, performance, and lifetime reliability while minimizing test costs and production time has become a significant challenge.‍ A new solution addres... » read more

SLM: Actionable Silicon Insights Through Intelligent Measurement and Analysis
By Synopsys - 12 Aug, 2025 - Comments: 0

Developing semiconductors has always been a complex process, with advancements in electronic design automation (EDA) tools and fabrication technologies working to meet growing demands for larger designs, improved power efficiency, and better performance. As chip and system complexity increases alongside higher expectations for product reliability and longevity, traditional methods are reaching ... » read more

End-to-End Yield Management for Compound Semiconductors Manufacturing
By PDF Solutions - 12 Aug, 2025 - Comments: 0

Abstract: Progress in compound semiconductors is hindered by the high level of defectivity of the initial material. Here we take Silicon Carbide manufacturing technology as an example and provide an overview of manufacturing analytics tools and methodologies used to drive yield ramp and capacity expansion. We focus on 2 examples of site-to-site handoff: substrates handoff to IC front-end fab or... » read more

New Error Correcting Code And Non-Volatile Memory Options For Memory BIST
By Etienne Racine - 12 Aug, 2025 - Comments: 0

Tessent MemoryBIST from Siemens EDA provides a complete solution for at-speed test, diagnosis, repair, debug and characterization of embedded memories. Leveraging a flexible hierarchical architecture, built-in self-test (BIST) and self-repair can be integrated at both the individual core level and the top level. Tessent MemoryBIST efficiently addresses the ever-increasing demand for testing ... » read more

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