ML-Assisted IC Test Binning With Real-Time Prediction At The Edge


IC Test is a critical part of semiconductor manufacturing and proper die binning and material disposition has an important impact on the overall yield and on the process monitoring and failure mode diagnostics. Edge analytics are becoming an increasingly important aspect of die disposition. By intercepting parts in real-time at the wafer test step, we can save downstream processing needs. In th... » read more

Blog Review: Feb. 7


Synopsys' Ian Land, Kenneth Larsen, and Rob Aitken find that a new approach will be required to ensure that higher volume 3D heterogeneous integration (3DHI) designs can function reliably and successfully in aerospace, defense, and government systems. Siemens' John Golding provides a primer on the fundamental concepts related to signal integrity, including key topics such as transmission lin... » read more

Evaluation of Cache Replacement Policies Using Various Typical Simulation Approaches


A technical paper titled “Improving the Representativeness of Simulation Intervals for the Cache Memory System” was published by researchers at Complutense University of Madrid, imec, and KU Leuven. Abstract: "Accurate simulation techniques are indispensable to efficiently propose new memory or architectural organizations. As implementing new hardware concepts in real systems is often not... » read more

Enabling Beyond-Bound Decoding For DRAM By Unraveling Reed-Solomon Codes


A technical paper titled “Unraveling codes: fast, robust, beyond-bound error correction for DRAM” was published by researchers at Rambus. Abstract: "Generalized Reed-Solomon (RS) codes are a common choice for efficient, reliable error correction in memory and communications systems. These codes add 2t extra parity symbols to a block of memory, and can efficiently and reliably correct up ... » read more

Benchmarking Electron Holography And Pixelated STEM On Various Semiconductor Structures


A technical paper titled “Measuring electrical properties in semiconductor devices by pixelated STEM and off-axis electron holography (or convergent beams vs. plane waves).” was published by researchers at CEA-LETI at the Universite Grenoble Alpes and EPFL. Abstract: "We demonstrate the use of both pixelated differential phase contrast (DPC) scanning transmission electron microscopy (STEM... » read more

Superexchange Coupling Of Donor Qubits In Si For Quantum Computers (UNSW)


A technical paper titled “Superexchange coupling of donor qubits in silicon” was published by researchers at University of New South Wales. Abstract: "Atomic engineering in a solid-state material has the potential to functionalize the host with novel phenomena. STM-based lithographic techniques have enabled the placement of individual phosphorus atoms at selective lattice sites of silicon... » read more

Generating And Evaluating HW Verification Assertions From Design Specifications Via Multi-LLMs


A technical paper titled “AssertLLM: Generating and Evaluating Hardware Verification Assertions from Design Specifications via Multi-LLMs” was published by researchers at Hong Kong University of Science and Technology. Abstract: "Assertion-based verification (ABV) is a critical method for ensuring design circuits comply with their architectural specifications, which are typically describe... » read more

Guidelines For A Single-Nanometer Magnetic Tunnel Junction (MTJ)


A technical paper titled “Single-nanometer CoFeB/MgO magnetic tunnel junctions with high-retention and high-speed capabilities” was published by researchers at Tohoku University, Université de Lorraine, and Inamori Research Institute for Science. Abstract: "Making magnetic tunnel junctions (MTJs) smaller while meeting performance requirements is critical for future electronics with spin-... » read more

Research Bits: Feb. 6


Laser printer for photonic circuits Researchers from the University of Washington and University of Maryland propose a faster, cheaper way to fabricate and reconfigure photonic integrated circuits. The method uses a laser writer to write, erase, and modify circuits into a thin film of phase-change material similar to what is used for recordable CDs and DVDs. The researcher say the method co... » read more

Chip Industry Technical Paper Roundup: Feb. 6


New technical papers added to Semiconductor Engineering’s library this week. [table id=187 /] More ReadingTechnical Paper Library home » read more

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