Highly Selective Etch Rolls Out For Next-Gen Chips

By Mark LaPedus - 21 Mar, 2022 - Comments: 0

Several etch vendors are starting to ship next-generation selective etch tools, paving the way for new memory and logic devices. Applied Materials was the first vendor to ship a next-gen selective etch system, sometimes called highly-selective etch, in 2016. Now, Lam Research, TEL, and others are shipping tools with highly-selective etch capabilities, in preparation for futuristic devices su... » read more

E/E Architecture Synthesis: Challenges and Technologies

By Technical Paper Link - 19 Mar, 2022 - Comments: 0

ACADEMIC PAPER Abstract "In recent years, the electrical and/or electronic architecture of vehicles has been significantly evolving. The new generation of cars demands a considerable amount of computational power due to a large number of safety-critical applications and driver-assisted functionalities. Consequently, a high-performance computing unit is required to provide the demanded pow... » read more

Key Recovery for Content Protection Using Ternary PUFs Designed with Pre-Formed ReRAM

By Technical Paper Link - 19 Mar, 2022 - Comments: 0

RESEARCH PAPER Abstract "Physical unclonable functions, embedded in terminal devices, can be used as part of the recovery process of session keys that protect digital files. Such an approach is only valuable when the physical element offers sufficient tamper resistance. Otherwise, error correcting codes should be able to handle any variations arising from aging, and environmentally induce... » read more

A compact two elements MIMO antenna for 5G communication

By Technical Paper Link - 18 Mar, 2022 - Comments: 0

Abstract: "This study presents a simple, miniaturized, and low-profile multiple-input multiple-output (MIMO) antenna operating at 29 GHz with reduced mutual coupling between the antenna elements for futuristic 5G communication. The proposed design employs two radiating elements with slits in the radiators to produce high isolation among the antenna radiators. The MIMO antenna maintains a compa... » read more

Programmable black phosphorus image sensor for broadband optoelectronic edge computing

By Technical Paper Link - 18 Mar, 2022 - Comments: 0

Abstract "Image sensors with internal computing capability enable in-sensor computing that can significantly reduce the communication latency and power consumption for machine vision in distributed systems and robotics. Two-dimensional semiconductors have many advantages in realizing such intelligent vision sensors because of their tunable electrical and optical properties and amenability fo... » read more

Week In Review: Manufacturing, Test

By Mark LaPedus - 18 Mar, 2022 - Comments: 0

Chipmakers, OEMs Intel continues to build more fabs. First, the company announced fabs in Arizona and then Ohio. Now, Intel plans to invest up to €80 billion in the European Union over the next decade. As part of the effort, Intel plans to build two semiconductor fabs in Magdeburg, Germany. Construction is expected to begin in the first half of 2023 and production planned to come online in 2... » read more

Week In Review: Design, Low Power

By Jesse Allen - 18 Mar, 2022 - Comments: 0

Alphawave IP will acquire the OpenFive business unit from SiFive. The $210 million cash deal will bring OpenFive’s high-speed connectivity SoC IP portfolio to Alphawave and nearly double its IPs currently available, including an expanded die-to-die connectivity portfolio as well as adding data center and networking custom silicon solutions. "When we completed our IPO in 2021, we committed to ... » read more

Week In Review: Auto, Security, Pervasive Computing

By SE Staff - 18 Mar, 2022 - Comments: 0

Automotive Supply chain issues and Russia’s invasion of Ukraine, will constrain automotive production in 2022 by 2.6mn units, predicts S&P Global Mobility (formerly known as the automotive team at I.H.S. Markit). Ukraine controls around half of high purity neon gas used to etch ICs — the low supply of which may continue to hurt the automotive industry — and the country makes a cable ... » read more

Extending Copper Interconnects To 2nm

By Laura Peters - 17 Mar, 2022 - Comments: 0

Transistor scaling is reaching a tipping point at 3nm, where nanosheet FETs will likely replace finFETs to meet performance, power, area, and cost (PPAC) goals. A significant architectural change is similarly being evaluated for copper interconnects at 2nm, a move that would reconfigure the way power is delivered to transistors. This approach relies on so-called buried power rails (BPRs) and... » read more

Wirebond IC Substrates: Challenges Ahead

By Prasad Dhond - 17 Mar, 2022 - Comments: 0

Substrate suppliers are slashing capacity allocated to wirebond IC substrates. We hear about "limited tenting capacity," "no support for EBS designs," and requests for "conversion to etchback" designs. What does all this mean? Let's start with "Line" and "Space." "Line" is the width of a trace on a substrate and "Space" is the distance between the two traces. For wirebond packages such a... » read more

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