Startup Funding: March 2022
By Jesse Allen - 04 Apr, 2022 - Comments: 0

Semiconductor manufacturing, test, and inspection equipment startups did well in March. Investors funded a wide variety of equipment companies, including test equipment, materials handling, and those that make parts and components. In the manufacturing space, several companies developing manufacturing execution systems received funding, as well as a startup trying to prevent counterfeit parts f... » read more

Electronic System Design Revenue Up 14.4% Y/Y in Q4 2021
By Ann Mutschler - 04 Apr, 2022 - Comments: 0

Electronic System Design (ESD) industry revenue increased 14.4% from $3.03 billion in Q4 2020 to $3.5 billion in Q4 2021, according to the latest Electronic Design Market Data (EDMD) report by ESD Alliance, a SEMI Technology Community. Walden C. Rhines, executive sponsor of the SEMI Electronic Design Market Data report noted, “The industry continued to report double-digit year-over-year re... » read more

Investigation of the Resistivity and Emissivity of a Pellicle Membrane for EUV Lithography
By Technical Paper Link - 01 Apr, 2022 - Comments: 0

New technical paper from Hanyang University and University of Texas at Dallas. Abstract "A pellicle is a thin membrane structure that protects an extreme ultraviolet (EUV) mask from contamination during the exposure process. However, its limited transmittance induces unwanted heating owing to the absorption of EUV photons. The rupture of the EUV pellicle can be avoided by improving its ther... » read more

Investigation of integrated factors in the occurrence of copper wire bonding corrosion of semiconductor packages
By Technical Paper Link - 01 Apr, 2022 - Comments: 0

Abstract "Copper wire bonding has got attracted attention over gold wire bonding due to its lower cost. However, despite many unique aspects and properties of copper wire bonding, corrosion of copper wire bonding has become a point of interest as it leads to the failure of semiconductor packages. Current and future trends and development in miniaturization and multifunction of the semico... » read more

Hardware-in-the-Loop-Based Real-Time Fault Injection Framework for Dynamic Behavior Analysis of Automotive Software Systems
By Technical Paper Link - 01 Apr, 2022 - Comments: 0

New academic paper from Institute for Software and Systems Engineering, Technische Universität Clausthal, Germany. Abstract "A well-known challenge in the development of safety-critical systems in vehicles today is that reliability and safety assessment should be rigorously addressed and monitored. As a matter of fact, most safety problems caused by system failures can lead to serious ha... » read more

Exploring far-from-equilibrium ultrafast polarization control in ferroelectric oxides with excited-state neural network quantum molecular dynamics
By Technical Paper Link - 01 Apr, 2022 - Comments: 0

New academic paper out of USC Viterbi School of Engineering: Abstract "Ferroelectric materials exhibit a rich range of complex polar topologies, but their study under far-from-equilibrium optical excitation has been largely unexplored because of the difficulty in modeling the multiple spatiotemporal scales involved quantum-mechanically. To study optical excitation at spatiotemporal scales w... » read more

Brokerage System for Integration of LrWPAN Technologies
By Technical Paper Link - 01 Apr, 2022 - Comments: 0

New academic paper from UK's Leeds Beckett University. Abstract "The prevalent demand for remote data sharing and connectivity has catalysed the development of many wireless network technologies. However, low-power and low-rate wireless network technologies have emerged as the preferred choice (due to cheap procurement and maintenance cost, efficiency, and adaptability). Currently, these gr... » read more

Neuromorphic chip integrated with a large-scale integration circuit and amorphous-metal-oxide semiconductor thin-film synapse devices
By Technical Paper Link - 01 Apr, 2022 - Comments: 0

New academic paper from Nara Institute of Science and Technology (NAIST) and Ryukoku University. Abstract "Artificial intelligences are promising in future societies, and neural networks are typical technologies with the advantages such as self-organization, self-learning, parallel distributed computing, and fault tolerance, but their size and power consumption are large. Neuromorphic syste... » read more

Week In Review: Manufacturing, Test
By Linda Christensen - 01 Apr, 2022 - Comments: 0

The U.S. Senate approved the 2022 America COMPETES act, which has big ramifications for the chip industry. The bill now heads to the House for further reconciliation. If approved, it would provide more than $50 billion in U.S. subsidies for semiconductor chip manufacturing. The SIAC (Semiconductor In America Coalition) urged Congress to act promptly to achieve a bipartisan compromise soon and o... » read more

Week In Review: Design, Low Power
By Jesse Allen - 01 Apr, 2022 - Comments: 0

Tools Synopsys introduced a new model for using its EDA tools on the cloud. Synopsys Cloud provides pay-as-you-go access to the company's cloud-optimized design and verification products, with pre-optimized infrastructure on Microsoft Azure to address higher levels of interdependencies in chip development. "As more design flows incorporate AI, requiring even more resources, the virtually unlim... » read more

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