Week In Review: Auto, Security, Pervasive Computing
By SE Staff - 15 Jan, 2021 - Comments: 0

Automotive/Mobility Tesla has to recall 158,000 2012-2018 Model S and 2016-2018 Model X vehicles because of an eMMC NAND flash memory chip. The chip can cause the touchscreen to stop working when the memory reaches its limit of writes. According to a story in Reuters, the United States NHTSA (National Highway Traffic Safety Administration) is insisting on the recall because many of Tesla contr... » read more

Week In Review: Design, Low Power
By Jesse Allen - 15 Jan, 2021 - Comments: 0

Qualcomm will acquire data center chip startup Nuvia for approximately $1.4 billion. Nuvia is working on a data center SoC and Arm-based CPU core it claims will lower performance per total cost of ownership by matching high performance with high efficiency and limiting maximum power to that which can be dissipated in an air-cooled environment. Qualcomm said Nuvia's technology would be incorpora... » read more

Learning properties of ordered and disordered materials from multi-fidelity data
By Technical Paper Link - 14 Jan, 2021 - Comments: 0

Source: Chen, C., Zuo, Y., Ye, W. et al. Learning properties of ordered and disordered materials from multi-fidelity data. Nat Comput Sci 1, 46–53 (2021). https://doi.org/10.1038/s43588-020-00002-x Abstract: "Predicting the properties of a material from the arrangement of its atoms is a fundamental goal in materials science. While machine learning has emerged in recent years as a n... » read more

Achieving Physical Reliability Of Electronics With Digital Design
By John Parry - 14 Jan, 2021 - Comments: 0

By John Parry and G.A. (Wendy) Luiten With today’s powerful computational resources, digital design is increasingly used earlier in the design cycle to predict zero-hour nominal performance and to assess reliability. The methodology presented in this article uses a combination of simulation and testing to assess design performance, providing more reliability and increased productivity. ... » read more

Die-To-Die Stress Becomes A Major Issue
By Ann Mutschler - 14 Jan, 2021 - Comments: 2

Stress is becoming more critical to identify and plan for at advanced nodes and in advanced packages, where a simple mismatch can impact performance, power, and the reliability of a device throughout its projected lifetime. In the past, the chip, package, and board in a system generally were designed separately and connected through interfaces from the die to the package, and from the packag... » read more

More Data, More Memory-Scaling Problems
By Bryon Moyer - 14 Jan, 2021 - Comments: 0

Memories of all types are facing pressures as demands grow for greater capacity, lower cost, faster speeds, and lower power to handle the onslaught of new data being generated daily. Whether it's well-established memory types or novel approaches, continued work is required to keep scaling moving forward as our need for memory grows at an accelerating pace. “Data is the new economy of this ... » read more

Verification’s Inflection Point
By Brian Bailey - 14 Jan, 2021 - Comments: 0

Functional verification is nearing an inflection point, brought on by rising complexity and the many tentacles that are intermixing it with other disciplines. New abstractions or different ways to approach the problems are needed. Being a verification engineer is no longer enough, except for those whose concerns is block-level verification. Most of the time and effort spent in verification i... » read more

Five Key Changes Coming With DDR5 DIMMs
By John Eble - 14 Jan, 2021 - Comments: 0

On July 14th of last year, JEDEC announced the publication of the DDR5 SDRAM standard. This signaled the nearing industry transition to DDR5 server dual-inline memory modules (DIMM). DDR5 memory brings a number of key enhancements that will bring great performance and power benefits in next generation servers. Scaling Data Rates to 6.4 Gb/s You can never have enough memory bandwidth, and DD... » read more

Is Computing Facing An Energy Crisis?
By Rob Aitken - 14 Jan, 2021 - Comments: 1

Is the end near? If the topic is energy efficiency gains in computing, the answer depends on whom you ask. The steady increase in performance per watt over the decades has been one of the most important drivers in our industry. Last year I was thumbing through a neighbor’s 1967 Motorola IC catalog that featured such space age wonders as a small control chip of the sort that went into th... » read more

112G SerDes Modeling And Integration Considerations
By Priyank Shukla - 14 Jan, 2021 - Comments: 0

The ever-increasing demand for compute power and data processing in accelerators, intelligence processing units (IPUs), GPUs, as well as training and inference SoCs is driving the adoption of 112G SerDes PHY IP solutions. Ensuring a reliable Ethernet link and efficient integration are the most essential requirements that designers need to meet. IBIS-AMI modeling can help predict SerDes link per... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2026 SMG   |  Terms of Service  |  Privacy Policy