13000 FPS Vision System-on-Chip With Mixed-Signal Compressed Sensing
By Fraunhofer IIS/EAS - 09 Feb, 2022 - Comments: 0

This paper presents a monolithic high-speed VSoC (Vision-System-on-Chip) with three software-programmable 16-bit ASIPs (application-specific instruction-set processors), a 1024-fold column-parallel data path of charge-based convolution functionality, freely configurable A/D conversion, 8-bit processor elements with 128 bytes of RAM each, and asynchronously compressing output of sparse column da... » read more

Materials For The Electrification Of The Powertrain
By Ansys - 09 Feb, 2022 - Comments: 0

The challenge for those looking to electrify powertrains in automotive and aerospace applications is essential to solve at both strategic and technical levels. Engineers are on the front line of an electrification revolution that must take place, and materials are evolving quickly to enable this revolution. Finding materials with the right thermal, structural, and electromagnetic properties for... » read more

Reservoir Computing based on Mutually Injected Phase Modulated Semiconductor Lasers as a Monolithic Integrated Hardware Accelerator
By Technical Paper Link - 08 Feb, 2022 - Comments: 0

Abstract: "In this paper we propose and numerically study a neuromorphic computing scheme that applies delay-based reservoir computing in a laser system consisting of two mutually coupled phase modulated lasers. The scheme can be monolithic integrated in a straightforward manner and alleviates the need for external optical injection, as the data can be directly applied on the on-chip phase m... » read more

Smart DFT Infrastructure And Automation Are Key To Managing Design Scaling
By Siemens EDA - 08 Feb, 2022 - Comments: 0

This paper describes how using a smarter DFT infrastructure and automation can greatly improve the DFT schedule. A structural DFT infrastructure based on plug-and-play principles is used to enable concurrent DFT development and integration. DFT automation is used to connect and manage the DFT infrastructure to dramatically reduce the risks associated with design scaling and complexity. Highe... » read more

Unknowns Driving Up The Cost Of Auto IC Reliability
By Ed Sperling - 08 Feb, 2022 - Comments: 2

Automotive chipmakers are considering a variety of options to improve the reliability of ICs used for everything from sensors to artificial intelligence. But collectively they could boost the number of process steps, increase the time spent in manufacturing and packaging, and stir up concerns about the amount of data that needs to be collected, shared, and stored. Accounting for advanced pro... » read more

What Causes Semiconductor Aging?
By Bryon Moyer - 08 Feb, 2022 - Comments: 7

Semiconductor technology has evolved to the point where no one can assume chips will last forever. If not carefully considered, aging can shorten the life of an IC below the needs for an intended application. Aging is well studied in technology circles, but while others less directly involved may understand at a general level this is a problem, it's not always obvious why. So what exactly ar... » read more

Critical Moves: Advanced Logic Devices And CIS Benefit From Applications Using IRCD Metrology
By Nick Keller - 08 Feb, 2022 - Comments: 1

As 3D NAND continues to scale vertically — all in the name of increasing capacity and speed and reducing inefficiency and cost — maintaining channel hole critical dimension (CD) and shape uniformity becomes even more challenging. Faced with rising high-aspect ratios, addressing these challenges requires new inline non-destructive metrology to provide real-time process control. Infrared crit... » read more

Simplify DFT For Advanced SoCs
By Ron Press - 08 Feb, 2022 - Comments: 0

The purpose of electronic design automation (EDA) software is to solve SoC design problems and simplify the entire process. For design for test (DFT), this means aiming to streamline the DFT development for today’s large and complex designs. The technologies and methods developed through partnerships between EDA suppliers, foundries, and semiconductor companies should effectively reduce risk,... » read more

More Manufacturing Issues, More Testing
By Ed Sperling - 08 Feb, 2022 - Comments: 0

Douglas Lefever, CEO of Advantest America, sat down with Semiconductor Engineering to talk about changes in test, the impact of advanced packaging, and business changes that are happening across the flow. What follows are excerpts of that discussion. SE: What are the big changes ahead in test? Lefever: It's less about inflection points and more like moving from algebra to calculus in the ... » read more

Evolution Of Data Center Networking Technology — IP And Beyond
By Synopsys - 08 Feb, 2022 - Comments: 0

Ethernet is ubiquitous—it is the core technology that defines the Internet and serves to connect the world in ways that people could not imagine even one generation ago. HPC clusters are working on solving the most challenging problems facing humanity—and cloud computing is the service hosting many of the application workloads struggling with these questions. While alternative network infra... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2026 SMG   |  Terms of Service  |  Privacy Policy