Tessent LogicBIST With Observation Scan Technology


Meeting the ISO 26262 requirements for high quality and long-term reliability mans implementing on-chip safety mechanisms with high defect coverage of IC logic. This paper describes Observation Scan Technology, a new new logic built-in-self-test (BIST) technology that improves logic BIST test quality and reduces in-system test time. Empirical results demonstrate 90% test coverage with up to 10X... » read more

Security In The ARM Ecosystem


Building security in an SoC aiming to meet the goals set by the ARM Platform Security Architecture (PSA) is a complex matter. This is compounded by the complexity of modern-day SoCs comprising multiple processors, security domains and security levels. The Rambus root of trust provides a solid foundation for the SoC security architecture ticking ‘all the boxes’ for reaching the security goal... » read more

Radix Coverage For Hardware Common Weakness Enumeration (CWE) Guide


MITRE's hardware Common Weakness Enumeration (CWE) database aggregates hardware weaknesses that are the root causes of vulnerabilities in deployed parts. A complete list can be found on the MITRE Hardware Design Webpage. Hardware CWEs are ideal to be used alongside internally developed security requirements databases and have been developed and submitted by both government and commercial design... » read more

Startup Funding: January 2021


Over $800M in funding went to companies developing autonomous driving technology, from self-driving-focused AI chips to full vehicles and aftermarket solutions. A couple electric vehicle manufacturers stood out this month, with investors putting large backing behind US-based Rivian and China-based Leapmotor. And with EVs come lots of batteries: funding went to a few startups trying out new batt... » read more

10 Things You Ought To Know Before You Benchmark Your Software Security Program


Benchmarking can help you get a new software security initiative off the ground or better navigate an existing one. It is different from other measurement techniques because it focuses on excellence, includes detailed comparisons, and pools confidential information among numerous organizations. To get you started in the right direction, we’ve put together some quick tips so you get the mos... » read more

Blog Review: Feb. 3


Cadence's Paul McLellan listens in on the outlook from SEMI's recent Industry Strategy Symposium, which looked at the prospects for global recovery, the application areas where growth is expected, and how segments have recently performed. Siemens EDA's Harry Foster takes a look at trends in the adoption of languages and libraries for IC and ASIC designs and finds continued interest in System... » read more

Hot Or Not? An Introduction To Electrical Thermal Co-Design


Heat transfer is not a one-way street. Traditionally, thermal analysis and management is thought of as a mechanical problem. However, modern electronic products are highly susceptible to electronic thermal issues. The electronics are often both the cause of thermal issues and the victim of overheating if temperature profiles exceed specifications. Indeed, over 50% of IC failures are related ... » read more

Better Quality RTL


How do you measure the quality of RTL? Philippe Luc, director of verification at Codasip, talks about identifying bugs, improving the overall quality of the verification, what happens when different blocks are used in a design, and how to improve efficiency in the verification process. » read more

Manufacturing Bits: Feb. 2


Capacitor-less DRAM At the recent 2020 International Electron Devices Meeting (IEDM), Imec presented a paper on a novel capacitor-less DRAM cell architecture. DRAM is used for main memory in systems, and today’s most advanced devices are based on roughly 18nm to 15nm processes. The physical limit for DRAM is somewhere around 10nm. DRAM itself is based on a one-transistor, one-capacito... » read more

Power/Performance Bits: Feb. 2


MXene antennas Researchers at Drexel University and Villanova University developed spray-on antennas made of the 2D materials MXene that is flexible and light while maintaining good signal. "This combination of communications performance with extreme thinness, flexibility and durability sets a new standard for antenna technology," said Yury Gogotsi, professor of Materials Science and Engine... » read more

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