Audio, Visual Advances Intensify IC Design Tradeoffs
By Ann Mutschler - 13 Jun, 2022 - Comments: 0

A spike in the number of audio and visual sensors is greatly increasing design complexity in chips and systems, forcing engineers to make tradeoffs that can affect performance, power, and cost. Collectively, these sensors generate so much data that designers must consider where to process different data, how to prioritize it, and how to optimize it for specific applications. The tradeoffs in... » read more

AlphaGo Game Influences Argonne’s New AI Tool For Materials Discovery
By Technical Paper Link - 10 Jun, 2022 - Comments: 0

Research paper titled "Learning in continuous action space for developing high dimensional potential energy models" from researchers at Argonne National Lab with contributions from Oak Ridge National Laboratory. Abstract "Reinforcement learning (RL) approaches that combine a tree search with deep learning have found remarkable success in searching exorbitantly large, albeit discrete action ... » read more

Quantum: Pairing Cooper Pairs Magnifies The Phase Fluctuations of the Ground State
By Technical Paper Link - 10 Jun, 2022 - Comments: 0

New technical paper titled "Magnifying Quantum Phase Fluctuations with Cooper-Pair Pairing" from researchers at Université PSL, CNRS, Sorbonne Université, Université Paris-Diderot, Inria de Paris, PSL Research University. Abstract "Remarkably, complex assemblies of superconducting wires, electrodes, and Josephson junctions are compactly described by a handful of collective phase degrees ... » read more

Cu/SiO₂ Hybrid Bond Interconnects
By Technical Paper Link - 10 Jun, 2022 - Comments: 0

Technical paper titled "Microstructure Development of Cu/SiO₂ Hybrid Bond Interconnects After Reliability Tests" from researchers at TU Dresden and others. Abstract: "The focus of this study is a detailed characterization of hybrid Cu/SiO 2 wafer-to-wafer bonding interconnects after reliability testing. Hybrid bonding (or direct bond interconnect) is a technology of choice for fine pitch... » read more

Deep Learning Applications For Material Sciences: Methods, Recent Developments
By Technical Paper Link - 10 Jun, 2022 - Comments: 0

New technical paper titled "Recent advances and applications of deep learning methods in materials science" from researchers at NIST, UCSD, Lawrence Berkeley National Laboratory, Carnegie Mellon University, Northwestern University, and Columbia University. Abstract "Deep learning (DL) is one of the fastest-growing topics in materials data science, with rapidly emerging applications spanning... » read more

Compact and Tunable Electro-Optic Modulator for Free Space Applications Modulating Light at Gigahertz Speed
By Technical Paper Link - 10 Jun, 2022 - Comments: 0

New research paper titled "Gigahertz free-space electro-optic modulators based on Mie resonances" from researchers at Harvard John A. Paulson School of Engineering and Applied Sciences (SEAS), in collaboration with researchers at the department of Chemistry at the University of Washington. Partial Abstract "Electro-optic modulators are essential for sensing, metrology and telecommunicatio... » read more

Simulation Framework to Evaluate the Feasibility of Large-scale DNNs based on CIM Architecture & Analog NVM
By Technical Paper Link - 10 Jun, 2022 - Comments: 0

Technical paper titled "Accuracy and Resiliency of Analog Compute-in-Memory Inference Engines" from researchers at UCLA. Abstract "Recently, analog compute-in-memory (CIM) architectures based on emerging analog non-volatile memory (NVM) technologies have been explored for deep neural networks (DNNs) to improve scalability, speed, and energy efficiency. Such architectures, however, leverage ... » read more

Week in Review: Manufacturing, Test
By Linda Christensen - 10 Jun, 2022 - Comments: 0

Breaking the Logjam The U.S. government’s delay in funding strategic chip capacity is threatening supply chains that are critical to national security. In fact, classified meetings are being held this week on the subject. Meanwhile, recognizing that time is of the essence, a group of billionaires has backed the “America’s Frontier Fund,” a non-profit group that aims to spur U.S. chipma... » read more

Week In Review: Design, Low Power
By Jesse Allen - 10 Jun, 2022 - Comments: 0

Edge, embedded, IoT Renesas Electronics will acquire Reality Analytics, Inc. (Reality AI), a provider of embedded AI and TinyML solutions for advanced non-visual sensing in automotive, industrial, and commercial products. The inference-based AI solutions can be implemented across various endpoint AI applications. “Customers are increasingly demanding highly customized solutions involving emb... » read more

Week In Review: Auto, Security, Pervasive Computing
By SE Staff - 10 Jun, 2022 - Comments: 0

Automotive, mobility Lightyear, an automotive company based in the Netherlands, announced its solar car, the Lightyear 0, which goes into production this year. The car has a Worldwide Harmonised Light Vehicle Test Procedure (WLTP) range of 625 kilometers/388 miles and can charge itself while driving or parked, using double curved solar arrays on its roof. The daily charging adds 70 kilometers/... » read more

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