What Is Achievable With A Yield Management System?
By Antonija Zagar - 12 Apr, 2023 - Comments: 0

Semiconductor manufacturers are under constant pressure to increase yields and cut costs. Yield Management Systems (YMS) are designed specifically to meet the needs of semiconductor manufacturers, enabling them to investigate yield excursions, streamline the manufacturing processes, optimize the supply chain, analyze tools and eliminate workplace inefficiencies. In terms of data challenges... » read more

New Group Of Non-vdW 2D Materials Derived From Non-Layered Crystals Exhibiting Ultra Low Exfoliation Energies
By Technical Paper Link - 11 Apr, 2023 - Comments: 0

A new technical paper titled "A New Group of 2D Non-van der Waals Materials with Ultra Low Exfoliation Energies" was published by TU Dresden, HZDR, and Aalto University. Abstract: "The exfoliation energy—quantifying the energy required to extract a two-dimensional (2D) sheet from the surface of a bulk material—is a key parameter determining the synthesizability of 2D compounds. Here, ... » read more

Hybrid Hardware Fuzzer, Combining Capabilities of Formal Verification Methods And Fuzzing Tools
By Technical Paper Link - 11 Apr, 2023 - Comments: 0

A new technical paper titled "HyPFuzz: Formal-Assisted Processor Fuzzing" was published by researchers at Texas A&M University and Technische Universität Darmstadt. Abstract: "Recent research has shown that hardware fuzzers can effectively detect security vulnerabilities in modern processors. However, existing hardware fuzzers do not fuzz well the hard-to-reach design spaces. Consequently,... » read more

Digital Neuromorphic Processor: Algorithm-HW Co-design (imec / KU Leuven)
By Technical Paper Link - 11 Apr, 2023 - Comments: 0

A technical paper titled "Open the box of digital neuromorphic processor: Towards effective algorithm-hardware co-design" was published by researchers at imec and KU Leuven. "In this work, we open the black box of the digital neuromorphic processor for algorithm designers by presenting the neuron processing instruction set and detailed energy consumption of the SENeCA neuromorphic architect... » read more

What Data Center Chipmakers Can Learn From Automotive
By Anne Meixner - 11 Apr, 2023 - Comments: 2

Automotive OEMs are demanding their semiconductor suppliers achieve a nearly unmeasurable target of 10 defective parts per billion (DPPB). Whether this is realistic remains to be seen, but systems companies are looking to emulate that level of quality for their data center SoCs. Building to that quality level is more expensive up front, although ultimately it can save costs versus having to ... » read more

Challenges In Photonics Testing
By Karen Heyman - 11 Apr, 2023 - Comments: 0

Photonics is poised for significant growth due a rapid increase in data volumes and the need to move that data quickly and with minimal heat. But to reach its full potential photonics will have to overcome several production hurdles. The biggest challenge today involves alignment. While the industry is poised to produce billions of units, it still relies on testing practices that don't scale. ... » read more

Challenges Grow For CD-SEMs At 5nm And Beyond
By Gregory Haley - 11 Apr, 2023 - Comments: 1

CD-SEM, the workhorse metrology tool used by fabs for process control, is facing big challenges at 5nm and below. Traditionally, CD-SEM imaging has relied on a limited number of image frames for averaging, which is necessary both to maintain throughput speeds and to minimize sample damage from the electron beam itself. As dimensions get smaller, these limitations result in higher levels of n... » read more

Using Machine Learning To Increase Yield And Lower Packaging Costs
By Melvin Lee - 11 Apr, 2023 - Comments: 0

Packaging is becoming more and more challenging and costly. Whether the reason is substrate shortages or the increased complexity of packages themselves, outsourced semiconductor assembly and test (OSAT) houses have to spend more money, more time and more resources on assembly and testing. As such, one of the more important challenges facing OSATs today is managing die that pass testing at the ... » read more

Power-Aware Test: Beyond Low-Power Test
By Rahul Singhal - 11 Apr, 2023 - Comments: 0

By Rahul Singhal and Likith Kumar Manchukonda Power consumption is one of the key considerations when designing today’s semiconductor chips and systems. Over the years, the constant need for higher performance and more functions from the chips has been driving the continuous requirement for higher transistor density. The process node scaling makes this possible by reducing transistor sizes... » read more

Device Validation: The Ultimate Test Frontier
By Dave Armstrong - 11 Apr, 2023 - Comments: 0

This article is a condensed version of an article that appeared in the November/December 2022 issue of Chip Scale Review. Adapted with permission. Read the original article at https://chipscalereview.com/wp-content/uploads/flipbook/30/book.html, p. 26. In the early days of space exploration, spacecraft were manned by small teams of astronauts, most of whom were experienced test pilots who ... » read more

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