An Evaluation of Quantum Algorithms On Classical Hardware Using The CuQuantum Framework
By Technical Paper Link - 07 Jun, 2023 - Comments: 0

A technical paper titled “Simulating Noisy Quantum Circuits for Cryptographic Algorithms” was published by researchers at Virginia Tech. Abstract: "The emergence of noisy intermediate-scale quantum (NISQ) computers has important consequences for cryptographic algorithms. It is theoretically well-established that key algorithms used in cybersecurity are vulnerable to quantum computers due ... » read more

Advantages, Disadvantages, And Use Cases Of FPGAs
By Technical Paper Link - 07 Jun, 2023 - Comments: 0

A technical paper titled “Data Processing with FPGAs on Modern Architectures” was published by researchers at ETH Zürich. Abstract: "Trends in hardware, the prevalence of the cloud, and the rise of highly demanding applications have ushered an era of specialization that is quickly changing the way data is processed at scale. These changes are likely to continue and accelerate in the next... » read more

Nanosheet GAAFETs: Compact Modeling (Politecnico di Torino)
By Technical Paper Link - 07 Jun, 2023 - Comments: 0

A technical paper titled “NS-GAAFET Compact Modeling: Technological Challenges in Sub-3-nm Circuit Performance” was published by researchers at Politecnico di Torino. Abstract: "NanoSheet-Gate-All-Around-FETs (NS-GAAFETs) are commonly recognized as the future technology to push the digital node scaling into the sub-3 nm range. NS-GAAFETs are expected to replace FinFETs in a few years, as ... » read more

Extreme Fast Charging by Regulating Lithium-Ion Batteries’ Self-Generated Heat Via Active Thermal Switching
By Technical Paper Link - 07 Jun, 2023 - Comments: 0

A technical paper titled “Extreme fast charging of commercial Li-ion batteries via combined thermal switching and self-heating approaches” was published by researchers at Lawrence Berkeley National Laboratory, the University of California, Berkeley, and the Hong Kong University of Science and Technology. Abstract: "The mass adoption of electric vehicles is hindered by the inadequate ext... » read more

3DICs: Legalizer Techniques For Better Routing Quality, Fewer DRVs, And Reduced Total Slack With Negligible Runtime Impact
By Technical Paper Link - 07 Jun, 2023 - Comments: 0

A technical paper titled “On Legalization of Die Bonding Bumps and Pads for 3D ICs” was published by researchers at the Georgia Institute of Technology, NVIDIA Corporation, and the University of Bremen. Abstract "State-of-the-art 3D IC Place-and-Route flows were designed with older technology nodes and aggressive bonding pitch assumptions. As a result, these flows fail to honor the widt... » read more

High Performance, Energy-Dense, Practical, And Reliable Solid-State Batteries (ORNL)
By Technical Paper Link - 07 Jun, 2023 - Comments: 0

A technical paper titled “Tailoring of the Anti-Perovskite Solid Electrolytes at the Grain-Scale” was published by researchers at Oak Ridge National Laboratory. Abstract: "The development of thin, dense, defect-free solid electrolyte films is key for achieving practical and commercially viable solid-state batteries. Herein, we showcase a facile processing pathway for antiperovskite (Li2OH... » read more

A PIM Architecture That Supports Floating Point-Precision Computations Within The Memory Chip
By Technical Paper Link - 07 Jun, 2023 - Comments: 0

A technical paper titled “FlutPIM: A Look-up Table-based Processing in Memory Architecture with Floating-point Computation Support for Deep Learning Applications” was published by researchers at Rochester Institute of Technology and George Mason University. Abstract: "Processing-in-Memory (PIM) has shown great potential for a wide range of data-driven applications, especially Deep Learnin... » read more

Multi-Rate Discrete-Time Modeling Approach Of A Power Hardware-in-the-Loop Setup (Karlsruhe Institute of Technology)
By Technical Paper Link - 07 Jun, 2023 - Comments: 0

A technical paper titled “Multi-rate Discrete Domain Modeling of Power Hardware-in-the-Loop Setups” was published by researchers at the Institute for Technical Physics, Karlsruhe Institute of Technology, Karlsruhe, Germany. Abstract: "Power Hardware-in-the-Loop (PHIL) facilitates the testing of novel power engineering solutions in the lab, allowing a flexible testing environment while kee... » read more

Power Modules: A Four-Dimensional Design Challenge Calls For A Holistic Design And Verification Approach
By Siemens EDA - 07 Jun, 2023 - Comments: 0

A power module is a high-power switching circuit used in applications for electric vehicles, renewable energy, photovoltaics, wind power, and much more. Switching-element IGBTs and MOSFETs are used in these modules. This paper discusses different technologies and the associated design challenges to achieve complex power module requirements like high voltage resistivity up to 1700 V, high curren... » read more

ESD Co-Design For High-Speed SerDeS In FinFET Technologies
By Synopsys - 07 Jun, 2023 - Comments: 0

An electronic device is susceptible to Electrostatic Discharge (ESD) damage during its entire life cycle, including the phase from the completion of the silicon wafer processing to when the device (die) is assembled in the system. To avoid yield loss due to ESD damage during this early phase, on-chip ESD protection measures are applied to provide a certain degree of ESD robustness. The componen... » read more

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