Building An AI Chip: Silicon Design And Advanced Packaging
By Synopsys - 29 Apr, 2026 - Comments: 0

AI has become a key driver for the semiconductor industry as it is applied to ever more aspects of daily life. Many startups and established vendors are designing AI chips to accelerate algorithms and yield the best results. AI designs are large and complex, requiring advanced process nodes and putting stress on every step of the development process. Multi-die, or chiplet-based, design is becom... » read more

Microarchitecture Tailored to 3D-Stacked Near-Memory Processing LLM Decoding (U. of Edinburgh, Peking U., Cambridge et al.)
By Technical Paper Link - 28 Apr, 2026 - Comments: 0

A new technical paper, "Rethinking Compute Substrates for 3D-Stacked Near-Memory LLM Decoding: Microarchitecture-Scheduling Co-Design," was published by researchers at University of Edinburgh, Peking University, University of Cambridge, University of Chinese Academy of Sciences, and the Hong Kong University of Science and Technology. Abstract "Large language model (LLM) decoding is a majo... » read more

Rethinking ESD Protection for System-On-Integrated Chiplets (UC Riverside)
By Technical Paper Link - 28 Apr, 2026 - Comments: 0

A new technical paper, "In-SoIC ESD Protection for Chiplet-Based 3D Microsystems: Future Research Directions," was published by researchers at the University of California, Riverside. Abstract "Heterogeneous integration opens a pathway to three-dimensional chiplet-based microsystem chips. Electrostatic discharge reliability is a major challenge to future smart chips featuring rich functio... » read more

Alumina Nanowires Improve Thermal Management in Advanced Packaging (Georgia Tech et al.)
By Technical Paper Link - 28 Apr, 2026 - Comments: 0

A new technical paper, "Epoxy Composites Reinforced with Long Al2O3 Nanowires for Enhanced Thermal Management in Advanced Semiconductor Packaging," was published by researchers at the Georgia Institute of Technology and National Cheng Kung University. Abstract "The rapid increase in heat flux in advanced 2.5D/3D semiconductor packaging places stringent demands on thermal interface materia... » read more

Mapping and Routing Fault-Tolerant Quantum Circuits Onto Chiplet Architectures (TU Munich)
By Technical Paper Link - 28 Apr, 2026 - Comments: 0

A new technical paper, "Chipmunq: A Fault-Tolerant Compiler for Chiplet Quantum Architectures," was published by researchers at the Technical University of Munich. Abstract "As quantum computing advances toward fault-tolerance through quantum error correction, modular chiplet architectures have emerged to provide the massive qubit counts required while overcoming fabrication limits of mon... » read more

Leveraging Agentic AI Techniques to Improve Formal Verification (Infineon, et al.)
By Technical Paper Link - 28 Apr, 2026 - Comments: 0

A new technical paper, "Agentic AI-based Coverage Closure for Formal Verification," was published by researchers at Infineon and the NIT Jalandhar. Abstract "Coverage closure is a critical requirement in Integrated Chip (IC) development process and key metric for verification sign-off. However, traditional exhaustive approaches often fail to achieve full coverage within project timelines.... » read more

Reflectometry-Based Technique for Characterising Complex Thin-Film Structures (Aalto U. et al.)
By Technical Paper Link - 28 Apr, 2026 - Comments: 0

A new technical paper, "Characterisation of Complex Multilayer Nanostructures with High Aspect Ratio," was recent published by researchers at Aalto University, University of Eastern Finland, Chipmetrics OY, and VTT MIKES. Abstract "Deposition studies of deep vertical dips on semiconductor wafers can create problems at an industrial manufacturing scale, since cross-sectioning requires a lo... » read more

New CPU Memory Module
By Ed Sperling - 28 Apr, 2026 - Comments: 0

Moving data has become the top challenge inside data centers. There is more data to process, more to move, and more to store and retrieve from memory. This is where small outline compression attached memory modules (SOCAMMs) fit in. Frank Ferro, group director for product management at Cadence, talks about the benefits of this next-gen modular low-power memory standard, how it compares with oth... » read more

Research Bits: Apr. 28
By Jesse Allen - 28 Apr, 2026 - Comments: 0

Parchment papertronics Researchers from Binghamton University used commercial parchment paper, commonly used in baking, along with a standard carbon dioxide laser and water-based conductive ink to create disposable, single-use electronic circuits. The laser selectively removes the paper's thin silicone coating in specific patterns, exposing the water-absorbing cellulose fibers underneath. T... » read more

When Semiconductor Materials Misbehave
By Gregory Haley - 27 Apr, 2026 - Comments: 0

Key Takeaways Material behavior in production depends on the process context that no development environment can fully replicate. In advanced packaging, the interactions that cross domain boundaries are increasingly where failures originate. The most accurate materials data is also the most commercially sensitive, leaving simulation models calibrated against generic inputs rather tha... » read more

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