Cold Plate Technology Comparison
By Ansys - 07 Jun, 2023 - Comments: 0

New types of energy, such as wind and solar power, are being utilized more prevalently and hybrid cars/buses are being identified as a means of reducing carbon dioxide emissions resulting from the use of fossil fuels. Electronic systems like frequency converters for wind power and train utilization are required to provide ever higher levels of energy savings. As such, IGBT (insulated-gate bipol... » read more

Blog Review: June 7
By Jesse Allen - 07 Jun, 2023 - Comments: 0

Synopsys' Kenneth Larsen and Powerchip's S.Z. Chang explore wafer-on-wafer (WoW) and chip-on-wafer (CoW), 3D hybrid bonding schemes that can be used to stack memory on logic with shorter signal transmission distance at no wasted power and more interconnect and bandwidth density. In a podcast, Siemens' Conor Peick, Nand Kochhar, and Mark Sampson chat about how companies can address growing co... » read more

Startup Funding: May 2023
By Jesse Allen - 07 Jun, 2023 - Comments: 0

Photonic interconnects were an area of activity in May, with two companies raising funds for what could be much faster chip-to-chip and chiplet-to-chiplet links. Microstructured optics and metasurfaces also drew investment, with four companies creating products for a range of applications from flexible LEDs to multi-wavelength spectral imaging. The large language models that power many gener... » read more

Uncovering Instabilities In Variational-Quantum Deep Q-Networks
By Fraunhofer IIS/EAS - 07 Jun, 2023 - Comments: 0

By Maja Franz (1), Lucas Wolf (1), Maniraman Periyasamy (2), Christian Ufrecht (2), Daniel D. Scherer (2), Axel Plinge (2), Christopher Mutschler (2), Wolfgang Mauerer (1,3) (1) Technical University of Applied Sciences, Regensburg, Germany, (2) Fraunhofer-IIS, Fraunhofer Institute for Integrated Circuits IIS, Division Positioning and Networks, Nuremberg, Germany, (3) Siemens AG, Corporate ... » read more

Arm SystemReady Certification System Requirements Specification v2.1
By Arm - 07 Jun, 2023 - Comments: 0

Systems that are designed to “just work” for the end user (with the ability to install and run generic off-the-shelf operating systems out-of-the-box) need to follow a set of minimum hardware and firmware requirements to ensure compatibility. For hardware, the Arm SystemReady Program defines a common Base System Architecture (BSA) specification and a set of market-specific supplements. F... » read more

From Lab To Fab: Increasing Pressure To Fuse IC Processes
By Gregory Haley - 06 Jun, 2023 - Comments: 0

Test, metrology, and inspection are essential for both the lab and the fab, but fusing them together so that data created in one is easily transferred to the other is a massive challenge. The chip industry has been striving to bridge these separate worlds for years, but the economics, speed, and complexity of change require a new approach. The never-ending push toward smaller, better-defined... » read more

Multivariate Analysis For Full Process Visibility
By Krista Tropper - 06 Jun, 2023 - Comments: 0

In semiconductor manufacturing, especially in electrical test data, but also in other parameters, there are often sets of parameters that are very highly correlated. Even a change in the correlation of those parameters may indicate a problem. For that reason, multivariate monitoring, or multivariate statistics, is applied to these parameters. Multivariate analysis, also known as multivariate... » read more

Journey From Cell-Aware To Device-Aware Testing Begins
By Laura Peters - 06 Jun, 2023 - Comments: 0

Early results of using device-aware testing on alternative memories show expanded test coverage, but this is just the start. Once the semiconductor industry realized that it was suffering from device failures even when test programs achieved 100% fault coverage, it went about addressing this disconnect between the way defects manifest themselves inside devices and the commonly used fault mod... » read more

Using Advanced Analytics To Meet ESG Goals
By Mike McIntyre - 06 Jun, 2023 - Comments: 0

With the continued advancement of environmental, social and governance goals, corporations are increasingly focused on reducing their carbon footprints. To accomplish this, these companies are being asked to operate their businesses more efficiently than ever before, whether the matter is reducing waste, water usage or power consumption. This is true for the semiconductor industry as well. A... » read more

Ramping Up Power Electronics For EVs
By Anne Meixner - 06 Jun, 2023 - Comments: 0

The rapid acceleration of the power devices used in electric vehicles (EVs) is challenging chipmakers to adequately screen the ICs that power these vehicles.[1] While progress toward autonomous driving is grabbing the public’s attention, the electrification of transportation systems is progressing quietly. For the automotive industry, this shift involves a mix of electronic components. Amo... » read more

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