2023 Open Source Risk In M&A By The Numbers
By Synopsys - 22 Mar, 2023 - Comments: 0

Learn how an open source audit can reduce your security risk Here’s what we know: Most of today’s codebases contain open source components. Vulnerabilities and licensing issues in codebases are as pervasive as open source itself. Unpatched software vulnerabilities are one of the biggest cyberthreats organizations face. Failure to comply with open source licenses can put... » read more

Compact NN Accelerator In CodAL
By Codasip - 22 Mar, 2023 - Comments: 0

Recent years of IoT/IIoT evolution resulted in an important shift from cloud-level to device-level AI processing. It enables devices to run some AI tasks locally, thus minimizing security issues, data transfer costs, and latency. The ability to run AI/ML tasks becomes a must-have when selecting an SoC or MCU for IoT and IIoT applications. Embedded devices are typically resource-constrained, ... » read more

Blog Review: March 22
By Jesse Allen - 22 Mar, 2023 - Comments: 0

Siemens EDA's Dan Yu warns that the unavailability of verification data is slowing down the development of advanced machine learning for verification, with valuable data assets either siloed among different team members or projects or simply discarded due to the lack of analytic techniques to extract value from them. Synopsys' Richard Solomon and Dana Neustadter point to the need for hardwar... » read more

PCIe 6.0 Electrical Testing For High Data-Bandwidth Applications
By Cadence - 22 Mar, 2023 - Comments: 0

For nearly three decades, PCI Express (PCIe) technology has been the standard interconnect inside computers providing high bandwidth and low latency to meet customer demand. However, as the industry needs to evolve, so does the standard, keeping pace and driving future innovation. PCIe 6.0 is ubiquitous and offers power-efficient performance and high bandwidth for latency-sensitive applicati... » read more

Using Simulation To Overcome Three Millimeter-Wave Design Challenges
By Keysight - 22 Mar, 2023 - Comments: 0

Radio designers are embracing system simulation to reduce design time and ensure their devices meet the 5G NR specification. We explore 3 simulation techniques to overcome mmWave design challenges. Click here to read more. » read more

China Chip Industry Startup Funding Annual Report & Analysis: 2022
By The SE Staff - 21 Mar, 2023 - Comments: 0

China is racing to stay competitive in semiconductors, as trade sanctions increasingly limit its access to EDA tools and manufacturing equipment required for the most advanced manufacturing processes. As a result, state-backed investors and regional development funds are pouring money into domestic semiconductor companies. This report will provide a glimpse into where the money is going, and wh... » read more

Research Bits: March 21
By Jesse Allen - 21 Mar, 2023 - Comments: 0

Micropatterning with sugar A scientist at the National Institute of Standards and Technology (NIST) discovered a transfer printing process that can deposit microcircuit patterns on curved and textured surfaces using sugar candy. Transfer printing methods, such as flexible tapes, are often used for surfaces that are difficult to directly print on. But they have difficulty with conforming to ... » read more

Chip Industry’s Technical Paper Roundup: Mar. 21
By Linda Christensen - 21 Mar, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=88 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us ... » read more

New Spintronics Manufacturing Process, Allowing Scaling Down To Sub-5nm (U. of Minnesota/NIST)
By Technical Paper Link - 20 Mar, 2023 - Comments: 0

A new technical paper titled "Sputtered L10-FePd and its Synthetic Antiferromagnet on Si/SiO2 Wafers for Scalable Spintronics" was published by researchers at University of Minnesota and NIST, with funding by DARPA and others. According to a University of Minnesota summary news article, "The industry standard spintronic material, cobalt iron boron, has reached a limit in its scalability. The... » read more

Mini-Consortia Forming Around Chiplets
By Ed Sperling - 20 Mar, 2023 - Comments: 0

Mini-consortia for chiplets are sprouting up across the industry, driven by demands for increasing customization in tight market windows and fueled by combinations of hardened IP that have been proven in silicon. These loosely aligned partnerships are working to develop LEGO-like integration models for highly specific applications and end markets. But they all are starting small, because it'... » read more

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