New Polymer-Based Semiconductor: Harnessing The Power of Chirality
By Technical Paper Link - 20 Nov, 2023 - Comments: 0

A technical paper titled “Subtle Molecular Changes Largely Modulate Chiral Helical Assemblies of Achiral Conjugated Polymers by Tuning Solution-State Aggregation” was published by researchers at University of Illinois Urbana-Champaign and Purdue University. Abstract: "Understanding the solution-state aggregate structure and the consequent hierarchical assembly of conjugated polymers is cr... » read more

Selected I-III-VI2 Semiconductors: Synthesis, Properties, and Applications (Université de Lorraine)
By Technical Paper Link - 20 Nov, 2023 - Comments: 0

A technical paper titled “Selected I-III-VI2 Semiconductors: Synthesis, Properties and Applications in Photovoltaic Cells” was published by researchers at Université de Lorraine, CNRS. Abstract: "I–III–VI2 group quantum dots (QDs) have attracted high attention in photoelectronic conversion applications, especially for QD-sensitized solar cells (QDSSCs). This group of... » read more

What To Do About Electrostatic Discharge
By Ed Sperling - 20 Nov, 2023 - Comments: 0

Electrostatic discharge is a well-understood phenomenon, but it’s becoming more difficult to plan for as single chips are replaced by multiple chips or chiplets in a package, and as the density of components continues to increase with each new node. In both cases, the probability for failure increases unless these sudden shocks are addressed in the design. Dermott Lynch, director of product m... » read more

Applying ML In Failure Analysis
By Anne Meixner - 20 Nov, 2023 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss how increasing complexity in semiconductor and packaging technology is driving shifts in failure analysis methods, with Frank Chen, director of applications and product management at Bruker Nano Surfaces & Metrology; Mike McIntyre, director of product management in the Enterprise Business Unit at Onto Innovation; Kamran H... » read more

Chip Industry Week In Review
By The SE Staff - 17 Nov, 2023 - Comments: 0

By Jesse Allen, Karen Heyman, and Liz Allan Japan's Rapidus and the University of Tokyo are teaming up with France's Leti to meet its previously announced mass production goal of 2nm chips by 2027, and chips in the 1nm range in the 2030s. Rapidus was formed in 2022 with the support of eight Japanese companies — Sony, Kioxia, Denso, NEC, NTT, SoftBank, Toyota, and Mitsubishi's banking arm, ... » read more

LLM Inference On CPUs (Intel)
By Technical Paper Link - 16 Nov, 2023 - Comments: 0

A technical paper titled “Efficient LLM Inference on CPUs” was published by researchers at Intel. Abstract: "Large language models (LLMs) have demonstrated remarkable performance and tremendous potential across a wide range of tasks. However, deploying these models has been challenging due to the astronomical amount of model parameters, which requires a demand for large memory capacity an... » read more

Neuromorphic Devices Based On Memristive Nanowire Networks
By Technical Paper Link - 16 Nov, 2023 - Comments: 0

A technical paper titled “Online dynamical learning and sequence memory with neuromorphic nanowire networks” was published by researchers at University of Sydney, University of California Los Angeles (UCLA), National Institute for Materials Science (NIMS), Kyushu Institute of Technology (Kyutech), and University of Sydney Nano Institute. Abstract: "Nanowire Networks (NWNs) belong to an em... » read more

Hybrid Photoresist Capable Of High-Resolution, Positive-Tone EUVL Patterning
By Technical Paper Link - 16 Nov, 2023 - Comments: 0

A technical paper titled “Vapor-Phase Infiltrated Organic–Inorganic Positive-Tone Hybrid Photoresist for Extreme UV Lithography” was published by researchers at Stony Brook University, Brookhaven National Laboratory, and University of Texas at Dallas. Abstract: "Continuing extreme downscaling of semiconductor devices, essential for high performance and energy efficiency of future microe... » read more

Big Shifts In Power Electronics Packaging
By Laura Peters - 16 Nov, 2023 - Comments: 0

The power semiconductor market is poised for remarkable growth in the next several years, fueled by the adoption of electric vehicles and renewable energy, but it also driving big changes in the packaging needed to protect and connect these devices. Packaging is playing an increasingly critical role in the transition to higher power densities, enabling more efficient power supplies, power deli... » read more

IC Manufacturing Targets Less Water, Less Waste
By Anne Meixner - 16 Nov, 2023 - Comments: 0

Fabs, OSATs, and equipment makers are accelerating their efforts to consume less water while recycling more material waste in a trend toward better sustainability. With chips, sustainability is heavily focused on carbon emissions, and energy consumption is a significant contributor. But there is an equal effort underway to reduce water consumption and pollution. Across the globe, the number ... » read more

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