Cracking The Memory Wall


Processor performance continues to improve exponentially, with more processor cores, parallel instructions, and specialized processing elements, but it is far outpacing improvements in bandwidth and memory. That gap, the so-called memory wall, has persisted throughout most of this century, but now it is becoming more pronounced. SRAM scaling is slowing at advanced nodes, which means SRAM takes ... » read more

Testing Analog And Digital Components In Modern PCBAs


Modern printed circuit board assemblies (PCBAs) are designed to support increasingly complex applications in industries such as telecommunications, automotive, consumer electronics, and industrial automation. Many applications require analog and digital components to function seamlessly within a single board. This integration of analog and digital technologies requires comprehensive testing to ... » read more

Low-Temp Pressure-Assisted Liquid-Metal Printing for Oxide-TFTs


A new technical paper titled "Low-temperature pressure-assisted liquid-metal printing for β-Ga2O3 thin-film transistors" was published by researchers at UCSD and National Tsing Hua University. Abstract "Developing a low-temperature and cost-effective manufacturing process for energy-efficient and high-performance oxide-thin-film transistors (TFTs) is a crucial step toward advanci... » read more

Machine Learning-Based IR Drop Prediction Approach


A new technical paper titled "Estimating Voltage Drop: Models, Features and Data Representation Towards a Neural Surrogate" was published by researchers at KTH Royal Institute of Technology and Ericsson Research. ABSTRACT "Accurate estimation of voltage drop (IR drop) in modern Application-Specific Integrated Circuits (ASICs) is highly time and resource demanding, due to the growing complex... » read more

Research Bits: Feb. 25


Recording synaptic connections Researchers from Harvard University built a silicon chip capable of recording synaptic signals from a large number of neurons and used it to catalogue more than 70,000 synaptic connections from about 2,000 rat neurons. They hope the device is a step in creating a detailed synaptic connection map of the brain. The chip contains an array of 4,096 microhole elect... » read more

Chip Industry Technical Paper Roundup: Feb. 25


New technical papers recently added to Semiconductor Engineering’s library: [table id=408 /] Find all technical papers here. » read more

Design Space For The Device-Circuit Codesign Of NVM-Based CIM Accelerators (TSMC)


A new technical paper titled "Assessing Design Space for the Device-Circuit Codesign of Nonvolatile Memory-Based Compute-in-Memory Accelerators" was published by TSMC researchers. Abstract "Unprecedented penetration of artificial intelligence (AI) algorithms has brought about rapid innovations in electronic hardware, including new memory devices. Nonvolatile memory (NVM) devices offer one s... » read more

Cradle-To-Grave Analysis Of The Carbon Footprint of AI Hardware (Google)


A new technical paper titled "Life-Cycle Emissions of AI Hardware: A Cradle-To-Grave Approach and Generational Trends" was published by researchers at Google. Abstract "Specialized hardware accelerators aid the rapid advancement of artificial intelligence (AI), and their efficiency impacts AI's environmental sustainability. This study presents the first publication of a comprehensive AI acc... » read more

Linear Pluggable Optics Save Energy In Data Centers


Linear pluggable optics (LPO) is garnering more attention as a way to quickly and efficiently move data in and out of server racks, but a lack of standards for connecting the optical modules is slowing adoption at a time when there is growing pressure to reduce power in data centers. LPO is the newest of two approaches to solving the power wall problem in data centers. Co-packaged optics (CP... » read more

Chip Industry Week In Review


The EU Commission approved €920 million in German State aid to support Infineon in setting up its Smart Power Fab in Dresden. Total funding for the Dresden site amounts to about €1 billion. PDF Solutions will acquire secureWISE for $130 million to expand the reach of its semiconductor manufacturing data platform, providing secure, remote access monitoring and control. Tariffs, trade, and ... » read more

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