Blog Review: March 23
By Jesse Allen - 23 Mar, 2022 - Comments: 0

Arm's Ilias Vougioukas presents new ways to improve on virtual to physical memory translation without breaking any of the pre-existing hardware or software. Siemens' Scot Morrison considers the current regulatory landscape for security of medical devices, including how device manufactures need to proactively implement a plan to find, assess, and respond to potential vulnerabilities. Synop... » read more

CXL and OMI: Competing or Complementary?
By Bryon Moyer - 23 Mar, 2022 - Comments: 1

System designers are looking at any ideas they can find to increase memory bandwidth and capacity, focusing on everything from improvements in memory to new types of memory. But higher-level architectural changes can help to fulfill both needs, even as memory types are abstracted away from CPUs. Two new protocols are helping to make this possible, CXL and OMI. But there is a looming question... » read more

Optimize Designs And Mitigate Thermal Threats In High-Current Automotive Applications
By Cadence - 23 Mar, 2022 - Comments: 0

By Melika Roshandell, Cadence Design overview Current density increases at the PCB/package level result in local temperature increases known as hotspots. In addition to highlighting the heat generated locally around and underneath certain components at the PCB or IC package level due to component power consumption, the Celsius Thermal Solver can calculate the heat generated by the Joule ef... » read more

System Innovation For Aerospace, Defense And Government
By Synopsys - 23 Mar, 2022 - Comments: 0

Tools for developer and user challenges Performance in a small package — low size, weight and power (SWaP) Long-life and upgradability with high-reliability, security, and safety Reliability in a range of operating environments, from ground to space End-to-end support: from the IoT network edge to the datacenter Process massively parallel sensor data with low latency S... » read more

Embedded AI On L-Series Cores
By Codasip - 23 Mar, 2022 - Comments: 0

Over the last few years there has been an important shift from cloud-level to device-level AI processing. The ability to run AI/ML tasks becomes a must-have when selecting an SoC or MCU for IoT and IIoT applications. Embedded devices are typically resource-constrained, making it difficult to run AI algorithms on embedded platforms. This paper looks at what could make it easier from a softwar... » read more

Flat-surface-assisted and self-regulated oxidation resistance of Cu(111)
By Technical Paper Link - 22 Mar, 2022 - Comments: 0

Abstract "Oxidation can deteriorate the properties of copper that are critical for its use, particularly in the semiconductor industry and electro-optics applications. This has prompted numerous studies exploring copper oxidation and possible passivation strategies. In situ observations have, for example, shown that oxidation involves stepped surfaces: Cu2O growth occurs on flat surfaces as a ... » read more

Research Bits: March 22
By Jesse Allen - 22 Mar, 2022 - Comments: 0

Securing wireless communications without encryption Researchers from Princeton University, University of Michigan–Shanghai Jiao Tong University Joint Institute, and Xi’an Jiaotong University developed a millimeter-wave wireless chip that allows secure wireless transmissions and makes it challenging to eavesdrop on high-frequency wireless transmissions, even with multiple colluding bad acto... » read more

Cataloging IP In The Enterprise
By Ed Sperling - 22 Mar, 2022 - Comments: 0

Many companies have no way of documenting where IP they license is actually used, which version of that IP is being utilized, and whether that license extends to other projects or even to their customers. Pedro Pires, applications engineer at ClioSoft, looks at how IP currently is cataloged, why it’s been so difficult to do this in the past, and how AI can be used to speed up and simplify thi... » read more

Technical Paper Round-Up: March 22
By Linda Christensen - 22 Mar, 2022 - Comments: 0

New memories, materials, and transistor types, and processes for making those devices, highlighted the past week's technical papers. That includes everything from vertical MoS2 to programmable black phosphorus image sensors and photonic lift-off processes for flexible thin-film materials. Papers continue to flow from all parts of the supply chain, with some new studies out of Pakistan, Seoul... » read more

An Energy-Efficient DRAM Cache Architecture for Mobile Platforms With PCM-Based Main Memory
By Technical Paper Link - 21 Mar, 2022 - Comments: 0

Abstract "A long battery life is a first-class design objective for mobile devices, and main memory accounts for a major portion of total energy consumption. Moreover, the energy consumption from memory is expected to increase further with ever-growing demands for bandwidth and capacity. A hybrid memory system with both DRAM and PCM can be an attractive solution to provide additional capacity ... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2026 SMG   |  Terms of Service  |  Privacy Policy