Embedded Security Using Cryptography
By Sriram Sharma Kalluri - 09 Aug, 2021 - Comments: 0

In the previous blog post, “Securing Offload Engines for a Robust Secure SoC System,” we briefly looked at some of the methods employed for achieving embedded security, i.e., cryptography, hardware partitioning and isolation, and hardware root of trust. In this blog, and subsequent blogs, we will explore more about each of these approaches in detail. Cryptography is not a new concept. It... » read more

In-Line Airborne Particle Sensing Supports Faster Response To Contamination Excursions
By CyberOptics - 09 Aug, 2021 - Comments: 0

Fine particles (less than 5 micrometers in diameter) do not affect most industrial processes, but they can have a disastrous impact on semiconductor manufacturing. From the earliest days, manufacturing facilities have deployed air filtering and recirculation to remove particles from the cleanroom, but particles may still be generated inside process tools, where they can cause defects and yield ... » read more

Power/Performance Bits: Aug. 9
By Jesse Allen - 09 Aug, 2021 - Comments: 0

Capacitors in interposers Scientists at Tokyo Institute of Technology developed a 3D functional interposer containing an embedded capacitor. They tout the design as saving package area and reducing wiring length, resulting in less noise and power consumption. The capacitive elements are embedded inside a 300mm silicon piece using permanent adhesive and mold resin. The interconnects between ... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 06 Aug, 2021 - Comments: 0

Chipmakers Taiwan’s Foxconn continues to expand its efforts in the semiconductor business. Foxconn has acquired a 6-inch wafer fab and the equipment from Taiwan’s Macronix for NT$2.52 billion (US$90.76 million). With the fab, Foxconn plans to enter the wideband gap semiconductor market, namely silicon carbide (SiC). SiC devices are used in electric vehicles, a market that Foxconn is making... » read more

Week In Review: Design, Low Power
By Jesse Allen - 06 Aug, 2021 - Comments: 0

Marvell will acquire Innovium, a provider of Ethernet data center switches, in an all-stock transaction valued at $1.1 billion. Innovium's switching architecture is optimized for ultra-low latency, optimized power, high performance, and telemetry in cloud applications and will join Marvell's portfolio of data center products to provide "architectural choice and flexibility to meet a diverse set... » read more

Week In Review: Auto, Security, Pervasive Computing
By SE Staff - 06 Aug, 2021 - Comments: 0

Automotive The New York Auto Show has been canceled due to concerns over the COVID-19 Delta variant. The show, which usually occurs in April, was scheduled for August 20 through 29th. Semiconductor company Qualcomm has offered to acquire Veoneer, an ADAS company, for $37 per share in cash. Automotive Tier 1 Magna International already has a definitive merger agreement to acquire Veoneer, wh... » read more

Hardware-Enabled Security: Container Platform Security Prototype
By Technical Paper Link - 05 Aug, 2021 - Comments: 0

Date Published: June 2021, NIST Author(s) Michael Bartock (NIST), Murugiah Souppaya (NIST), Jerry Wheeler (Intel), Tim Knoll (Intel), Uttam Shetty (Intel), Ryan Savino (Intel), Joseprabu Inbaraj (AMI), Stefano Righi (AMI), Karen Scarfone (Scarfone Cybersecurity) Abstract In today’s cloud data centers and edge computing, attack surfaces have significantly increased, hacking ha... » read more

Intelligent Agents for the Optimization of Atomic Layer Deposition
By Technical Paper Link - 05 Aug, 2021 - Comments: 0

"Atomic layer deposition (ALD) is a highly controllable thin film synthesis approach with applications in computing, energy, and separations. The flexibility of ALD means that it can access a massive chemical catalogue; however, this chemical and process diversity results in significant challenges in determining processing parameters that result in stable and uniform film growth with minimal pr... » read more

Extremely Large Exposure Field w/Fine Resolution Lithography Tech To Enable Next-Gen Panel Level Advanced Packaging
By Technical Paper Link - 05 Aug, 2021 - Comments: 0

Abstract—"The growing demand for heterogeneous integration is driven by the 5G market that includes smartphones, data centers, servers, HPC, AI and IoT applications. Next-generation packaging technologies require tighter overlay to accommodate a larger package size with finer pitch chip interconnects on large format flexible panels. Heterogeneous integration enables next-generation device per... » read more

Building A More Secure SoC
By Gajinder Panesar - 05 Aug, 2021 - Comments: 1

SoC integrators know that a software-only chip security plan leaves devices open to attack. All that a hacker needs to do is find a way to replace key parts of the bootloader or the low-level firmware to compromise other software in the system used to support secure access. The most simple attacks come remotely over a network, and these can be patched with software upgrades. However, we see ... » read more

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