Verification Knowledge At Your Fingertips
By Rob van Blommestein - 25 Feb, 2021 - Comments: 0

If you’re like most engineers, you’re curious about how other engineers tackle some of the most difficult challenges. What can you absorb from them and apply to your own projects? Learning from experience has tremendous value but learning from others’ experiences is arguably more valuable since the cost to acquire that knowledge is significantly cheaper. At OneSpin, we’ve lowered... » read more

When Is Verification Done?
By Ann Mutschler - 25 Feb, 2021 - Comments: 0

Even with the billions of dollars spent on R&D for EDA tools, and tens of billions more on verification labor, only 30% to 50% of ASIC designs are first time right, according to Wilson Research Group and Siemens EDA. Even then, these designs still have bugs. They’re just not catastrophic enough to cause a re-spin. This means more efficient verification is needed. Until then, verificati... » read more

Big Challenges In Verifying Cyber-Physical Systems
By Ed Sperling - 25 Feb, 2021 - Comments: 0

Semiconductor Engineering sat down to discuss cyber-physical systems and how to verify them with Jean-Marie Brunet, senior director for the Emulation Division at Siemens EDA; Frank Schirrmeister, senior group director for solution marketing at Cadence; Maurizio Griva, R&D Manager at Reply; and Laurent Maillet-Contoz, system and architect specialist at STMicroelectronics. This discussion was... » read more

Customizing An Existing RISC-V Processor
By Roddy Urquhart - 25 Feb, 2021 - Comments: 0

In a previous post, we considered how you could create an optimized ISA for a domain-specific processor core by profiling software and experimenting with adding/removing instructions. Using the open RISC-V ISA can be a great starting point for a processor that combines application-specific capabilities and access to portable software. The old-fashioned way to modify the instruction set wo... » read more

Surviving The Three Phases Of High Density Advanced Packaging Design
By Siemens EDA - 24 Feb, 2021 - Comments: 0

The growth of High Density Advanced Packages (HDAP) such as FOWLP, CoWoS, and WoW is triggering a convergence of the traditional IC design and IC package-design worlds. To handle these various substrate scenarios, process transformation must occur. This paper discusses the three phases of HDAP design and provides tips on how to survive their challenges. To read more, click here. » read more

Part Average Tests For Auto ICs Not Good Enough
By Anne Meixner - 24 Feb, 2021 - Comments: 0

Part Average Testing (PAT) has long been used in automotive. For some semiconductor technologies it remains viable, while for others it is no longer good enough. Automakers are bracing for chips developed at advanced process nodes with much trepidation. Tight control of their supply chains and a reliance upon mature electronic processes so far have enabled them to increase electronic compone... » read more

Distributed Development Of IP And SoC In Compliance With Automotive ISO 26262
By Synopsys - 24 Feb, 2021 - Comments: 0

Automotive functional safety System-on-Chips (SoCs) for Advanced Driver Assistance Systems (ADAS) contain several complex Intellectual Property (IP) cores. The IP cores are developed as a Safety Element out of Context (SEooC), meaning the context of the end application is not fully known at delivery time. In addition, IP development might be distributed across the globe. To reduce the risk of f... » read more

5G NR Design For eMBB
By Cadence - 24 Feb, 2021 - Comments: 0

This white paper examines the design challenges for eMBB products and provides examples of how these challenges can be overcome using the co-design capabilities in Cadence AWR Design Environment software. Click here to download with registration. » read more

OVP Guide To Using Processor Models
By Imperas - 24 Feb, 2021 - Comments: 0

The OVP simulation technology from Open Virtual Platforms (OVP) and Imperas Software Limited enables very high performance simulation, debug and analysis of virtual platforms containing multiple processor and peripheral models. The OVP technology is extensible, provides the ability to create new models of processors and other platform components by writing C/C++ code that uses application progr... » read more

Blog Review: Feb. 24
By Jesse Allen - 24 Feb, 2021 - Comments: 0

Siemens EDA's Harry Foster checks out the efficiency and effectiveness of verification on ASIC and IC designs with a look at how many projects meet the original schedule, the number of required spins, and classification of functional bugs. Cadence's Paul McLellan listens in as Philippe Magarshack of ST Microelectronics on how the company uses massive amounts of data generated by its fabs to ... » read more

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