Better ATPG To Minimize Chip Test Time And Cost
By Hari Mani - 08 May, 2025 - Comments: 0

As chips get ever bigger and more complex, the electronic design automation (EDA) industry must innovate constantly to keep up. Engineers expect every new generation of silicon to be modeled, simulated, laid out, and checked in about the same time with the same effort, despite the growth in die size and density. One area of particular focus is manufacturing test. Any effort expended to reduce t... » read more

Shifting Left With DFT To Optimize Productivity, Testability, And Time-To-Market
By Siemens EDA - 08 May, 2025 - Comments: 0

This paper discusses one of the Siemens EDA shift-left strategies in the RTL-to-signoff flow: shift-left design-for-test (DFT). Tessent RTL Pro software automates the analysis and insertion of Tessent VersaPoint test point technology, LBIST-OST test points, dedicated scan wrapper cells and x-bounding logic as behavioral code at the RTL level. Tessent RTL Pro builds on Tessent’s market-leading... » read more

Identifying Sources Of Silent Data Corruption
By Laura Peters - 08 May, 2025 - Comments: 0

Silent data errors are raising concerns in large data centers, where they can propagate through systems and wreak havoc on long-duration programs like AI training runs. SDEs, also called silent data corruption, are technically rare. But with many thousands of servers, which contain millions of processors running at high utilization rates, these damaging events become common in large fleets. ... » read more

IoT Security By Design
By Lee Harrison - 08 May, 2025 - Comments: 0

After years of anticipation and steady uptake, the Internet of Things (IoT) seems poised to cross over into mainstream business use. The percentage of businesses utilizing IoT technologies has risen from 13% in 2014 to approximately 25% today. Global projections indicate that the number of IoT-connected devices is expected to reach 43 billion by 2030, nearly tripling from the figures in 2018. O... » read more

Coaxial Test Sockets Are In The Critical Path Of Advanced AI/CPU Products
By Jack Lewis - 08 May, 2025 - Comments: 0

Advanced AI/CPU processors demand extreme high frequency and power performance from SLT and ATE test sockets. These sockets are in the critical path at the end of a very costly silicon fabrication and advanced packaging manufacturing process. Yield loss at this point in the process is catastrophic to the bottom line. We at Modus Test, working in conjunction with our customers, have seen first-h... » read more

E-Beam Inspection Proves Essential For Advanced Nodes
By Gregory Haley - 08 May, 2025 - Comments: 0

Electron-beam inspection is proving to be indispensable for finding critical defects at sub-5nm dimensions. The challenge now is how to speed up the process to make it economically palatable to fabs. E-beam inspection's notorious sensitivity-throughput tradeoff has made comprehensive defect coverage with e-beam at these advanced nodes especially problematic. For Intel’s 18A logic node (~1.... » read more

Chip Complexity Drives Innovation In Automated Test Equipment
By Jeorge Hurtarte - 08 May, 2025 - Comments: 0

Innovations in semiconductor technology—such as advancements in AI high-performance computing (HPC), Angstrom-scale silicon process nodes, silicon photonics, and automotive xEV wideband gap power transistor applications—require automated test equipment (ATE) to evolve at an unprecedented rate. As chip complexity grows, the challenges in design, manufacturing, and test multiply. It is a comp... » read more

Atomic Force Microscopy: The Definitive AFM Modes Handbook
By Bruker - 08 May, 2025 - Comments: 0

This handbook illustrates the wide variety of operating modes available on Bruker AFMs, going well beyond the standard high‑resolution topographic imaging capabilities of AFM. The modes are broken into seven separate categories: morphology, electromagnetic properties, thermal properties, mechanical properties, chemical properties, electrochemical properties, and manipulation. Each category be... » read more

Overview of Silicon Carbide Technology: Status, Challenges, Key Drivers, and Product Roadmap
By PDF Solutions - 08 May, 2025 - Comments: 0

Abstract: Arguably, SiC technology is the most rapidly expanding IC manufacturing technology driven mostly by the aggressive roadmap for battery electric vehicle penetration and also industrial high-voltage/high-power applications. This paper provides a comprehensive overview of the state of the art of SiC technology focusing on the challenges starting from the difficult and lengthy SiC substr... » read more

Who Is Most Likely To Link Financial And Manufacturing Data?
By Anne Meixner - 08 May, 2025 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss which companies have the most to gain from linking financial data with manufacturing data analytics platforms with Dieter Rathei, CEO of DR Yield; Jon Holt, senior director of product management at PDF Solutions, Alex Burlak, vice president of advanced analytics and test at proteanTecs; and Dirk de Vries, technical program ma... » read more

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